Light source device, projection-type display device, and method for cooling semiconductor light-emitting element

1. A light source device, comprising:

a plurality of semiconductor light-emitting elements;

a light source hank that accommodates said plurality of semiconductor light-emitting elements; and

a light source bank holder that mounts said light source bank on a first surface and includes a cooling mechanism provided on a second surface that includes a back surface of the first surface,

wherein the cooling mechanism includes:

a heat dissipating part provided at a position corresponding to said light source bank with said light source bank holder interposed therebetween;

a flow path cover that covers the second surface so as to accommodate the heat dissipating part;

an inflow terminal into which a coolant flows, the inflow terminal being provided on the flow path cover;

an outflow terminal from which the coolant flows out, the outflow terminal being provided on the flow path cover, so that a flow path by the heat dissipating part is formed between the outflow terminal and the inflow terminal; and

another flow path that is smaller in resistance than the flow path formed in the heat dissipating part, and that is formed between the inflow terminal and the heat dissipating part, and

wherein the heat dissipating part with a fin configuration is provided between the inflow terminal and the light source bank holder.

2. The light source device according to claim 1 , wherein the inflow terminal and the outflow terminal are similar in a cross-sectional area of the flow path.

3. The light source device according to claim 2 , wherein said another flow path is similar to the inflow terminal and the outflow terminal in said cross-sectional area of the flow path.

4. The light source device according to claim 2 , wherein the heat dissipating part is configured to include a plurality of parallel fins, and the first said another flow path is formed in such a way so as to straddle all respective fins.

5. The light source device according to claim 4 , wherein the heat dissipating part has a rectangular shape, and said another flow path is formed so as to connect substantially centers of opposite sides that are parallel to the plurality of said respective fins.

6. A projection type display device comprising the light source device according to claim 1 .

7. A semiconductor light-emitting element cooling method for cooling a plurality of semiconductor light-emitting elements accommodated in a light source bank, the method comprising:

mounting said light source bank on a first surface of a light source bank holder, and providing a cooling mechanism on a second surface that includes a back surface of the first surface;

as the cooling mechanism;

providing a heat dissipating part at a position corresponding to said light source bank with said light source bank holder interposed therebetween;

covering the second surface with a flow path cover so as to accommodate the heat dissipating part;

providing an inflow terminal into which a coolant flows on the flow path cover;

providing an outflow terminal from which the coolant flows out on the flow path cover, so that a flow path by the heat dissipating part is formed between the outflow terminal and the inflow terminal;

forming another flow path smaller in resistance than the flow path formed in the heat dissipating part between the inflow terminal and the heat dissipating part; and

providing the heat dissipating part with a fin configuration between the inflow terminal and the light source bank holder.

8. The light source device according to claim 1 , wherein the heat dissipating part with the fin configuration is not provided between the outflow terminal and the light source bank holder.

9. The light source device according to claim 1 , wherein a direction in which said another flow path extends and a surface of a fin in the fin configuration of the heat dissipating part are arranged perpendicular to each other.

10. The light source device according to claim 1 , wherein, in a sequential direction of stacking of the heat dissipating part, the light source bank holder, and the light source bank, the inflow terminal overlaps with the fin configuration.

11. The light source device according to claim 1 , wherein, in a sequential direction of stacking of the heat dissipating part, the light source bank holder, and the light source bank, the outflow terminal is disposed outside of an overlapping area of the fin configuration with the light source bank holder.

12. The light source device according to claim 1 , wherein, in a sequential direction of stacking of the heat dissipating part, the light source hank holder, and the light source bank, an entirety of the outflow terminal is disposed outside of an overlapping area of the fin configuration with the light source hank holder, and the inflow terminal overlaps with the fin configuration.

13. The light source device according to claim 1 , wherein the flow path cover, the inflow terminal, and the outflow terminal are provided on a same side of the second surface of the light source bank holder.

14. The light source device according to claim 1 , in a sequential direction of stacking of the heat dissipating part, the light source bank holder, and the light source bank, an entirety of the flow path cover is disposed on a side of the second surface of the light source bank holder.

15. The semiconductor light-emitting element cooling method according to claim 7 , wherein the fin configuration in the heat dissipating part is not provided between the outflow terminal and the light source bank holder.

16. The semiconductor light-emitting element cooling method according to claim 7 , wherein a direction in which said another flow path extends and a surface of a fin in the fin configuration of the heat dissipating part are arranged perpendicular to each other.

17. The semiconductor light-emitting element cooling method according to claim 7 , wherein, in a sequential direction of stacking of the heat dissipating part, the light source bank holder, and the light source bank, the inflow terminal overlaps with the fin configuration.

18. The semiconductor light-emitting element cooling method according to claim 7 , wherein, in a sequential direction of stacking of the heat dissipating part, the light source bank holder, and the light source bank, the outflow terminal is disposed outside of an overlapping area of the fin configuration with the light source bank holder.

19. The semiconductor light-emitting element cooling method according to claim 7 , wherein, in a sequential direction of stacking of the heat dissipating part, the light source bank holder, and the light source hank, an entirety of the outflow terminal is disposed outside of an overlapping area of the fin configuration with the light source bank holder, and the inflow terminal overlaps with the fin configuration.

20. The semiconductor light-emitting element cooling method according to claim 7 , wherein the flow path cover, the inflow terminal, and the outflow terminal are provided on a same side of the second surface of the light source bank holder.