IP Library Granted Patent US 10,681,810
Granted Patent B2
US 10,681,810 · App. 16/331,510 · Granted Jun 9, 2020

Electronic control device

Inventors: Mototaka Takahashi (Ota, JP); Fumihiko Kuwabara (Isesaki, JP); Hirofumi Watanabe (Isesaki, JP)
Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
H05K1/116H01R12/721H05K3/325H05K3/3452
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,681,810
App. No.
16/331,510
Granted
Jun 9, 2020
Kind
B2
Abstract

A circuit board ( 3 ) of an electronic control device has a connector fixing screw penetration hole ( 16 ) which a connector fixing screw penetrates, a resist layer ( 13 ) and a joining portion ( 23 ) which is formed at a circumference of connector fixing screw penetration hole ( 16 ) and to which the connector fixing screw can be soldered. Joining portion ( 23 ) is formed at an inner side of a resist layer opening ( 22 ) which is open at the circumference of connector fixing screw penetration hole ( 16 ). Joining portion ( 23 ) is formed so that an area of joining portion ( 23 ) located at an inner side of circuit board ( 3 ) with respect to a center (C 1 ) of connector fixing screw penetration hole ( 16 ) is larger than an area of joining portion ( 23 ) located at an outer side of circuit board ( 3 ) with respect to the center (C 1 ) of connector fixing screw penetration hole ( 16 ).

Claims (39)

1. An electronic control device comprising:

a circuit board mounting thereon electronic components; and

a connector fixed to a board edge of the circuit board and electrically connecting an electronic circuit formed on the circuit board and an external device, and

the circuit board having:

a penetration hole which a fixing member for fixing the connector to the circuit board penetrates;

a resist layer having insulating nature and covering a surface of the circuit board; and

a joining portion which is formed at a circumference of the penetration hole and to which the fixing member can be soldered, and

the resist layer having a resist layer opening which is open at the circumference of the penetration hole,

the joining portion formed at an inner side of the resist layer opening, and

the joining portion being formed so that an area of the joining portion located at an inner side of the circuit board with respect to a center of the penetration hole is larger than an area of the joining portion located at an outer side of the circuit board with respect to the center of the penetration hole.

2. The electronic control device as claimed in claim 1 , wherein:

the circuit board has an annular land at the circumference of the penetration hole,

the resist layer is formed so as to cover the land, and

the joining portion is a part, which is exposed through the resist layer opening, of the land.

3. The electronic control device as claimed in claim 1 , wherein:

a portion, which is located at the inner side of the circuit board with respect to the center of the penetration hole, of the fixing member is fixed to the joining portion by soldering.

4. The electronic control device as claimed in claim 1 , wherein:

the joining portion is formed so that a portion of the joining portion located at the inner side of the circuit board with respect to the center of the penetration hole and facing to an outer circumferential edge of the penetration hole is longer than a portion of the joining portion located at the outer side of the circuit board with respect to the center of the penetration hole and facing to the outer circumferential edge of the penetration hole.

5. The electronic control device as claimed in claim 1 , wherein:

the joining portion is formed at the inner side of the circuit board with respect to the center of the penetration hole.

6. The electronic control device as claimed in claim 1 , wherein:

the circuit board is formed into a rectangular plate shape, and has a pair of first board edges that are located on opposite sides of the circuit board and a pair of second board edges that are located on opposite sides of the circuit board, and

the joining portion is formed so that an area of the joining portion located at a middle side between the pair of first board edges with respect to the center of the penetration hole and also located at a middle side between the pair of second board edges with respect to the center of the penetration hole is larger than the other area of the joining portion.

7. The electronic control device as claimed in claim 1 , wherein:

the joining portion is formed so as to be located at an inner side of the circuit board with respect to a portion, which is positioned closest to an outer edge of the circuit board, of the outer circumference of the penetration hole.

8. The electronic control device as claimed in claim 1 , wherein:

the joining portion is formed so as to have a circular shape whose outside diameter is larger than the penetration hole and so that a center of the joining portion is offset from the center of the penetration hole toward the inner side of the circuit board.

9. The electronic control device as claimed in claim 1 , wherein:

the joining portion has a pair of first solder joining portions located at opposite sides of the penetration hole, and

each of the first solder joining portions is formed so that an area of the first solder joining portion located at the inner side of the circuit board with respect to the center of the penetration hole is larger than an area of the first solder joining portion located at the outer side of the circuit board with respect to the center of the penetration hole.

10. The electronic control device as claimed in claim 1 , wherein:

the joining portion has a pair of first solder joining portions located at opposite sides of the penetration hole and an annular solder joining portion continuously encircling an entire circumference of the penetration hole,

each of the first solder joining portions is formed so that an area of the first solder joining portion located at the inner side of the circuit board with respect to the center of the penetration hole is larger than an area of the first solder joining portion located at the outer side of the circuit board with respect to the center of the penetration hole, and

the first solder joining portions are joined to each other through the annular solder joining portion.

11. The electronic control device as claimed in claim 1 , wherein:

the joining portion has a plurality of solder joining portions arranged radially with respect to the center of the penetration hole.

12. The electronic control device as claimed in claim 1 , wherein:

the joining portion has a plurality of solder joining portions arranged radially with respect to the center of the penetration hole and an annular solder joining portion continuously encircling an entire circumference of the penetration hole, and

the solder joining portions are joined to each other through the annular solder joining portion.

Assignments (2)
CHANGE OF NAME Recorded Mar 25, 2021
From: HITACHI AUTOMOTIVE SYSTEMS, LTD.
To: HITACHI ASTEMO, LTD.
Reel/Frame 056299/0447 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 8, 2019
From: TAKAHASHI, MOTOTAKA; KUWABARA, FUMIHIKO; WATANABE, HIROFUMI
To: HITACHI AUTOMOTIVE SYSTEMS, LTD.
Reel/Frame 048537/0077 →