CURABLE PARTICULATE SILICONE COMPOSITION, LIGHT REFLECTING MATERIAL CONTAINING THE SAME, AND A MANUFACTURING METHOD THEREOF
A curable particulate silicone composition is provided which has hot-melt properties, excellent handling workability and curing characteristics, high light reflectance in the visible wavelength region, and excellent flexibility and toughness at a temperature of from room temperature to a high temperature of about 150° C. The composition comprises: (A) hot-melt silicone fine particles having a softening point of 30° C. or higher and having a hydrosilylation reactive group and/or a radical reactive group; (B) an inorganic filler substantially free of coarse particles having an average particle diameter of 5 μm or more (fine particles); and (C) a curing agent. When cured, the composition provides a cured product that has: a storage modulus (G′) at 25° C. of 2000 MPa or less; and a storage modulus (G′) at 150° C. of 100 MPa or less; and a spectral reflectance of 90% or more at a wavelength of 450 nm at a thickness of 100 μm.
1 . A curable particulate silicone composition comprising:
(A) hot-melt silicone fine particles having a softening point of 30° C. or higher and having a hydrosilylation reactive group and/or a radical reactive group;
(B) an inorganic filler substantially free of coarse particles having an average particle diameter of 5 μm or more; and
(C) a curing agent;
wherein when cured, the curable particulate silicone composition provides a cured product that has:
a storage modulus (G′) at 25° C. of 2000 MPa or less; and
a storage modulus (G′) at 150° C. of 100 MPa or less; and
a spectral reflectance of 90% or more at a wavelength of 450 nm at a thickness of 100 μm.
2 . The curable particulate silicone composition according to claim 1 , wherein component (B) is a filler that does not have a softening point or does not soften below the softening point of component (A).
3 . The curable particulate silicone composition according to claim 1 , wherein 90 mass % or more of component (B) is (B1) titanium oxide fine particles having an average particle diameter of 0.5 μm or less.
4 . The curable particulate silicone composition according to claim 1 , wherein component (B) consists essentially of (B1) titanium oxide fine particles having an average particle diameter of 0.5 μm or less.
5 . The curable particulate silicone composition according to claim 1 , wherein component (A) is silicone fine particles comprising (A 1 ) a resinous organopolysiloxane, (A 2 ) an organopolysiloxane crosslinked product obtained by partially crosslinking at least one organopolysiloxane, (A 3 ) a block copolymer composed of a resinous organosiloxane block and a chained organosiloxane block, or a mixture of at least two of these.
6 . The curable particulate silicone composition according to claim 1 , wherein component (A) is true-spherical silicone fine particles in which 10 mol % or more of the silicon atom-bonded organic groups in component (A) is an aryl group and the average primary particle diameter thereof is 1 to 10 μm.
7 . The curable particulate silicone composition according to claim 1 , wherein the amount of component (B) is 10 to 2000 parts by mass with regard to 100 parts by mass of component (A).
8 . The curable particulate silicone composition according to claim 1 , which provides a cured product having a spectral reflectance of 90% or more at a wavelength of 700 nm at a thickness of 100 μm.
9 . The curable particulate silicone composition according to claim 1 , wherein the curable particulate silicone composition is in the form of pellets or sheets.
10 . A cured product formed by curing the curable particulate silicone composition according to claim 1 .
11 . The cured product according to claim 10 , wherein the light reflectance (ρ 450 ) at a wavelength of 450 nm and the light reflectance (ρ 700 ) at a wavelength of 700 nm at a thickness of 100 μm are both 90% or more, and
the differences in the respective light reflectance expressed as (ρ 700 /ρ 450 )*100(%) are less than 10%.
12 . A light reflecting material comprising the cured product according to claim 10 .
13 . An optical semiconductor device comprising a cured product of the curable silicone composition according to claim 1 as a light reflecting material.
14 . The optical semiconductor device according to claim 13 , which is a chip scale package type optical semiconductor device.
15 . A method of molding a cured product, comprising:
(I) heating and melting the curable particulate silicone composition according to claim 1 to the softening point of component (A) or higher;
(II) injecting the curable silicone composition obtained in step (I) into a mold or distributing the curable silicone composition obtained in step (I) to a mold by clamping; and
(III) curing the curable silicone composition injected or distributed in step (II).
16 . The curable particulate silicone composition according to claim 2 , wherein 90 mass % or more of component (B) is (B1) titanium oxide fine particles having an average particle diameter of 0.5 μm or less.
17 . The curable particulate silicone composition according to claim 5 , wherein component (A) is true-spherical silicone fine particles in which 10 mol % or more of the silicon atom-bonded organic groups in component (A) is an aryl group and the average primary particle diameter thereof is 1 to 10 μm.