Low temperature curable adhesive composition and articles including the same
A one part curable adhesive composition that includes a multifunctional (meth)acrylate oligomer the homopolymer of which has a glass transition temperature (Tg) of at least 100° C., and a first (meth)acrylate monomer exhibiting a viscosity of no greater than 1000 centipoise (cP) at 25° C., the first (meth)acrylate monomer being at least one of a (meth)acrylate monomer whose homopolymer has a Tg of at least 100° C. and (alkoxy) tetrahydrofurfuryl (meth)acrylate, the curable adhesive composition exhibiting a viscosity of no greater than 100,000 cP when measured at 25° C. and a shear rate of 20 sec −1 .
1. A one part curable adhesive composition comprising:
at least 10% by weight, based on the total weight of polymerizable components, of a multifunctional (meth)acrylate oligomer the homopolymer of which has a glass transition temperature (Tg) of at least 100° C.;
at least 5% by weight, based on the total weight of polymerizable components, of a first (meth)acrylate monomer the homopolymer of which has a Tg of at least 100° C., the first (meth)acrylate monomer exhibiting a viscosity of no greater than 1000 centipoise (cP) at 25° C.; and
alkoxy tetrahydrofurfuryl (meth)acrylate,
the curable adhesive composition exhibiting a viscosity of no greater than 100,000 cP when measured at 25° C. and a shear rate of 20 sec −1 .
2. The curable adhesive composition of claim 1 further comprising a second (meth)acrylate monomer the homopolymer of which exhibits a Tg of at least 200° C., the second (meth)acrylate monomer being multifunctional and being different from the first (meth)acrylate monomer.
3. The curable adhesive composition of claim 2 , wherein the second (meth)acrylate monomer comprises at least three ethylenically unsaturated functional groups.
4. The curable adhesive composition of claim 1 , wherein the composition, when cured, exhibits a Tg of at least 150° C.
5. The curable adhesive composition of claim 1 , wherein the composition, when cured, exhibits a coefficient of thermal expansion of no greater than 75 parts per million per degree centigrade (ppm/° C.).
6. The curable adhesive composition of claim 1 comprising
at least 17% by weight, based on the total weight of polymerizable components, of the multifunctional (meth)acrylate oligomer; and
at least 10% by weight, based on the total weight of polymerizable components, of the first (meth)acrylate monomer.
7. The curable adhesive composition of claim 1 comprising
from at least 20% by weight, based on the total weight of polymerizable components, to no greater than 45% by weight, based on the total weight of polymerizable components, of the multifunctional (meth)acrylate oligomer; and
from at least 10% by weight, based on the total weight of polymerizable components, to no greater than 55% by weight, based on the total weight of polymerizable components, of the first (meth)acrylate monomer.
8. The curable adhesive composition of claim 1 , wherein the homopolymer of the multifunctional (meth)acrylate oligomer exhibits a glass transition temperature of at least 120° C.
9. The curable adhesive composition of claim 1 , wherein the homopolymer of the multifunctional (meth)acrylate oligomer exhibits a glass transition temperature of at least 140° C.
10. The curable adhesive composition of claim 1 further comprising a monoethylenically unsaturated (meth)acrylate monomer exhibiting a viscosity of no greater than 100 centipoise (cP) at 25° C.
11. The curable adhesive composition of claim 1 comprising at least 5% by weight, based on the total weight of polymerizable components, alkoxy tetrahydrofurfuryl (meth)acrylate.
12. The curable composition of claim 1 further comprising at least 30% by weight of a nonconductive filler.
13. The curable adhesive composition of claim 1 further comprising a silane adhesion promoter.
14. A one part curable adhesive composition comprising:
at least 10% by weight, based on the total weight of polymerizable components, of a multifunctional (meth)acrylate oligomer the homopolymer of which has a glass transition temperature (Tg) of at least 100° C.; and
at least 5% by weight, based on the total weight of polymerizable components, of a first (meth)acrylate monomer the homopolymer of which has a Tg of at least 100° C., the first (meth)acrylate monomer exhibiting a viscosity of no greater than 1000 centipoise (cP) at 25° C.,
the curable adhesive composition exhibiting a viscosity of no greater than 100,000 cP when measured at 25° C. and a shear rate of 20 sec −1 ,
the adhesive composition, when cured, exhibiting a Tg of at least 120° C.
15. The curable adhesive composition of claim 14 further comprising a second (meth)acrylate monomer the homopolymer of which exhibits a Tg of at least 200° C., the second (meth)acrylate monomer being multifunctional and being different from the first (meth)acrylate monomer.
16. The curable adhesive composition of claim 15 , wherein the second (meth)acrylate monomer comprises at least three ethylenically unsaturated functional groups.
17. The curable adhesive composition of claim 14 further comprising tetrahydrofurfuryl acrylate, alkoxy tetrahydrofurfuryl acrylate, or a combination thereof.
18. An electronic article comprising:
a first substrate;
an adhesive composition; and
a component adhered to the first substrate through the adhesive composition, the adhesive composition comprising a cured form of the curable adhesive composition of claim 1 .
19. The electronic article of claim 18 , wherein the first substrate comprises polycarbonate, alumina, glass, metal or a combination thereof.
20. A method of using a one part adhesive composition, the method comprising:
applying the adhesive composition of claim 1 to a component of an electronic article;
exposing the adhesive composition to visible light, electron beam radiation, ultraviolet radiation, or a combination thereof,
heating the adhesive composition; and
allowing the heated composition to cure,
the cured composition exhibiting a Tg greater than 85° C.