IP Library Granted Patent US 10,920,026
Granted Patent B2
US 10,920,026 · App. 16/336,161 · Granted Feb 16, 2021

Polymer composition, molded part and processes for production thereof

Inventor: Zhujuan Wang (Echt, NL)
Assignee: DSM IP ASSETS B.V.
C08J5/043C08G73/1082C08J3/201C08L77/06B29C45/2708B29K2077/00B29K2309/08C08J2377/06
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Quick Facts
Patent No.
US 10,920,026
App. No.
16/336,161
Granted
Feb 16, 2021
Kind
B2
Abstract

The present invention relates to a polymer composition, consisting of (A) 30-90 wt. % of at least one thermoplastic polymer comprising at least a semi-crystalline semi-aromatic polyamide (SSPA-1) in an amount in the range of 30-90 wt. %; (B) 10-70 wt. % of at least one reinforcing agent, and (C) 0-25 wt. % of one or more other components; wherein the SSPA-1 consists of (A-1-a) 90-100 wt. % of repeat units derived from (i) an aromatic dicarboxylic acid and (ii) diamines, and (A-1-b) 0-10 wt. % of repeat units derived from other monomers; the diamines (ii) consist of 80-95 mole % of a linear aliphatic diamine, 5-20 mole % of 2-methyl-pentamethylene diamine, and 0-10 mole % of other diamines; and the SSPA-1 has a melting temperature (Tm) of at least 300° C. The invention further relates to a molded part made of the composition, a process for making the composition and a process for making the molded part.

Claims (25)

1. A reinforced thermoplastic polymer composition consisting of:

(A) a polymer comprising 30-90 wt. %, based on total weight of the polymer (A), of at least a first semi-crystalline semi-aromatic polyamide (SSPA-1) having a melting temperature (Tm) of at least 300° C.;

(B) 10-70 wt. % of at least one reinforcing agent, and

(C) 0-25 wt. % of one or more other components, wherein the SSPA-1 consists of:

(A-1-a) 90-100 mole % of repeat units derived from (i) aromatic dicarboxylic acid and (ii) diamines, and

(A-1-b) 0-10 mole % of repeat units derived from other monomers; wherein

the diamines (ii) consist of 80-95 mole % of linear aliphatic diamine, 5-20 mole % of 2-methyl-pentamethylene diamine, and 0-10 mole % of other diamines; and wherein

the mole percentages (mole %) of the linear aliphatic diamine, the 2-methyl-pentamethylene diamine and the other diamines are relative to the total molar amount of the diamines (ii);

the mole % of (A-1-a) and (A-1-b) are relative to the total molar amount of monomeric repeat units (A-1-a) and (A1-b) in the SSPA-1;

the weight percentages (wt. %) of the components (A), (B) and (C) are relative to the total weight of the composition, with the sum of the components (A), (B) and (C) being 100 wt. %.

2. The polymer composition according to claim 1 , wherein the SSPA-1 has a melting temperature in the range of 310-350° C.

3. The polymer composition according to claim 2 , wherein the aromatic dicarboxylic acid is terephthalic acid.

4. The polymer composition according to claim 1 , wherein the aromatic dicarboxylic acid is selected from the group consisting of terephthalic acid, 2,6′-naphthalene dicarboxylic acid, 4,4′-biphenyl dicarboxylic acid and combinations thereof.

5. The polymer composition according to claim 1 , wherein the diamines (ii) consist of 5-15 mole % of 2-methyl-pentamethylene diamine, 85-95 mole % of a linear aliphatic diamine, and 0-5 mole % of other diamines.

6. The polymer composition according to claim 1 , wherein the linear diamines comprise 40-95 mole % of a C2-C8 diamine, relative to the total molar amount of the linear diamines (ii).

7. The polymer composition according to claim 1 , wherein the component (B) comprises inorganic fibers and/or inorganic fillers.

8. The polymer composition according to claim 1 , wherein the component (B) comprises glass fibers and/or carbon fibers.

9. The polymer composition according to claim 1 , wherein the component (B) is present in an amount in the range of 30-50 wt. %, relative to the total weight of the composition.

10. The polymer composition according to claim 1 , wherein the linear diamines comprise 60-95 mole % of a C2-C6 diamine, relative to the total molar amount of the linear diamines (ii).

11. A process for preparing a polymer composition according to claim 1 , comprising melt-mixing the components (A), (B) and (C).

12. A molded part comprising an element made of the polymer composition according to claim 1 .

13. The molded part according to claim 12 , wherein the molded part is an automotive part or a part of an electronic device.

14. The molded part according to claim 12 , wherein the element is made in a mold with a multi-gate cavity.

15. A process for making a molded part which comprises injection molding the polymer composition according to claim 1 into a mold.

16. The process according to claim 15 , wherein the mold comprises a multi-gate cavity.

Assignments (2)
NUNC PRO TUNC ASSIGNMENT Recorded May 27, 2025
From: DSM IP ASSETS B.V.
To: ENVALIOR B.V.
Reel/Frame 071393/0045 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 25, 2019
From: WANG, ZHUJUAN
To: DSM IP ASSETS B.V.
Reel/Frame 048684/0206 →
Priority Claims (1)
EP 16191041 · Sep 28, 2016 · regional
Continuity (1)
Related Publication 20190225760A1 · Jul 25, 2019