Radio frequency interconnection device
An interconnection system is described including a first printed circuit board, the first printed circuit board including a first portion of a filter, the filter used to communicate a signal between the first printed circuit board and a second printed circuit board, and a mechanical structure for coupling the signal between the first printed circuit board and the second printed circuit board, the second printed circuit board being oriented at an angle with respect to the first printed circuit board.
1. An interconnection system, comprising;
a first printed circuit board;
a second printed circuit board, wherein the first printed circuit board comprises a first portion of a bandpass filter, wherein the bandpass filter is configured to communicate a signal between the first printed circuit board and the second printed circuit board; and
a metal clip formed of curved strips configured to couple the signal between the first printed circuit board and the second printed circuit board, the second printed circuit board being oriented at an angle with respect to the first printed circuit board.
2. The interconnection system according to claim 1 , wherein said angle is a right angle.
3. The interconnection system according to claim 1 , wherein said bandpass filter is a symmetric radio frequency wideband bandpass filter.
4. The interconnection system according to claim 1 , wherein said metal clip provides a coupling using two electrical interface connections.
5. The interconnection system according to claim 4 , wherein one of said two electrical interface connections is for said signal.
6. The interconnection system according to claim 1 , wherein said angle is an acute angle.
7. The interconnection system according to claim 1 ,
wherein said first printed circuit board comprises a first transmission line connected to a first I/O port, and
wherein said first transmission line is terminated in an intermediate terminating pad, said intermediate terminating pad being spaced apart from a first grounding pad.
8. The interconnection system according to claim 7 , wherein said first transmission line is one of a micro-strip line, a coplanar line, a strip-line or a multilayer line and wherein said second transmission line is one of a micro-strip line, a coplanar line, a strip-line or a multilayer line and wherein said first grounding pad and said intermediate terminating pad are printed on an outer surface of said first circuit board.
9. The interconnection system according to claim 7 , wherein a distance between said intermediate terminating pad and said first grounding pad is between 100 and 200 μm.
10. The interconnection system according to claim 7 ,
wherein said second printed circuit board comprises a third transmission line that is connected to a second grounding pad, said second grounding pad located directly above said first grounding pad, said third transmission line also connected to an output line at an intersection point,
wherein said third transmission line is a micro-strip line.
11. The interconnection system according to claim 7 , wherein said first transmission line is about one half-wavelength long.
12. The interconnection system according to claim 7 , wherein said first transmission line is straight.
13. The interconnection system according to claim 7 , wherein said first transmission line is meandering.
14. An electronic device, comprising:
at least two printed circuit boards, the at least two printed circuit boards comprising a first printed circuit board and a second printed circuit board, the first printed circuit board comprising a first portion of a bandpass filter, wherein the bandpass filter is configured to communicate a signal between the first printed circuit board and the second printed circuit board, the second printed circuit board being oriented at an angle with respect to the first printed circuit board; and
a metal clip formed of curved strips, the metal clip being configured to couple the signal between the first printed circuit board and the second printed circuit board.
15. The electronic device according to claim 14 , wherein said bandpass filter is a symmetric radio frequency wideband bandpass filter.
16. The electronic device according to claim 14 , wherein said metal clip provides a coupling using two electrical interface connections.
17. The electronic device according to claim 16 , wherein one of said two electrical interface connections is for said signal.
18. The electronic device according to claim 14 , wherein said angle is an acute angle.
19. The electronic device according to claim 14 , wherein said angle is a right angle.
20. The electronic device according to claim 14 ,
wherein said first printed circuit board comprises a first transmission line connected to a first I/O port, and
wherein said first transmission line is terminated in an intermediate terminating pad, said intermediate terminating pad being spaced apart from a first grounding pad.
21. The electronic device according to claim 20 ,
wherein said second printed circuit board comprises a third transmission line that is connected to a second grounding pad, said second grounding pad located directly above said first grounding pad, said third transmission line also connected to an output line at an intersection point,
wherein said third transmission line is a micro-strip line.
22. The electronic device according to claim 20 , wherein said first transmission line is about one half-wavelength long.
23. The electronic device according to claim 20 , wherein said first transmission line is straight.
24. The electronic device according to claim 20 , wherein said first transmission line is meandering.
25. The electronic device according to claim 20 , wherein a distance between said intermediate terminating pad and said first grounding pad is between 100 and 200 μm.
26. The electronic device according to claim 20 , wherein said first transmission line is one of a micro-strip line, a coplanar line, a strip-line or a multilayer line and wherein said second transmission line is one of a micro-strip line, a coplanar line, a strip-line or a multilayer line and wherein said first grounding pad and said intermediate terminating pad are printed on an outer surface of said first circuit board.