Printed circuit board and sensor
A printed circuit board having conductor tracks formed on one side of a substrate. The substrate is able to be cohesively bonded at a contact face to a cover for protecting the conductor tracks. In this case, the substrate includes a step, which forms a barrier with respect to an auxiliary material for promoting the cohesive bond, in order to prevent any wetting of the conductor tracks with the auxiliary material. A sensor having a printed circuit board for use in a fuel filling level measurement system of a vehicle.
1. A printed circuit board comprising:
a cover;
a planar substrate bonded by a cohesive bond made by soldering at a contact face on a planar surface of the planar substrate to the cover;
conductor tracks formed on the surface side of the planar substrate, the conductor tracks arranged inboard of and protected by the cover;
an auxiliary material comprising flux configured to promote the cohesive bond; and
a step, configured as a positive step, arranged on the planar surface of the planar substrate that extends away from the planar surface of the planar substrate and configured to form a barrier with respect to the auxiliary material for promoting the cohesive bond to prevent any wetting of the conductor tracks with the auxiliary material,
wherein the cover does not bear on the barrier.
2. The printed circuit board as claimed in claim 1 , wherein, the step arranged on the planar substrate is arranged on an inside with respect to the contact face of the planar substrate.
3. The printed circuit board as claimed in claim 1 , wherein the step is formed in a substrate-reinforcing manner.
4. The printed circuit board as claimed in claim 1 , wherein the step comprises the contact face.
5. The printed circuit board as claimed in claim 1 , wherein the step is formed at least in one layer.
6. The printed circuit board as claimed in claim 5 , wherein the step comprises:
a first layer;
a second layer; and
a third layer that forms the barrier.
7. The printed circuit board as claimed in claim 1 , wherein the step is formed in a manner encircling the conductor tracks.
8. The printed circuit board as claimed in claim 7 , wherein the step is formed in a continuously encircling manner.
9. The printed circuit board as claimed in claim 1 , wherein the step is formed along edges of the planar substrate.
10. The printed circuit board as claimed in claim 1 , wherein the planar substrate is formed from a sintered ceramic.
11. The printed circuit board as claimed in claim 1 , configured as a sensor.
12. The printed circuit board as claimed in claim 11 , wherein the sensor is a fuel filling level measurement system.
13. The printed circuit board as claimed in claim 12 , wherein the fuel filling level measurement system is arranged in a vehicle.
14. The printed circuit board as claimed in claim 1 , wherein the step is radially inside a mounting portion of the cover.
15. A printed circuit board comprising:
a cover;
a planar substrate bonded by a cohesive bond at a contact face to the cover;
conductor tracks formed on one side of the planar substrate, the conductor tracks protected by the cover;
an auxiliary material for promoting the cohesive bond; and
a step, configured as a positive step, arranged on the planar substrate that extends away from a planar surface of the planar substrate and configured to form a barrier with respect to the auxiliary material for promoting the cohesive bond to prevent any wetting of the conductor tracks with the auxiliary material,
wherein the step contains metal.
16. The printed circuit board as claimed in claim 15 , wherein the step is formed from a silver-containing sintering paste.
17. A printed circuit board, comprising:
a cover;
a planar substrate bonded by a cohesive bond at a contact face to the cover;
conductor tracks formed on one side of the planar substrate, the conductor tracks protected by the cover;
an auxiliary material for promoting the cohesive bond;
a step, configured as a positive step, arranged on the planar substrate radially inside a mounting portion of the cover, which extends away from a planar surface of the planar substrate and configured to form a barrier with respect to the auxiliary material for promoting the cohesive bond to prevent any wetting of the conductor tracks with the auxiliary material; and
a solder seal that is at least partially radially outside the mounting portion of the cover.
18. The printed circuit board as claimed in claim 17 , wherein the solder seal is spaced apart from the barrier.
19. A printed circuit board, comprising:
a cover;
a planar substrate bonded by a cohesive bond made by soldering at a contact face on a planar surface of the planar substrate to the cover;
conductor tracks formed on the surface side of the planar substrate, the conductor tracks arranged inboard of and protected by the cover;
an auxiliary material comprising flux configured to promote the cohesive bond;
a step, configured as a positive step, arranged on the planar surface of the planar substrate that extends away from the planar surface of the planar substrate and configured to form a barrier with respect to the auxiliary material for promoting the cohesive bond to prevent any wetting of the conductor tracks with the auxiliary material; and
a perimeter conductor track arranged at an edge of the planar surface the planar substrate at which the cover is located,
wherein a portion of the cover that contacts the perimeter conductor track is convex.
20. The printed circuit board as claimed in claim 19 , wherein a material for the cohesive bond is a solder that is arranged on the substrate radially beyond a midpoint of the convex portion of the cover.