Vibration-resistant circuit arrangement for electrically connecting two terminal regions

1. A circuit arrangement comprising:

a heat sink; and

a set of layers arranged on a surface of the heat sink;

wherein the set of layers includes a first electrically insulating insulation layer and an electrically conductive conductor layer arranged on a side of the first electrically insulating insulation layer facing away from the heat sink;

wherein the set of layers includes an electrical connecting path between two electrical connection regions;

a switchable electronic component arranged on the surface of the heat sink, the switchable electronic component electrically interconnected with one of the two electrical connection regions; and

wherein at least one layer of the set of layers is formed by cold gas spraying of a respective material; and

between the switchable electronic component and the set of layers, the surface of the heat sink defines two material cutouts and a bridge element formed by a part of the heat sink arranged between the two material cutouts.

2. The circuit arrangement as claimed in claim 1 , wherein the set of layers includes:

a first magnetic layer composed of a magnetic material and arranged between the surface of the heat sink and the first electrically insulating insulation layer to set an electrical inductance value of the connecting path;

a second insulation layer arranged on a side of the electrically conductive conductor layer facing away from the first electrically insulating insulation layer; and

a second magnetic layer composed of a magnetic material;

wherein the conductor layer is arranged between the first magnetic layer and the second magnetic layer.

3. The circuit arrangement as claimed in claim 2 , wherein the second magnetic layer is connected to the first magnetic layer along a profile of the electrical connecting path on both sides of the electrical connecting path.

4. The circuit arrangement as claimed in claim 2 , wherein the set of layers includes a further insulation layer arranged between the heat sink and the first magnetic layer.

5. The circuit arrangement as claimed in claim 2 , wherein the magnetic material of the first magnetic layer and/or of the second magnetic layer is porous.

6. The circuit arrangement as claimed in claim 2 , wherein the second insulation layer is connected to the first electrically insulating insulation layer along a profile of the electrical connecting path on both sides of the electrical connecting path.

7. The circuit arrangement as claimed in claim 1 , wherein the electrical connecting path comprises a flat coil or a helix.

8. The circuit arrangement as claimed in claim 1 , wherein the circuit arrangement comprises a DC voltage converter or an inverter.

9. The circuit arrangement as claimed in claim 1 , further comprising a cooling structure in or on the heat sink in order to guide a cooling medium.

10. The circuit arrangement as claimed in claim 2 , wherein the first magnetic layer and the second magnetic layer are electrically insulated from one another by at least one of the first electrically insulating insulation layer or the second insulating layer.

11. A motor vehicle comprising:

an electrical voltage source;

a high-current load with an operating current greater than 10 A;

a heat sink; and

a set of layers arranged on a surface of the heat sink;

wherein the set of layers includes a first electrically insulating insulation layer and an electrically conductive conductor layer arranged on a side of the first electrically insulating insulation layer facing away from the heat sink;

wherein the set of layers includes an electrical connecting path between two electrical connection regions;

a switchable electronic component arranged on the surface of the heat sink, the switchable electronic component electrically interconnected with one of the two electrical connection regions; and

wherein at least one layer of the set of layers is formed by cold gas spraying of a respective material;

wherein the voltage source and the high-current load are each connected to a respective one of the two electrical connection regions; and

between the switchable electronic component and the set of layers, the surface of the heat sink defines two material cutouts and a bridge element formed by a part of the heat sink arranged between the two material cutouts.

12. A method for producing a circuit arrangement, the method comprising:

producing a set of layers composed of an insulation layer made of an electrically insulating material and a conductor layer made of an electrically conductive material arranged on a side of the insulation layer facing away from a heat sink on a surface of the heat sink by means of cold gas spraying;

providing an electrical connecting path between two connection regions of the circuit arrangements;

arranging a switchable electronic component on the surface of the heat sink;

connecting the switchable electronic component with one of the two electrical connection regions;

connecting an electrical voltage source and a high-current load to a respective one of the two electrical connection regions, the high-current load having an operating current greater than 10 A; and

between the switchable electronic component and the set of layers, the surface of the heat sink defines two material cutouts and a bridge element formed by a part of the heat sink arranged between the two material cutouts.