IP Library Patent Application 16340043
Patent Application
App. No. 16/340,043

COATING COMPOSITIONS INCLUDING DIAMOND AND EITHER CATIONIC CURABLE RESIN SYSTEM OR THIOL-ENE CURABLE SYSTEMS

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Patent No.
US None
App. No.
16/340,043
Abstract

Disclosed are cationic cure resin systems and thiol-ene cure systems, which include abrasion resistant material such as diamond material. The systems are coated onto substrates. Floor coverings comprising the coated substrates are also disclosed.

Claims (48)

1 . A cationic cured resin system, comprising:

A. at least one resin;

B. at least one polyol;

C. a photoinitiation system;

D. at least one abrasion resistant material comprising diamond material; and optionally

E. at least one dispersing agent.

2 . The cationic cured resin system of claim 1 , wherein the at least one resin is selected from the group consisting of vinyl ether resins, epoxy resins, and combinations thereof.

3 . The cationic cured resin system of claim 2 , wherein the vinyl ether resin is selected from the group consisting of 1,4-butanediol divinyl ether; 1,3-propanediol ether; 1,6-hexanediol divinyl ether; 1,4-cyclohexanedimethylol divinyl ether; diethyleneglycol divinyl ether; triethyleneglycol divinyl ether; n-butyl vinyl ether; tert-butyl vinyl ether; cyclohexyl vinyl ether; dodecyl vinyl ether; octadecyl vinyl ether; trimethylolpropane diallyl ether; allyl pentaerythritol; trimethylolpropane monoallyl ether; and combinations thereof.

4 . The cationic cured resin system of claim 2 , wherein the epoxy resin is selected from the group consisting of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate; bis-(3,4-epoxycyclohexyl) adipate; 3-ethyl-3-hydroxy-methyl-oxetane; 1,4-butanediol diglycidyl ether; 1,6 hexanediol diglycidyl ether; ethylene glycol diglycidyl ether; polypropylene glycol diglycidyl ether; polyglycol diglycidyl ether; propoxylated glycerin triglycidyl ether; monoglycidyl ester of neodecanoic acid; epoxidized soy; epoxidized linseed oil; epoxidized polybutadiene resins; and combinations thereof.

5 . The cationic cured resin system of claim 1 , wherein the at least one resin is selected from the group consisting of 1,4-butanediol divinyl ether; 1,3-propanediol divinyl ether; 1,6-hexanediol divinyl ether; 1,4-cyclohexanedimethylol divinyl ether; diethyleneglycol divinyl ether; triethyleneglycol divinyl ether; n-butyl vinyl ether; tert-butyl vinyl ether; cyclohexyl vinyl ether; dodecyl vinyl ether; octadecyl vinyl ether; trimethylolpropane diallyl ether; allyl pentaerythritol; trimethylolpropane monoallyl ether; 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate; bis-(3,4-epoxycyclohexyl) adipate; 3-ethyl-3-hydroxy-methyl-oxetane; 1,4-butanediol diglycidyl ether; 1,6 hexanediol diglycidyl ether; ethylene glycol diglycidyl ether; polypropylene glycol diglycidyl ether; polyglycol diglycidyl ether; propoxylated glycerin triglycidyl ether; monoglycidyl ester of neodecanoic acid; epoxidized soy; epoxidized linseed oil; epoxidized polybutadiene resins; and combinations thereof.

6 . The cationic cured resin system of claim 1 , wherein the at least one polyol is selected from the group consisting of diethylene glycol; neopentyl glycol; glycerol; trimethylol propane; polyether polyols; polyester polyols; aliphatic polyester polyols derived from diacids or dials; aromatic polyester polyols derived from diacids or dials; 1,3-propanediol; 1,4-butanediol; 1,6-hexanediol; 1,4-cyclohexanedimethylol; derivatives thereof; and combinations thereof.

7 . The cationic cured resin system of claim 6 , wherein the at least one polyol is selected from the group consisting of:

A. a polyether polyol selected from the group consisting of polytetramethylene ether glycol;

B. a polyester polyol selected from the group consisting of caprolactone dial: caprolactone trial; and combinations thereof; and

C. combinations thereof.

8 . The cationic cured resin system of claim 1 , wherein the photoinitiation system comprises:

A. at least one photo initiator; and

B. optionally, at least one photosensitizer.

9 . The cationic cured resin system of claim 8 , wherein the at least one photoinitiator is a cationic photoinitiator.

10 . The cationic cured resin system of claim 9 , wherein the cationic photoinitiator is selected from the group consisting of iodonium salts; sulfonium salts; and combinations thereof.

11 . The cationic cured resin system of claim 10 , wherein the cationic photoinitiator is selected from the group consisting of:

A. an iodonium salt selected from the group consisting of bis(4-methylphenyl) hexafluorophosphate-(1)-iodonium;

B. a sulfonium salt selected from the group consisting of triarylsulfonium hexafluoroantimonate salts; triarylsulfonium hexafluorophosphate salts; and combinations thereof; and

C. combinations thereof.

12 . The cationic cured resin system of claim 8 , wherein the at least one photosensitizer is selected from the group consisting of isopropyl thioxanthone; 1-chloro-4-propoxythioxanthone; 2,4-diethylthioxanthone; 2-chlorothioxanthone; and combinations thereof.

