IP Library Granted Patent US 11,075,288
Granted Patent B2
US 11,075,288 · App. 16/325,981 · Granted Jul 27, 2021

Thin film transistor, manufacturing method therefor, array substrate and display panel

Inventors: Guoying Wang (Beijing, CN); Hongda Sun (Beijing, CN); Zhen Song (Beijing, CN)
Assignee: BOE TECHNOLOGY GROUP CO., LTD.
H01L29/66969H01L21/02554H01L21/02565H01L21/02614H01L29/45H01L29/7869H01L21/0272H01L21/0331H01L21/44
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,075,288
App. No.
16/325,981
Granted
Jul 27, 2021
Kind
B2
Abstract

A thin film transistor is provided and includes an active layer, a source electrode, a drain electrode, a gate electrode and a gate electrode insulating layer, the active layer includes a source electrode region, a drain electrode region and a channel region, the source electrode region and the drain electrode region include a first metal material, and the channel region includes a semiconductor material made from oxidation of the first metal material.

Claims (17)

1. A thin film transistor, comprising an active layer, a source electrode, a drain electrode, a gate electrode and a gate insulating layer,

wherein the active layer comprises a source region, a drain region and a channel region, the source region and the drain region comprise a first metal material, and the channel region comprises a semiconductor material which is obtained from oxidation of the first metal material;

the thin film transistor further comprises a source contact region and a drain contact region, and the source contact region and the drain contact region are respectively electrically connected with the source region and the drain region;

the source contact region and the drain contact region comprise a second metal material, and the gate insulating layer comprises an insulating material which is obtained from oxidation of the second metal material,

wherein the source contact region, the drain contact region and the gate insulating layer are provided in a one-piece manner and formed from the second metal material.

2. The thin film transistor according to claim 1 , wherein the source region, the drain region and the channel region are provided in a one-piece manner and formed from the first metal material.

3. The thin film transistor according to claim 1 , further comprising a passivation layer, wherein the passivation layer is on a side of the gate electrode away from the gate insulating layer, and the source electrode and the drain electrode are respectively electrically connected with the source contact region and the drain contact region through via holes passing through the passivation layer.

4. The thin film transistor according to claim 1 , wherein the second metal material comprises aluminum, titanium, tantalum, hafnium or zirconium; or the second metal material comprises an alloy material comprising aluminum, titanium, tantalum, hafnium or zirconium.

5. The thin film transistor according to claim 1 , wherein the first metal material comprises indium, zinc, tin, copper, nickel, titanium or tungsten; or the first metal material comprises an alloy material comprising indium, zinc, tin, copper, nickel, titanium or tungsten.

6. An array substrate, comprising the thin film transistor according to claim 1 .

7. A display panel, comprising the array substrate according to claim 6 .

8. A manufacturing method of a thin film transistor, comprising:

forming an active layer, a source electrode, a drain electrode, a gate electrode and a gate insulating layer, wherein forming the active layer comprises:

forming a source region, a drain region, and a channel region between the source region and the drain region, wherein the source region and the drain region comprise a first metal material, and the channel region comprises a semiconductor material which is obtained from oxidation of the first metal material; and

forming a source contact region and a drain contact region, wherein the source contact region and the drain contact region are respectively electrically connected with the source region and the drain region;

the source contact region and the drain contact region comprise a second metal material, and the gate insulating layer comprises an insulating material which is obtained from oxidation of the second metal material; and

the source contact region, the drain contact region and the gate insulating layer are provided in a one-piece manner and formed from the second metal material.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 27, 2022
From: BOE TECHNOLOGY GROUP CO., LTD.
To: BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
Reel/Frame 060826/0252 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2019
From: WANG, GUOYING; SUN, HONGDA; SONG, ZHEN
To: BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 048347/0061 →
Priority Claims (1)
CN 201710313626.1 · May 5, 2017 · national
Continuity (1)
Related Publication 20190181248A1 · Jun 13, 2019