Avalanche photodiode
An avalanche photodiode includes a first-conductivity-type semiconductor layer; a first second-conductivity-type semiconductor layer; a second second-conductivity-type semiconductor layer; a third second-conductivity-type semiconductor layer; a fourth second-conductivity-type semiconductor layer; a fifth second-conductivity-type semiconductor layer. The first-conductivity-type semiconductor layer and the second second-conductivity-type semiconductor layer form an avalanche junction. The first and third second-conductivity-type semiconductor layers are electrically connected together via the fourth second-conductivity-type semiconductor layer such that the semiconductor substrate and the first-conductivity-type semiconductor layer are electrically isolated from each other.
1. An avalanche photodiode comprising:
a first-conductivity-type semiconductor layer formed within a first-conductivity-type semiconductor substrate;
a first second-conductivity-type semiconductor layer formed within the semiconductor substrate so as to surround, in plan view for the semiconductor substrate, with a gap width, the first-conductivity-type semiconductor layer;
a second second-conductivity-type semiconductor layer formed, within the semiconductor substrate, deeper than the first-conductivity-type semiconductor layer and in contact with at least a portion of a bottom portion of the first-conductivity-type semiconductor layer;
a third second-conductivity-type semiconductor layer formed, within the semiconductor substrate, deeper than the second second-conductivity-type semiconductor layer and in contact with a bottom portion of the second second-conductivity-type semiconductor layer;
a fourth second-conductivity-type semiconductor layer formed between the first second-conductivity-type semiconductor layer and the third second-conductivity-type semiconductor layer so as to be in contact with at least a portion of a bottom portion of the first second-conductivity-type semiconductor layer;
an oxide film formed so as to isolate, from each other, the first-conductivity-type semiconductor layer and the first second-conductivity-type semiconductor layer; and
a fifth second-conductivity-type semiconductor layer formed in an upper portion of the first second-conductivity-type semiconductor layer and having a higher impurity concentration than the first second-conductivity-type semiconductor layer,
wherein the first-conductivity-type semiconductor layer and the second second-conductivity-type semiconductor layer form an avalanche junction,
the first second-conductivity-type semiconductor layer and the third second-conductivity-type semiconductor layer are electrically connected together via the fourth second-conductivity-type semiconductor layer such that the semiconductor substrate and the first-conductivity-type semiconductor layer are electrically isolated from each other, and
the fourth second-conductivity-type semiconductor layer extends toward, beyond the oxide film, the first-conductivity-type semiconductor layer.
2. The avalanche photodiode according to claim 1 ,
wherein the second second-conductivity-type semiconductor layer is smaller than, in plan view for the semiconductor substrate, the bottom portion of the first-conductivity-type semiconductor layer.
3. An avalanche photodiode comprising:
a first-conductivity-type semiconductor layer formed within a first-conductivity-type semiconductor substrate;
a first second-conductivity-type semiconductor layer formed within the semiconductor substrate so as to surround, in plan view for the semiconductor substrate, with a gap width, the first-conductivity-type semiconductor layer;
a second second-conductivity-type semiconductor layer formed, within the semiconductor substrate, deeper than the first-conductivity-type semiconductor layer and in contact with at least a portion of a bottom portion of the first-conductivity-type semiconductor layer;
a third second-conductivity-type semiconductor layer formed, within the semiconductor substrate, deeper than the second second-conductivity-type semiconductor layer and in contact with a bottom portion of the second second-conductivity-type semiconductor layer;
a fourth second-conductivity-type semiconductor layer formed between the first second-conductivity-type semiconductor layer and the third second-conductivity-type semiconductor layer so as to be in contact with at least a portion of a bottom portion of the first second-conductivity-type semiconductor layer; and
a virtual guard ring formed between the first-conductivity-type semiconductor layer and the first second-conductivity-type semiconductor layer and having a lower concentration than the third second-conductivity-type semiconductor layer,
wherein the first-conductivity-type semiconductor layer and the second second-conductivity-type semiconductor layer form an avalanche junction,
the first second-conductivity-type semiconductor layer and the third second-conductivity-type semiconductor layer are connected together such that the semiconductor substrate and the first-conductivity-type semiconductor layer are electrically isolated from each other,
the second second-conductivity-type semiconductor layer is smaller than, in plan view for the semiconductor substrate, the bottom portion of the first-conductivity-type semiconductor layer, and
the fourth second-conductivity-type semiconductor layer electrically connects together the first second-conductivity-type semiconductor layer and the third second-conductivity-type semiconductor layer.
4. The avalanche photodiode according to claim 3 ,
wherein the fourth second-conductivity-type semiconductor layer has a higher concentration than a portion of the first second-conductivity-type semiconductor layer, the portion of the first second-conductivity-type semiconductor layer being in contact with the fourth second-conductivity-type semiconductor layer, and than a portion of the third second-conductivity-type semiconductor layer, the portion of the third second-conductivity-type semiconductor layer being in contact with the fourth second-conductivity-type semiconductor layer.
5. The avalanche photodiode according to claim 3 , comprising:
an oxide film formed so as to isolate, from each other, the first-conductivity-type semiconductor layer and the first second-conductivity-type semiconductor layer;
wherein the fourth second-conductivity-type semiconductor layer extends toward, beyond the oxide film, the first-conductivity-type semiconductor layer.
6. An avalanche photodiode comprising:
a first-conductivity-type semiconductor layer formed within a first-conductivity-type semiconductor substrate;
a first second-conductivity-type semiconductor layer formed within the semiconductor substrate so as to surround, in plan view for the semiconductor substrate, with a gap width, the first-conductivity-type semiconductor layer;
a second second-conductivity-type semiconductor layer formed, within the semiconductor substrate, deeper than the first-conductivity-type semiconductor layer and in contact with at least a portion of a bottom portion of the first-conductivity-type semiconductor layer;
a third second-conductivity-type semiconductor layer formed, within the semiconductor substrate, deeper than the second second-conductivity-type semiconductor layer and in contact with a bottom portion of the second second-conductivity-type semiconductor layer; and
a fourth second-conductivity-type semiconductor layer formed between the first second-conductivity-type semiconductor layer and the third second-conductivity-type semiconductor layer so as to be in contact with at least a portion of a bottom portion of the first second-conductivity-type semiconductor layer, and having a higher concentration than a portion of the first second-conductivity-type semiconductor layer, the portion of the first second-conductivity-type semiconductor layer being in contact with the fourth second-conductivity-type semiconductor layer, and than a portion of the third second-conductivity-type semiconductor layer, the portion of the third second-conductivity-type semiconductor layer being in contact with the fourth second-conductivity-type semiconductor layer; and
a fifth second-conductivity-type semiconductor layer formed in an upper portion of the first second-conductivity-type semiconductor layer and having a higher impurity concentration than the first second-conductivity-type semiconductor layer,
wherein the first-conductivity-type semiconductor layer and the second second-conductivity-type semiconductor layer form an avalanche junction,
the first second-conductivity-type semiconductor layer and the third second-conductivity-type semiconductor layer are connected together such that the semiconductor substrate and the first-conductivity-type semiconductor layer are electrically isolated from each other, and
the fourth second-conductivity-type semiconductor layer electrically connects together the first second-conductivity-type semiconductor layer and the third second-conductivity-type semiconductor layer.