13 . The cationic cured resin system of claim 1 , wherein the diamond material is selected from the group consisting of diamond particles, diamond dust, diamond shards, diamond fragments, whole diamonds, and combinations thereof.

14 . The cationic cured resin system of claim 1 , wherein the diamond material is a nanoparticle having an average diameter of from about 0.1 nm to about 1,000 nm.

15 . The cationic cured resin system of claim 1 , wherein the diamond material is a microparticle having an average diameter of from about 0.01 μm to about 100 μm.

16 . The cationic cured resin system of claim 1 , further comprising at least a second abrasion resistant material comprising at, least one selected from the group consisting of (i) a second diamond material, (ii) a non-diamond material having a Mohs hardness value of at least 6, and (iii) combinations thereof, wherein:

A. the at least one abrasion resistant material comprising diamond material is a nanoparticle having an average diameter of from about 0.1 nm to about 1,000 nm;

B. the at least one abrasion resistant material comprising diamond material is a microparticle having an average diameter of from about 0.01 μm to about 100 μm;

C. the at least one abrasion resistant material comprising diamond material is a nanoparticle having an average diameter of from about 0.1 nm to about 1,000 nm;

D. the at least one abrasion resistant material comprising diamond material is a microparticle having an average diameter of from about 0.01 μm to about 100 μm; optionally wherein the cationic cured resin system further comprises at least a third abrasion resistant material selected from the group, consisting of (i) a third diamond material, (ii) a second non-diamond material preferably having a Mohs hardness value of at least 6 and even more preferably selected from the group consisting of aluminum oxide, feldspar, a spinel, topaz, quartz and combinations thereof, wherein the third abrasion resistant material has an average diameter in the range of the at least one abrasion resistant material and/or the second abrasion resistant material.

17 . The cationic cured resin system of claim 16 , wherein:

A. the at least one abrasion resistant material comprising diamond material is a nanoparticle having an average diameter of from about 2.0 nm to about 500 nm, and the second abrasion resistant material is a microparticle having an average diameter of from about 0.5 μm to about 100 μm; or

B. the at least one abrasion resistant material comprising diamond material is a microparticle having an average diameter of from about 0.5 μm to about 100 μm, and the second abrasion resistant material is a nanoparticle having an average diameter of from about 2.0 nm to about 500 nm; or

C. the at least one abrasion resistant material comprising diamond material is a nanoparticle having an average diameter of from about 2.0 μm to about 500 nm, and the second abrasion resistant material is a nanoparticle having an average diameter of from about 2.0 nm to about 500 nm; or

D. the at least one abrasion resistant material comprising diamond material is a microparticle having an average diameter of from about 0.5 μm to about 100 μm, and the second abrasion resistant material is a microparticle having an average diameter of from about 0.5 μm to about 100 μm;

optionally, wherein the third abrasion resistant material has an average diameter in the range of the at least one abrasion resistant material and/or the second abrasion resistant material.

18 . The cationic cured resin system of claim 16 , wherein:

A. the at least one abrasion resistant material comprising diamond material is a nanoparticle having an average diameter of from about 20 nm to about 200 nm, and the second abrasion resistant material is a microparticle having an average diameter of from about 6 μm to about 30 pin; or

B. the at least one abrasion resistant material comprising diamond material is a microparticle having an average diameter of from about 6 μm to about 30 μm, and the second abrasion resistant material is a nanoparticle having an average diameter of from about 20 nm to about 200 nm; or

C. the at least one abrasion resistant material comprising diamond material is a nanoparticle having an average diameter of from about 20 nm to about 200 nm, and the second, abrasion resistant material is a nanoparticle having an average diameter of from about 20 nm to about 200 nm; or

D. the at least one abrasion resistant material comprising diamond material is a microparticle having an average diameter of from about 6 μm to about 30 μm, and the second abrasion resistant material is a microparticle having an average diameter of from about 6 μm to about 30 μm;

optionally, wherein the third abrasion resistant material has an average diameter in the range of the at least one abrasion resistant material and/or the second abrasion resistant material.

19 . The cationic cured resin system of claim 1 , wherein the composition is curable by UV light.

20 . The cationic cured resin system of claim 19 , wherein the UV light is produced by a UV LED light or a UV arc lamp.

21 - 82 . (canceled)

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Jul 26, 2022
From: PATHLIGHT CAPITAL LP
To: ARMSTRONG FLOORING, INC.; AFI LICENSING LLC
Reel/Frame 060934/0242 →
RELEASE OF SECURITY INTEREST Recorded Jul 26, 2022
From: BANK OF AMERICA, N.A.
To: ARMSTRONG FLOORING, INC.; AFI LICENSING LLC
Reel/Frame 060934/0554 →
SECURITY INTEREST Recorded Sep 9, 2020
From: AFI LICENSING LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 053731/0016 →
SECURITY INTEREST Recorded Jun 24, 2020
From: ARMSTRONG FLOORING, INC.; AFI LICENSING, LLC
To: PATHLIGHT CAPITAL, LP
Reel/Frame 053033/0726 →