Curable silicone composition, cured product thereof, and optical semiconductor device
A curable silicone composition is disclosed. The curable silicone composition comprises: (A) a linear organopolysiloxane having at least two silicon atom-bonded alkenyl groups per molecule, wherein at least 5 mole % of all silicon atom-bonded organic groups are aryl groups; (B) an organopolysiloxane containing siloxane units represented by the general formula R 1 3 SiO 1/2 where each R 1 represents an independently selected monovalent hydrocarbon group, and siloxane units represented by the general formula SiO 4/2 , wherein the amount of alkenyl groups is at least 6% by weight; (C) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; and (D) a hydrosilylation reaction catalyst. The curable silicone composition forms a cured product with little weight reduction, little change in hardness, and little crack generation after thermal aging.
1. A curable silicone composition comprising:
(A) 100 parts by weight of a linear organopolysiloxane having at least two silicon atom-bonded alkenyl groups per molecule, wherein at least 5 mole % of all silicon atom-bonded organic groups are aryl groups;
(B) 1 to 100 parts by weight of an organopolysiloxane containing siloxane units represented by the general formula R 1 3 SiO 1/2 where each R 1 represents an independently selected monovalent hydrocarbon group, and siloxane units represented by the general formula SiO 4/2 , wherein the amount of alkenyl groups is at least 10% by weight;
(C) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule, in an amount that the silicon atom-bonded hydrogen atoms in the component is 0.1 to 10 moles with regard to 1 mole of the total alkenyl groups included in components (A) and (B);
(D) a hydrosilylation reaction catalyst, in an amount that promotes curing of the composition; and
(F) an adhesion promoter, in an amount of 0.01 to 10 parts by weight with regard to 100 parts by weight of a total amount of components (A) to (C).
2. The curable silicone composition according to claim 1 , further comprising:
(E) a hydrosilylation reaction inhibitor, in an amount of 0.01 to 3 parts by weight with regard to 100 parts by weight of a total amount of components (A) to (C).
3. A cured product formed by curing the curable silicone composition according to claim 2 .
4. An optical semiconductor device, wherein an optical semiconductor element is sealed by a cured product of the curable silicone composition according to claim 2 .
5. A cured product formed by curing the curable silicone composition according to claim 1 .
6. An optical semiconductor device, wherein an optical semiconductor element is sealed by a cured product of a curable silicone composition comprising:
(A) 100 parts by weight of a linear organopolysiloxane having at least two silicon atom-bonded alkenyl groups per molecule, wherein at least 5 mole % of all silicon atom-bonded organic groups are aryl groups;
(B) 1 to 100 parts by weight of an organopolysiloxane containing siloxane units represented by the general formula R 1 3 SiO 1/2 where each R 1 represents an independently selected monovalent hydrocarbon group, and siloxane units represented by the general formula SiO 4/2 wherein the amount of alkenyl groups is at least 10% by weight;
(C) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule, in an amount that the silicon atom-bonded hydrogen atoms in the component is 0.1 to 10 moles with regard to 1 mole of the total alkenyl groups included in components (A) and (B); and
(D) a hydrosilylation reaction catalyst, in an amount that promotes curing of the composition.
7. The optical semiconductor device according to claim 6 , wherein the curable silicone composition further comprises:
(F) an adhesion promoter, in an amount of 0.01 to 10 parts by weight with regard to 100 parts by weight of a total amount of components (A) to (C).
8. The optical semiconductor device according to claim 6 , wherein the curable silicone composition further comprises:
(E) a hydrosilylation reaction inhibitor, in an amount of 0.01 to 3 parts by weight with regard to 100 parts by weight of a total amount of components (A) to (C).