Infrared radiating element
An infrared emitter that comprises a cladding tube made of quartz glass that surrounds a heating filament as an infrared radiation-emitting element that is connected via current feedthroughs to an electrical connector outside the cladding tube. To improve the service life and power density, the heating filament comprises a carrier plate with a surface made of an electrically insulating material, whereby the surface is covered by a printed conductor made of a material that generates heat when current flows through it.
1. An infrared emitter comprising:
a heating filament functioning as an infrared radiation-emitting element and including a carrier plate with a surface made of an electrically insulating material and a printed conductor covering the surface, the printed conductor being made of a material that generates heat when current flows through it and the carrier plate including a composite material that is formed by a matrix component and by an additional component in the form of a semiconductor material;
a cladding tube made of quartz glass that surrounds the heating filament; and
one or more current feedthroughs adapted to connect the heating filament to an electrical connector located outside the cladding tube.
2. The infrared emitter according to claim 1 , wherein the material of the printed conductor is a non-precious metal.
3. The infrared emitter according to claim 1 , wherein the material of the printed conductor contains one or more elements from the group of tungsten (W), molybdenum (Mo), silicon carbide (SiC), molybdenum disilicide (MoSi 2 ), chromium suicide (Cr 3 Si), aluminum (Al), tantalum (Ta), polysilicon (Si), copper (Cu), and high temperature-resistant steel.
4. The infrared emitter according to claim 1 , wherein the carrier plate is formed by at least two layers of material.
5. The infrared emitter according to, claim 1 , wherein the matrix component is quartz glass and has a chemical purity of at least 99.99% SiO 2 and a cristobalite content of at most 1%.
6. The infrared emitter according to claim 1 , wherein the additional component contains a semiconductor material in elemental form.
7. The infrared emitter according to claim 1 , wherein the additional component is present in a type and an amount such as to effect, in the carrier plate at a temperature of 600° C., an emissivity □ of at least 0.6 for wavelengths between 2 and 8 μm.
8. The infrared emitter according to claim 1 , wherein the carrier plate comprises a closed porosity of less than 0.5% and has a specific density of at least 2.19 g/cm 3 .
9. The infrared emitter according to claim 1 , wherein the cladding tube surrounds the heating filament with a vacuum or in a protective gas atmosphere that comprises one or more gases from the series of nitrogen, argon, xenon, krypton, or deuterium.
10. The infrared emitter according to claim 1 , wherein the printed conductor has a burnt-in thick film layer.
11. The infrared emitter according to claim 1 , further comprising a coating made of opaque highly reflective quartz glass and wherein the cladding tube has a circumference with partial areas of the circumference being covered by the coating.
12. The infrared emitter according to claim 11 , wherein the coating covers the circumference of the cladding tube over a range of angles from 180° to 330°.
13. An infrared emitter comprising:
a heating filament functioning as an infrared radiation-emitting element and including a carrier plate with a surface made of an electrically insulating material and a printed conductor covering the surface, the printed conductor being made of a material that generates heat when current flows through it;
a cladding tube made of quartz glass that surrounds the heating filament;
one or more current feedthroughs adapted to connect the heating filament to an electrical connector located outside the cladding tube; and
a coating made of opaque highly reflective quartz glass, wherein the cladding tube has a circumference with partial areas of the circumference being covered by the coating.
14. The infrared emitter according to claim 13 wherein the carrier plate is formed by at least two layers of material, comprises a composite material that is formed by a matrix component and by an additional component in the form of a semiconductor material, or comprises a closed porosity of less than 0.5% and has a specific density of at least 2.19 g/cm 3 .
15. The infrared emitter according to claim 13 , further comprising multiple printed conductors, which each can be electrically triggered individually, covering the surface of the carrier plate.
16. The infrared emitter according to claim 13 , further comprising multiple carrier plates with printed conductors arranged in the cladding tube, whereby each of the carrier plates can be electrically triggered individually.
17. An infrared emitter comprising:
a heating filament functioning as an infrared radiation-emitting element and including a carrier plate with a surface made of an electrically insulating material and a printed conductor covering the surface, the printed conductor being made of a material that generates heat when current flows through it and the carrier plate having a closed porosity of less than 0.5% and a specific density of at least 2.19 g/cm 3 ;
a cladding tube made of quartz glass that surrounds the heating filament; and
one or more current feedthroughs adapted to connect the heating filament to an electrical connector located outside the cladding tube.