IP Library Patent Application 16353520
Patent Application
App. No. 16/353,520

MAGNETIC MEMORY DEVICE

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Quick Facts
Patent No.
US None
App. No.
16/353,520
Abstract

According to one embodiment, a magnetic memory device includes a first interconnect, a second interconnect provided on the upper layer side of the first interconnect, a third interconnect provided on the upper layer side of the second interconnect, a first memory cell provided between the first interconnect and the second interconnect and including a first stacked structure including a magnetic layer, a second memory cell provided between the second interconnect and the third interconnect and including a second stacked structure including a magnetic layer, and a light reflection layer provided on the upper layer side of the first interconnect and on the lower layer side of the third interconnect and having optical reflectance higher than optical transmittance.

Claims (56)

1 . A magnetic memory device comprising:

a first interconnect;

a second interconnect provided on the upper layer side of the first interconnect;

a third interconnect provided on the upper layer side of the second interconnect;

a first memory cell provided between the first interconnect and the second interconnect and including a first stacked structure including a magnetic layer;

a second memory cell provided between the second interconnect and the third interconnect and including a second stacked structure including a magnetic layer; and

a light reflection layer provided on the upper layer side of the first interconnect and on the lower layer side of the third interconnect and having optical reflectance higher than optical transmittance.

2 . The device of claim 1 , wherein

the light reflection layer is formed of aluminum oxide, aluminum or copper.

3 . The device of claim 1 , wherein

the first memory cell further includes a first switching element connected to the first stacked structure, and

the second memory cell further includes a second switching element connected to the second stacked structure.

4 . The device of claim 1 , wherein

each of the first stacked structure and the second stacked structure includes a first magnetic layer having a variable magnetization direction, a second magnetic layer having a fixed magnetization direction, and a nonmagnetic layer provided between the first magnetic layer and the second magnetic layer.

5 . A magnetic memory device comprising:

a first interconnect;

a second interconnect provided on the upper layer side of the first interconnect;

a third interconnect provided on the upper layer side of the second interconnect;

a first memory cell provided between the first interconnect and the second interconnect and including a first stacked structure including a magnetic layer;

a second memory cell provided between the second interconnect and the third interconnect and including a second stacked structure including a magnetic layer; and

a light-absorbing layer provided on the upper layer side of the second interconnect and on the lower layer side of the third interconnect and having optical absorptance higher than optical transmittance.

6 . The device of claim 5 , wherein

the light-absorbing layer is formed of silicon nitride or silicon carbide.

7 . The device of claim 5 , wherein

the first memory cell further includes a first switching element connected to the first stacked structure, and

the second memory cell further includes a second switching element connected to the second stacked structure.

8 . The device of claim 5 , wherein

each of the first stacked structure and the second stacked structure includes a first magnetic layer having a variable magnetization direction, a second magnetic layer having a fixed magnetization direction, and a nonmagnetic layer provided between the first magnetic layer and the second magnetic layer.

9 . A magnetic memory device comprising:

a first interconnect;

a second interconnect provided on the upper layer side of the first interconnect;

a third interconnect provided on the upper layer side of the second interconnect;

a first memory cell provided between the first interconnect and the second interconnect and including a first stacked structure including a magnetic layer; and

a second memory cell provided between the second interconnect and the third interconnect and including a second stacked structure including a magnetic layer, wherein

a cavity is provided on the upper layer side of the first interconnect and on the lower layer side of the third interconnect.

10 . The device of claim 9 , wherein

the first memory cell further includes a first switching element connected to the first stacked structure, and

the second memory cell further includes a second switching element connected to the second stacked structure.

11 . The device of claim 9 , wherein

each of the first stacked structure and the second stacked structure includes a first magnetic layer having a variable magnetization direction, a second magnetic layer having a fixed magnetization direction, and a nonmagnetic layer provided between the first magnetic layer and the second magnetic layer.

12 . A magnetic memory device comprising:

a first interconnect;

a second interconnect provided on the upper layer side of the first interconnect;

a third interconnect provided on the upper layer side of the second interconnect;

a first memory cell provided between the first interconnect and the second interconnect and including a first stacked structure including a magnetic layer; and

a second memory cell provided between the second interconnect and the third interconnect and including a second stacked structure including a magnetic layer, wherein

the second interconnect has lower thermal conductivity than the first interconnect.

13 . The device of claim 12 , wherein

the second interconnect include a part formed of titanium or Nichrome.

14 . The device of claim 12 , wherein

the second interconnect include a part formed of an insulating material.

15 . The device of claim 12 , wherein

the first memory cell further includes a first switching element connected to the first stacked structure, and

the second memory cell further includes a second switching element connected to the second stacked structure.

16 . The device of claim 12 , wherein

each of the first stacked structure and the second stacked structure includes a first magnetic layer having a variable magnetization direction, a second magnetic layer having a fixed magnetization direction, and a nonmagnetic layer provided between the first magnetic layer and the second magnetic layer.

Assignments (2)
CHANGE OF NAME Recorded Feb 15, 2022
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 059110/0850 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 3, 2019
From: KUMURA, YOSHINORI
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 049344/0540 →