Current collector, electrode plate including the same and electrochemical device
View Patent ↗The present disclosure relates to the field of battery and, in particular, relates to a current collector, an electrode plate including the current collector, and an electrochemical device. The current collector of the present disclosure includes an insulation layer and a conductive layer. The insulation layer is used to support the conductive layer. The conductive layer is used to support an electrode active material layer and is located on at least one surface of the insulation layer. The insulation layer has a density smaller than that of the conductive layer. The insulation layer has a thickness of D 1 satisfying 1 μm≤D 1 ≤10 μm. The conductive layer has a thickness of D 2 satisfying 200 nm≤D 2 ≤1.5 μm. The insulation layer has a tensile strength greater than or equal to 150 MPa.
1. A current collector, comprising: an insulation layer and a conductive layer, wherein the insulation layer is used to support the conductive layer, and the conductive layer is used to support an electrode active material layer and is located on at least one surface of the insulation layer,
the insulation layer has a density smaller than a density of the conductive layer,
the insulation layer has a thickness of D1 satisfying 1 μm≤D1≤10 μm,
the conductive layer has a thickness of D2 satisfying 200 nm≤D2≤1.5 μm,
the insulation layer has a tensile strength greater than or equal to 150 MPa,
the conductive layer has a resistivity smaller than or equal to 8.0×10 −8 Ω·m,
wherein the conductive layer comprises a conductive layer body, an upper metal protective layer located on a surface of the conductive layer body facing away from the insulation layer, and a lower metal protective layer located on a surface of the conductive layer body facing towards the insulation layer, and the upper metal protective layer and the lower metal protective layer are made of nickel, and
wherein the upper metal protective layer has a thickness of D3′ and the lower metal protective layer has a thickness of D3″, D3′ and D3″ satisfy ½ D3′≤D3″≤⅘ D3′, and 100 nm≤D3′≤200 nm.
2. The current collector according to claim 1 , wherein D1 satisfies 1 μm≤D1≤5 μm.
3. The current collector according to claim 2 , wherein the insulation layer has a thermal shrinkage at 200° C. smaller than or equal to 1.5%.
4. The current collector according to claim 2 , wherein D1 satisfies 1 μm≤D1≤3 μm.
5. The current collector according to claim 1 , wherein a bonding force between the insulation layer and the conductive layer is F, and F satisfies F≥400 N/m.
6. The current collector according to claim 1 , wherein the insulation layer has a thermal shrinkage at 200° C. smaller than or equal to 1.5%.
7. The current collector according to claim 1 , wherein D2 satisfies 200 nm≤D2≤1 μm.
8. The current collector according to claim 7 , wherein D2 satisfies 200 nm≤D2≤900 nm.
9. The current collector according to claim 7 , wherein the conductive layer is made of a material selected from a group consisting of a metal conductive material, a carbon-based conductive material and combinations thereof, the metal conductive material is at least one of aluminum, copper, nickel, titanium, silver, nickel copper alloy and aluminum zirconium alloy, and the carbon-based conductive material is at least one of graphite, acetylene black, graphene and carbon nanotube.
10. The current collector according to claim 1 , wherein
the conductive layer body is made of a material selected from a group consisting of a metal conductive material, a carbon-based conductive material, and combinations thereof, the metal conductive material is at least one of aluminum, copper, nickel, titanium, silver, nickel copper alloy, aluminum zirconium alloy, and combinations thereof, and the carbon-based conductive material is at least one of graphite, acetylene black, graphene and carbon nanotube.
11. The current collector according to claim 10 , wherein the thickness of D3′ satisfies D3′≤ 1/10 D2, or the thickness of D3″ satisfies D3″≤ 1/10 D2 and 1 nm≤D3″≤200 nm.
12. The current collector according to claim 6 , wherein the thickness of D3″ satisfies 50 nm≤D3″≤100 nm.
13. The current collector according to claim 1 , wherein the insulation layer has an elongation at break in a range from 16% to 120%.
14. The current collector according to claim 1 , wherein the insulation layer is made of an organic polymer insulation material, and the organic polymer insulation material is at least one of polyamide, polyethylene terephthalat, polyimide, polyethylene, polypropylene, polystyrene, polyvinyl chloride, acrylonitrile-butadiene-styrene copolymer, polybutylene terephthalate, poly-p-phenylene terephthamide, ethylene propylene rubber, polyformaldehyde, epoxy resin, phenol-formaldehyde resin, polytetrafluoroethylene, polyvinylidene fluoride, silicone rubber and polycarbonate.
15. An electrode plate, comprising the current collector according to claim 1 and an electrode active material layer formed on a surface of the current collector.
16. An electrochemical device, comprising a positive electrode plate, a separator and a negative electrode plate, wherein the positive electrode plate and/or the negative electrode plate is the electrode plate according to claim 15 .
17. A current collector, comprising: an insulation layer and a conductive layer, wherein the insulation layer is used to support the conductive layer, and the conductive layer is used to support an electrode active material layer and is located on at least one surface of the insulation layer,
the insulation layer has a density smaller than a density of the conductive layer,
the insulation layer has a thickness of D1 satisfying 1 μm≤D1≤10 μm,
the conductive layer has a thickness of D2 satisfying 200 nm≤D2≤1.5 μm,
the insulation layer has a tensile strength greater than or equal to 150 MPa,
the conductive layer has a resistivity smaller than or equal to 8.0×10 −8 Ω·m,
wherein the conductive layer comprises a conductive layer body, an upper metal protective layer located on a surface of the conductive layer body facing away from the insulation layer, and a lower metal protective layer located on a surface of the conductive layer body facing towards the insulation layer, and the upper metal protective layer and the lower metal protective layer are made of nickel or nickel-based alloy, and
wherein the upper metal protective layer has a thickness of D3′ and the lower metal protective layer has a thickness of D3″, D3′ and D3″ satisfy ½ D3′≤D3″≤⅘ D3′, and 100 nm≤D3′≤200 nm, and
a bonding force between the insulation layer and the conductive layer is F, and F satisfies F≥400 N/m.