Intra-cardiac echocardiography interposer
An imaging catheter assembly is provided. The imaging catheter assembly includes an interposer including a multi-layered substrate structure, wherein the multi-layered substrate structure includes a first plurality of conductive contact pads coupled to a second plurality of conductive contact pads via a plurality of conductive lines; an imaging component coupled to the interposer via the first plurality of conductive contact pads; and an electrical cable coupled to the interposer via the second plurality of conductive contact pads and in communication with the imaging component.
1. An imaging catheter assembly, comprising:
an interposer including a proximal end, a distal end, and a multi-layered substrate structure, wherein the multi-layered substrate structure includes a first plurality of conductive contact pads coupled to a second plurality of conductive contact pads via a plurality of conductive lines;
an imaging component coupled to the interposer via the first plurality of conductive contact pads, wherein the imaging component includes an ultrasound transducer array including a proximal end and a distal end, wherein the distal end of the interposer is proximal to the proximal end of the ultrasound transducer array; and
an electrical cable coupled to the interposer via the second plurality of conductive contact pads and in communication with the imaging component,
wherein the imaging component includes an integrated circuit (IC) layer positioned between an acoustic layer and a backing layer,
wherein the backing layer is longer than the IC layer such that a portion of the backing layer extends beyond the IC layer, and
wherein the interposer is positioned on the portion of the backing layer that extends beyond the IC layer.
2. The imaging catheter assembly of claim 1 , wherein the interposer includes:
a top conductive layer including the first plurality of conductive contact pads and the second plurality of conductive contact pads;
a base substrate material layer; and
at least one intermediate conductive layer positioned between the top conductive layer and the base substrate material layer, wherein the plurality of conductive lines extend through the at least one intermediate conductive layer.
3. The imaging catheter assembly of claim 2 , wherein the base substrate material layer includes at least one of ceramic, glass, quartz, alumina, sapphire, or silicon.
4. The imaging catheter assembly of claim 2 , wherein the top conductive layer further includes:
a third plurality of conductive contact pads coupled to the plurality of conductive lines; and
a surface-mount component mounted on the third plurality of conductive contact pads.
5. The imaging catheter assembly of claim 4 , wherein the surface-mount component is a power-regulating component.
6. The imaging catheter assembly of claim 1 , wherein the interposer has a width less than 4 millimeter.
7. The imaging catheter assembly of claim 1 , wherein the interposer has a length less than 15 millimeter.
8. The imaging catheter assembly of claim 1 , wherein the imaging component is wire-bonded to the interposer via the first plurality of conductive contact pads.
9. The imaging catheter assembly of claim 8 , wherein the electrical cable is soldered to the interposer via the second plurality of conductive contact pads.
10. The imaging catheter assembly of claim 1 , wherein the imaging component includes an integrated circuit (IC) layer positioned between an acoustic layer and a backing layer.
11. The imaging catheter assembly of claim 10 , wherein the imaging component is a planar component, and wherein the interposer is positioned coplanar or parallel to a plane of the imaging component.
12. The imaging catheter assembly of claim 1 , wherein the plurality of conductive lines includes at least one of a power line, a control line, or a signal line.
13. The imaging catheter assembly of claim 1 , further comprising a flexible elongate member including a distal portion and a proximal portion, wherein the imaging component and the interposer are coupled to the distal portion of the flexible elongate member.
14. An imaging catheter assembly, comprising:
an interposer including a proximal end, a distal end, and a multi-layered substrate structure, wherein the multi-layered substrate structure includes a first plurality of conductive contact pads coupled to a second plurality of conductive contact pads via a plurality of conductive lines;
an imaging component coupled to the interposer via the first plurality of conductive contact pads, wherein the imaging component includes an ultrasound transducer array including a proximal end and a distal end, wherein the distal end of the interposer is proximal to the proximal end of the ultrasound transducer array; and
an electrical cable coupled to the interposer via the second plurality of conductive contact pads and in communication with the imaging component,
wherein the imaging component includes a backing layer including a proximal portion and a distal portion, and
wherein the ultrasound transducer array is positioned over the distal portion of the backing layer and the interposer is positioned over the proximal portion of the backing layer.
15. The imaging catheter assembly of claim 14 , wherein the interposer includes:
a top conductive layer including the first plurality of conductive contact pads and the second plurality of conductive contact pads;
a base substrate material layer; and
at least one intermediate conductive layer positioned between the top conductive layer and the base substrate material layer, wherein the plurality of conductive lines extend through the at least one intermediate conductive layer.
16. The imaging catheter assembly of claim 15 , wherein the base substrate material layer includes at least one of ceramic, glass, quartz, alumina, sapphire, or silicon.
17. The imaging catheter assembly of claim 15 , wherein the top conductive layer further includes:
a third plurality of conductive contact pads coupled to the plurality of conductive lines; and
a surface-mount component mounted on the third plurality of conductive contact pads.
18. The imaging catheter assembly of claim 17 , wherein the surface-mount component is a power-regulating component.
19. The imaging catheter assembly of claim 14 , wherein the interposer has a width less than 4 millimeter.
20. The imaging catheter assembly of claim 14 , wherein the interposer has a length less than 15 millimeter.
21. The imaging catheter assembly of claim 14 , wherein the imaging component is wire-bonded to the interposer via the first plurality of conductive contact pads.
22. The imaging catheter assembly of claim 21 , wherein the electrical cable is soldered to the interposer via the second plurality of conductive contact pads.
23. The imaging catheter assembly of claim 14 , wherein the imaging component includes an integrated circuit (IC) layer positioned between an acoustic layer and the backing layer.
24. The imaging catheter assembly of claim 23 , wherein the imaging component is a planar component, and wherein the interposer is positioned coplanar or parallel to a plane of the imaging component.
25. The imaging catheter assembly of claim 14 , wherein the plurality of conductive lines includes at least one of a power line, a control line, or a signal line.
26. The imaging catheter assembly of claim 14 , further comprising a flexible elongate member including a distal portion and a proximal portion, wherein the imaging component and the interposer are coupled to the distal portion of the flexible elongate member.