IP Library Granted Patent US 10,990,235
Granted Patent B2
US 10,990,235 · App. 16/336,523 · Granted Apr 27, 2021

Flexible sensor

Inventor: Matthew Gospel (Scorton, GB)
Assignee: Peratech Holdco Ltd
G06F3/045G06F2203/04102G06F2203/04103
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Quick Facts
Patent No.
US 10,990,235
App. No.
16/336,523
Granted
Apr 27, 2021
Kind
B2
Abstract

A flexible sensor ( 201 ) comprises a first conductive layer ( 202 ) and a second conductive layer ( 203 ). The first conductive layer and the second conductive layer define a sensing region ( 205 ) for determining an interaction, such as a mechanical interaction. The first conductive layer comprises a first substrate ( 206 ) having a plurality of conductive rows ( 207 ) printed thereon and the second conductive layer comprises a second substrate 208 having a plurality of columns ( 209 ) printed thereon. The first conductive layer and the second conductive layer are constrained by a constraining means ( 505 ) which holds the two layers together but permits movement of the layers perpendicular to each other in the sensing region.

Claims (33)

1. A flexible sensor, comprising:

a first conductive layer; and

a second conductive layer; wherein:

said first conductive layer and said second conductive layer define a sensing region for determining a mechanical interaction;

said first conductive layer comprises a first substrate having a plurality of conductive rows printed thereon;

said second conductive layer comprises a second substrate having a plurality of conductive columns printed thereon;

said first conductive layer and said second conductive layer are loosely constrained by a constraining means along an edge of said flexible sensor so as to maintain said first conductive layer and said second conductive layer together; and

said constraining means is located outside said sensing region to permit independent movement of said first conductive layer and said second conductive layer perpendicular to each other in said sensing region.

2. The flexible sensor of claim 1 , wherein said first conductive layer and said second conductive layer are constrained by said constraining means in a first direction and a second direction parallel to said first conductive layer and said second conductive layer respectively.

3. The flexible sensor of claim 1 , wherein at least one of said first substrate or said second substrate comprises a substance that exhibits a variable resistivity and said variable resistivity is dependent upon pressure applied to said second conductive layer.

4. The flexible sensor of claim 3 , wherein said substance is a quantum tunnelling composite.

5. The flexible sensor of claim 1 , wherein each conductive row of said plurality of conductive rows comprises at least one of silver-loaded ink or carbon loaded ink.

6. The flexible sensor of claim 1 , wherein each conductive column of said plurality of conductive columns comprises at least one of silver-loaded ink or carbon loaded ink.

7. The flexible sensor of claim 1 , wherein said constraining means comprises a plurality of slots on one of said first conductive layer and said second conductive layer, and a plurality of corresponding pins on the other of said first conductive layer and said second conductive layer.

8. The flexible sensor of claim 1 , wherein said first conductive layer and said second conductive layer are suspended in a free floating configuration within an enclosure.

9. The flexible sensor of claim 8 , wherein said enclosure is attached to an electronic device.

10. The flexible sensor of claim 9 , wherein said electronic device is a display.

11. The flexible sensor of claim 9 , wherein said electronic device is substantially curved.

12. A method of manufacturing a flexible sensor, comprising the steps of:

providing a first conductive layer and a second conductive layer, said first conductive layer and said second conductive layer defining a sensing region for determining a mechanical interaction, said first conductive layer comprising a first substrate and said second conductive layer comprising a second substrate;

printing a plurality of conductive rows on said first substrate;

printing a plurality of conductive columns on said second substrate;

loosely constraining said first conductive layer and said second conductive layer by a constraining means along an edge of said flexible sensor to maintain said first conductive layer and said second conductive layer together; and

locating said constraining means outside said sensing region to permit independent movement of said first conductive layer and said second conductive layer perpendicular to each other in said sensing region.

13. The method of claim 12 , further comprising the step of:

suspending said first conductive layer and said second conductive layer in a free floating configuration within an enclosure.

14. The method of claim 13 , further comprising the step of:

attaching said enclosure to an electronic device.

15. The method of claim 12 , wherein said step of constraining includes the step of:

constraining said first conductive layer and said second conductive layer by said constraining means in a first direction and a second direction parallel to said first conductive layer and said second conductive layer respectively.

16. The method of claim 12 , further comprising the step of:

printing a substance that exhibits a variable resistivity onto said first substrate.

17. The method of claim 16 , wherein said substance is a quantum tunnelling ink.

Assignments (4)
LIEN Recorded Oct 28, 2024
From: PERATECH IP LTD.; PERATECH HOLDCO LTD.
To: DARK MATTER LEND CO LTD.
Reel/Frame 069272/0745 →
LICENSE Recorded Oct 28, 2024
From: PERATECH IP LTD.
To: PERATECH HOLDCO LTD.
Reel/Frame 069444/0115 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 5, 2024
From: PERATECH HOLDCO LTD.
To: PERATECH IP LTD
Reel/Frame 068840/0351 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 26, 2019
From: GOSPEL, MATTHEW
To: PERATECH HOLDCO LIMITED
Reel/Frame 048697/0093 →
Priority Claims (1)
GB 1616751 · Oct 1, 2016 · national
Continuity (1)
Related Publication 20200133418A1 · Apr 30, 2020