IP Library Granted Patent US 11,313,749
Granted Patent B2
US 11,313,749 · App. 16/333,671 · Granted Apr 26, 2022

Pressure sensor device and method for forming a pressure sensor device

Inventors: Joerg Siegert (Graz, AT); Willem Frederik Adrianus Besling (Eindhoven, NL); Coenraad Cornelis Tak (Waalre, NL); Martin Schrems (Eggersdorf, AT); Franz Schrank (Graz, AT)
Assignee: SCIOSENSE B.V.
G01L19/145G01L7/08G01L9/0072G01L9/12G01L19/04G01L19/143G01L19/147
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,313,749
App. No.
16/333,671
Granted
Apr 26, 2022
Kind
B2
Abstract

In an embodiment a pressure sensor device includes a substrate body, a pressure sensor having a membrane and a cap body having at least one opening, wherein the pressure sensor is arranged between the substrate body and the cap body in a vertical direction which is perpendicular to a main plane of extension of the substrate body, and wherein the mass of the substrate body amounts to at least 80% of the mass of the cap body and at most 120% of the mass of the cap body.

Claims (14)

1. A pressure sensor device comprising:

a substrate body;

a pressure sensor comprising a membrane; and

a cap body comprising at least one opening,

wherein the pressure sensor is arranged between the substrate body and the cap body in a vertical direction which is perpendicular to a main plane of extension of the substrate body, and

wherein a mass of the substrate body amounts to at least 80% of the mass of the cap body and at most 120% of the mass of the cap body.

2. The pressure sensor device according to claim 1 , wherein the mass of the substrate body amounts to at least 95% of the mass of the cap body and at most 105% of the mass of the cap body.

3. The pressure sensor device according to claim 1 , wherein the pressure sensor comprises a capacitive pressure sensor comprising a cavity below the membrane.

4. The pressure sensor device according to claim 1 , wherein the substrate body comprises at least one vertical, electrically conductive via and/or wherein the pressure sensor device is surface mountable.

5. The pressure sensor device according to claim 1 , wherein the pressure sensor is positioned on top of an integrated circuit.

6. The pressure sensor device according to claim 1 , wherein a top layer covers the pressure sensor on a side of the pressure sensor facing the cap body and the top layer and the cap body are connected via direct bonding.

7. The pressure sensor device according to claim 6 , wherein the top layer comprises at least one electrically conductive wall, which is arranged on top of the pressure sensor, surrounds the opening, and is in direct contact with the pressure sensor and the cap body.

8. The pressure sensor device according to claim 1 , wherein the opening in the cap body is positioned above the pressure sensor in the vertical direction and extends over a total lateral extension of the pressure sensor.

9. The pressure sensor device according to claim 1 , wherein the opening in the cap body is positioned above the pressure sensor in the vertical direction and a lateral extension of the opening is smaller than a lateral extension of the pressure sensor.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 11, 2020
From: AMS AG; AMS INTERNATIONAL AG; AMS SENSORS UK LIMITED; AMS SENSORS GERMANY GMBH
To: SCIOSENSE B.V.
Reel/Frame 052623/0215 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 16, 2019
From: SIEGERT, JOERG; BESLING, WILLEM FREDERIK ADRIANUS; TAK, COENRAAD CORNELIS; SCHREMS, MARTIN; SCHRANK, FRANZ
To: AMS INTERNATIONAL AG
Reel/Frame 050383/0402 →