Thermoplastic composition, molded part made thereof and use thereof in automotive and E and E applications

1. A thermoplastic composition comprising:

(A) a semi-aromatic copolyamide; and

(B) a reinforcing agent, wherein

the semi-aromatic copolyamide (A) is a direct solid-state polymerization (DSSP) product at a temperature of 235-255° C. of and comprises repeat units derived from monomeric components of:

(a) diamines which consist of, relative to the total molar amount of diamines:

90-100 mole % of a mixture of tetramethylene diamine and hexamethylene diamine, or

90-100 mole % of a mixture of pentamethylene diamine and hexamethylene diamine, and

0-10 mole % of one or more other diamine;

(b) dicarboxylic acids which consist of, relative to the total molar amount of dicarboxylic acids:

95-100 mole % terephthalic acid,

0-5 mole % of one or more other aromatic dicarboxylic acid, and

0-1 mole % aliphatic dicarboxylic acid; and

(c) at least one other monomeric component which includes 0-0.1 mole %, relative to the total molar amount of the monomeric components (a)-(c), of branching units; and wherein

the copolyamide has a viscosity number (VN) of at least 100 ml/g; measured by the method according to ISO 307, fourth edition, at 0.5 wt. % in sulphuric acid at 25° C.

2. The thermoplastic composition according to claim 1 , wherein the diamine comprises tetramethylene diamine and hexamethylene diamine in a molar ratio in a range of 15:85-70:30.

3. The thermoplastic composition according to claim 1 , wherein the copolyamide consists of repeat units derived from 95-100 mole % of tetramethylene diamine, hexamethylene diamine and terephthalic acid, and 0-5 mole % of one or more other monomers, relative to the total amount of tetramethylene diamine, hexamethylene diamine, terephthalic acid and other monomers.

4. The thermoplastic composition according to claim 1 , wherein the composition comprises

(A) 30-90 wt. % of the semi-aromatic copolyamide, and

(B) 10-70 wt. % of the reinforcing agent; wherein the weight percentages (wt. %) are relative to the total weight of the composition.

5. The thermoplastic composition according to claim 1 , wherein the composition comprises

(A) 30-90 wt. % of the semi-aromatic copolyamide, and

(B) 10-70 wt. % of glass fibers, or carbon fibers, or a combination thereof; wherein

the weight percentages (wt. %) are relative to the total weight of the composition.

6. The thermoplastic composition according to claim 1 , wherein the composition comprises one or more further components.

7. The thermoplastic composition according to claim 1 , wherein

the viscosity number (VN) is at least 110 ml/g, the Tensile Strength is at least 200 MPa, Elongation at Break (EaB) is at least 2.3% or any combination thereof, and wherein

the viscosity number (VN) is measured by the method according to ISO 307, fourth edition, at 0.5 wt. % in sulphuric acid at 25° C.; and

the Tensile Strength and Elongation at Break are measured by the method according to ISO 527/1 at 23° C. at a drawing speed of 5 mm/min, on test bars conforming to ISO 527 type 1A and having a thickness of 4 mm.

8. A molded plastic part made of a thermoplastic composition as defined in claim 1 .

9. The molded part according to claim 8 , wherein the molded part is a structural part for an automotive vehicle or a plastic component for an electrical assembly.

10. An automotive vehicle comprising the structural part according to claim 9 .

11. An electronic device comprising an assembly of surface mounted electronic components, wherein at least one of the surface mounted electronic components includes the molded plastic part according to claim 8 .

12. The electronic device according to claim 11 , wherein the molded plastic part has at least one section having a thickness of at least 1.6 mm.

13. A process for making an assembly of surface mounted electronic components, wherein the process comprises subjecting the plastic component as defined in claim 9 to a process step comprising lead free reflow soldering.