Pixel circuit, manufacturing method thereof, and display device
A pixel circuit includes a substrate, and a first thin film transistor and a second transistor which are disposed on the substrate. The first thin film transistor is in a top-gate structure, and the second thin film transistor is in a bottom-gate structure; a first electrode of the first thin film transistor is electrically connected with a gate electrode of the second thin film transistor, and the first electrode of the first thin film transistor and the gate electrode of the second thin film transistor are in a same layer on the substrate. The pixel circuit can have a relatively high switch speed and a relatively large driving current, a manufacturing method is easily realized and a process cost is relatively low.
1. A pixel circuit, comprising:
a substrate, and
a first thin film transistor and a second transistor, disposed on the substrate,
wherein the first thin film transistor is in a top-gate structure, and the second thin film transistor is in a bottom-gate structure;
a first electrode of the first thin film transistor is electrically connected with a gate electrode of the second thin film transistor, and the first electrode of the first thin film transistor and the gate electrode of the second thin film transistor are in a same layer on the substrate and are both on a side of an active layer of the second thin film transistor close to the substrate;
an active layer of the first thin film transistor and the active layer of the second thin film transistor are in a same layer and made of a same material;
the active layer of the first thin film transistor comprises a first region, a second region and a channel region between the first region and the second region;
the first region of the active layer of the first thin film transistor is electrically connected with the first electrode of the first thin film transistor through a via hole, and the first region is filled in the via hole.
2. The pixel circuit according to claim 1 , further comprising a capacitor disposed on the substrate, the capacitor comprising a first electrode, a second electrode and a dielectric layer between the first electrode and the second electrode,
wherein the first electrode of the capacitor is electrically connected with the first electrode of the first thin film transistor and the gate electrode of the second thin film transistor, and
the first electrode of the capacitor, the first electrode of the first thin film transistor and the gate electrode of the second thin film transistor are in a same layer on the substrate.
3. The pixel circuit according to claim 2 , wherein
a gate electrode and a second electrode of the first thin film transistor, a first electrode and a second electrode of the second thin film transistor and the second electrode of the capacitor are in a same layer and made of a same material, and
the first electrode of the second thin film transistor is electrically connected with the second electrode of the capacitor.
4. The pixel circuit according to claim 3 , wherein
the first thin film transistor further comprises a buffer layer between the first electrode and a the active layer of the first thin film transistor, and
the buffer layer, a gate insulating layer of the second thin film transistor and the dielectric layer of the capacitor are in a same layer and are all on a side of the active layer of the first thin film transistor close to the substrate.
5. The pixel circuit according to claim 3 , further comprising a pixel electrode, wherein the pixel electrode is electrically connected with the first electrode of the second thin film transistor and the second electrode of the capacitor.
6. The pixel circuit according to claim 3 , further comprising a pixel electrode, wherein the pixel electrode is electrically connected with the second electrode of the second thin film transistor.
7. The pixel circuit according to claim 1 , wherein the second thin film transistor further comprises an etch stop layer, and the etch stop layer is in a same layer as a gate insulating layer of the first thin film transistor.
8. The pixel circuit according to claim 1 , wherein the first region and the second region of the active layer of the first thin film transistor are conductors.
9. A display device, comprising the pixel circuit according to claim 1 .
10. The pixel circuit according to claim 2 , wherein the second electrode of the capacitor and the first electrode of the second thin film transistor are in an integral structure.
11. The pixel circuit according to claim 3 , wherein a gate insulating layer of the second thin film transistor and the dielectric layer of the capacitor are in a same layer and made of a same material.
12. The pixel circuit according to claim 1 , wherein the first electrode and the second electrode of the first thin film transistor are respectively on opposite sides of the active layer of the first thin film transistor with respect to the substrate.
13. A manufacturing method of a pixel circuit, comprising:
providing a substrate, and
forming a first thin film transistor and a second thin film transistor on the substrate,
wherein the first thin film transistor is in a top-gate structure, and the second thin film transistor is in a bottom-gate structure;
a first electrode of the first thin film transistor and a gate electrode of the second thin film transistor are formed to be electrically connected with each other and disposed in a same layer, by forming a first metal layer on the substrate and patterning the first metal layer,
an active layer of the first thin film transistor and the active layer of the second thin film transistor are in a same layer and made of a same material;
the active layer of the first thin film transistor comprises a first region, a second region and a channel region between the first region and the second region;
the first region of the active layer of the first thin film transistor is electrically connected with the first electrode of the first thin film transistor through a via hole, and the first region is filled in the via hole.
14. The manufacturing method according to claim 13 , wherein a capacitor, the first thin film a transistor and the second thin film transistor are formed simultaneously;
a first electrode of the capacitor is further formed by patterning the first metal layer, and the first electrode is electrically connected with the first electrode of the first thin film transistor and the gate electrode of the second thin film transistor.
15. The manufacturing method according to claim 13 , wherein the forming the first thin film transistor and the second thin film transistor on the substrate comprises:
forming a first insulating layer on the first metal layer and patterning the first insulating layer to expose at least a portion of the first electrode of the first thin film transistor,
forming a semiconductor layer on the first insulating layer and patterning the semiconductor layer to form the active layer of the first thin film transistor and the active layer of the second thin film transistor, wherein the active layer of the first thin film transistor contacts the exposed portion of the first electrode of the first thin film transistor through the via hole,
forming a second insulating layer on the semiconductor layer and patterning the second insulating layer to form a gate insulating layer on the active layer of the first thin film transistor and an etch stop layer on the active layer of the second thin film transistor, and
forming a second metal layer on the second insulating layer and patterning the second insulating layer to form a second electrode and a gate electrode of the first thin film transistor, and a first electrode and a second electrode of the second thin film transistor.
16. The manufacturing method according to claim 15 , wherein the forming the first thin film transistor and the second thin film transistor on the substrate further comprises:
after forming the semiconductor layer and before forming the second insulating layer, performing a conduction treatment on a portion, which is not covered by the gate insulating layer, of the active layer of the first thin film transistor, and on a portion, which is not covered by the etch stop layer, of the active layer of the second thin film transistor.
17. The manufacturing method according to claim 16 , wherein the conduction treatment comprises:
performing ion implantation on the active layer of the first thin film transistor and the active layer of the second thin film transistor using the gate insulating layer of the first thin film transistor and the etch stop layer as a mask.
18. The manufacturing method according to claim 15 , further comprising:
forming a passivation layer on the second metal layer,
patterning the passivation layer to expose at least a portion of the first electrode of the second thin film transistor, and
forming a conductive layer on the passivation layer, the conductive layer in contact with the portion, which is exposed, of the first electrode of the second thin film transistor.
19. The manufacturing method according to claim 15 , further comprising:
forming a passivation layer on the second metal layer,
patterning the passivation layer to expose at least a portion of the second electrode of the second thin film transistor, and
forming a conductive layer on the passivation layer, the conductive layer in contact with the portion, which is exposed, of the second electrode of the second thin film transistor.