IP Library Granted Patent US 11,005,156
Granted Patent B2
US 11,005,156 · App. 16/331,071 · Granted May 11, 2021

Antenna on protrusion of multi-layer ceramic-based structure

Inventor: Zhinong Ying (Lund, SE)
Assignee: SONY MOBILE COMMUNICATIONS INC.
H01Q1/2283H01Q1/243H01Q9/0457H01Q9/285H01Q13/106H01Q21/205H01Q21/28H01Q21/30
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Quick Facts
Patent No.
US 11,005,156
App. No.
16/331,071
Granted
May 11, 2021
Kind
B2
Abstract

Antenna on protrusion of multi-layer ceramic-basedstructure An antenna device ( 100 ) includes a multi-layer ceramic-basedstructure ( 110 ) with a plurality of ceramic-basedlayers. Further, the antenna device ( 100 ) includes a protrusion ( 120 ) formed by at least one of the ceramic-basedlayers extending beyond at least one other of the ceramic-basedlayers at an edge of the multi-layer ceramic-basedstructure ( 110 ). Further, the antenna device ( 100 ) includes at least one antenna ( 140 ) formed by at least one conductive layer on the protrusion ( 120 ).

Claims (32)

1. A device, comprising:

a multi-layer ceramic-based structure comprising a plurality of ceramic-based layers;

a protrusion formed by at least one of the ceramic-based layers extending beyond at least one other of the ceramic-based layers at an edge of the multi-layer ceramic-based structure; and

at least one antenna entirely formed by at least one conductive layer on the protrusion.

2. The device according to claim 1 ,

wherein the at least one antenna is formed by a first conductive layer on one side of the protrusion and a second conductive layer separated by at least one of the ceramic-based layers forming the protrusion.

3. The device according to claim 2 ,

wherein the first conductive layer and the second conductive layer are connected by a conductive via extending through the at least one ceramic-based layer forming the protrusion.

4. The device according to claim 2 ,

wherein the first conductive layer comprises an at least one antenna patch and the second conductive layer comprises at least one feeding patch configured for feeding the at least one antenna patch.

5. The device according to claim 4 ,

wherein the at least one feeding patch is configured for conductively feeding at least one of the antenna patches.

6. The device according to claim 4 ,

wherein the at least one feeding patch is configured for capacitively feeding at least one of the antenna patches.

7. The device according to claim 1 ,

wherein the at least one antenna comprises a dipole antenna.

8. The device according to claim 1 ,

wherein the at least one antenna comprises a notch antenna.

9. The device according to claim 1 , further comprising:

radio front end circuitry housed in a cavity of the multi-layer ceramic-based structure.

10. The device according to claim 1 ,

wherein the antenna is configured for transmission of radio signals having a wavelength of more than 1 mm and less than 3 cm.

11. The device according to claim 1 ,

wherein the multi-layer ceramic-based structure is a low temperature co-fired ceramic-based structure.

12. An assembly, comprising:

at least one device according to claim 1 ; and

a circuit board on which the at least one device is arranged.

13. The assembly according to claim 12 ,

wherein the at least one device is arranged with the at least one antenna located at an edge of the circuit board.

14. A communication device, comprising:

at least one device according to claim 1 ; and

at least one processor configured to process communication signals transmitted via the at least one antenna of the at least one device.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 11, 2020
From: YING, ZHINONG
To: SONY MOBILE COMMUNICATIONS INC.
Reel/Frame 052079/0503 →
Continuity (1)
Related Publication 20190198974A1 · Jun 27, 2019
Cited By (1)
US 12,383,750