Electronic device including antenna module
View Patent ↗In a metal housing, an opening is provided in a first surface. A second substrate is disposed inside the metal housing and has a communication circuit and a ground unit provided thereon. An antenna module includes an antenna pattern provided on an upper step surface of a base and a ground pattern provided on a lower step surface. In the antenna module, the antenna pattern is exposed through the opening, and the ground pattern opposes a back side of the first surface. The ground pattern is electrically connected to the back side of the first surface and electrically connected to the ground unit via a coaxial cable. The ground unit is electrically connected to the metal housing.
1. An electronic device, comprising:
a metal housing including one surface with an opening provided therein;
a substrate disposed inside the metal housing, the substrate having a communication circuit and a ground unit provided thereon; and
an antenna module including
a base having an upper step surface and & lower step surface arrayed m a non-overlapping manner,
an antenna pattern provided on the upper step surface, and
a ground pattern provided on the lower, step surface,
in the antenna module, the antenna pattern on the upper step surface being exposed through the opening in the one surface of the metal housing, the ground pattern on the lower step surface opposing a back side of the one surface of the metal housing,
the ground pattern on the lower step surface being electrically connected to the back side of the one surface of the metal housing and electrically connected to the ground unit on the substrate via a cable,
the ground unit on the substrate being electrically connected to the metal housing.
2. The electronic device according to claim 1 , wherein the ground pattern is provided continuously from the lower step surface to a portion of the upper step surface.
3. The electronic device according to claim 1 , wherein the antenna pattern is termed through any one of vapor deposition, plating, and sheet metal working.
4. The electronic device according to claim 1 , wherein the ground pattern is formed through any one of vapor deposition, plating, and sheet metal working.
5. The electronic device according to claim 1 , further comprising:
a conductive cushion affixed on the ground pattern on the lower step surface of the antenna module.
6. The electronic device according to claim 1 , wherein
the communication circuit on the substrate is provided on a surface closer to the antenna module, and
the ground unit on the substrate is provided on a surface opposite to the surface where the communication circuit is provided.