IP Library Granted Patent US 11,209,608
Granted Patent B2
US 11,209,608 · App. 16/354,666 · Granted Dec 28, 2021

Optical module

Inventors: Xuxia Liu (Shandong, CN); Yan Zhong (Shandong, CN)
Assignee: Hisense Broadband Multimedia Technologies Co., Ltd.
G02B7/102G02B7/023H05K1/0274
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,209,608
App. No.
16/354,666
Granted
Dec 28, 2021
Kind
B2
Abstract

An optical module includes a circuit board, a lens assembly, a first lens array and a second lens array. The circuit board includes a first driving chip, a first photoelectric chip, a second photoelectric chip and a second driving chip. The lens assembly houses the first photoelectric chip and the second photoelectric chip and includes an upper surface having a first groove and a second groove. The first lens array and the second lens array are on a side surface of the second groove. A bottom surface of the first groove includes a reflecting surface. The first photoelectric chip and the second photoelectric chip are configured such that light coming from or to the first photoelectric chip, or from or to second photoelectric chip, is reflected by the reflecting surface and passes through the first lens array or the second lens array.

Claims (37)

1. An optical module, comprising:

a circuit board comprising a first driving chip, a first photoelectric chip, a second photoelectric chip and a second driving chip in order along a first direction;

a lens assembly housing the first photoelectric chip and the second photoelectric chip, the lens assembly comprising an upper surface having a first groove and a second groove; and

a first lens array and a second lens array arranged in a top-down direction on a side surface of the second groove,

wherein

a bottom surface of the first groove comprises a reflecting surface,

a lower surface of the lens assembly comprises a third groove and a fourth groove, and a depth of the fourth groove is different from a depth of the third groove,

the optical module further comprises a third lens array and a fourth lens array, a portion of lenses in the third lens array and the fourth lens array are positioned on a bottom surface of the fourth groove, and a remaining portion of the lenses in the third lens array and the fourth lens array are positioned on a bottom surface of the third groove,

the first photoelectric chip is configured such that light coming from or to the first photoelectric chip passes through the third lens array, is reflected by the reflecting surface and passes through the first lens array, and

the second photoelectric chip is configured such that light coming from or to the second photoelectric chip passes through the fourth lens array, is reflected by the reflecting surface and passes through the second lens array.

2. The optical module according to claim 1 , further comprising an optical fiber bracket in the second groove, wherein

the optical fiber bracket comprises optical fiber arrays along the top-down direction,

the first lens array corresponds to a first optical fiber array of the optical fiber arrays, and

the second lens array corresponds to a second optical fiber array of the optical fiber arrays.

3. The optical module according to claim 2 , wherein both sides of the first lens array have positioning mechanisms, and the positioning mechanisms are configured to be inserted into corresponding positioning holes in the optical fiber bracket.

4. The optical module according to claim 2 , wherein both sides of the second lens array have positioning mechanisms, and the positioning mechanisms are configured to be inserted into corresponding positioning holes in the optical fiber bracket.

5. The optical module according to claim 2 , further comprising guiding pins, wherein

both sides of the first lens array comprise first fixing holes,

both ends of a side surface of the optical fiber bracket comprise second fixing holes corresponding to the first fixing holes, and

both ends of each of the guiding pins are inserted into one of the first fixing holes and a corresponding one of the second fixing holes to fix the optical fiber bracket in the second groove.

6. The optical module according to claim 2 , further comprising guiding pins, wherein

both sides of the second lens array comprise first fixing holes,

both ends of a side surface of the optical fiber bracket comprise second fixing holes corresponding to the first fixing holes, and

both ends of each of the guiding pins are inserted into one of the first fixing holes and a corresponding one of the second fixing holes to fix the optical fiber bracket in the second groove.

7. The optical module according to claim 1 , wherein

the third lens array is over the first photoelectric chip, and the fourth lens array is over the second photoelectric chip.

8. The optical module according to claim 7 , wherein

the circuit board comprises a third driving chip, a third photoelectric chip, a fourth photoelectric chip and a fourth driving chip in order along a second direction parallel to the first direction,

the lens assembly houses the third photoelectric chip and the fourth photoelectric chip,

the third groove is over the third photoelectric chip and the fourth photoelectric chip, and

the fourth groove is over the first photoelectric chip and the second photoelectric chip.

9. The optical module according to claim 1 , wherein an inclination angle of the reflecting surface is in a range of 40° to 50°.

10. The optical module according to claim 1 , wherein

the first lens array comprises at least eight convex lenses, and

the second lens array comprises at least eight convex lenses.

11. The optical module according to claim 10 , further comprising a first housing and a second housing, wherein

the circuit board, the first driving chip, the first photoelectric chip, the second photoelectric chip, the second driving chip and the lens assembly are packaged in a chamber enclosed by the first housing and the second housing.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2026
From: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
To: LIGENT (SINGAPORE) PTE. LTD.
Reel/Frame 074944/0753 →
CORRECTIVE ASSIGNMENT TO CORRECT THE CITY OF THE ASSIGNEE PREVIOUSLY RECORDED AT REEL: 048614 FRAME: 0805. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Nov 14, 2021
From: LIU, XUXIA; ZHONG, YAN
To: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
Reel/Frame 058121/0545 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 15, 2019
From: LIU, XUXIA; ZHONG, YAN
To: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
Reel/Frame 048614/0805 →
Priority Claims (1)
CN 201810321976.7 · Apr 11, 2018 · national
Continuity (2)
Continuation PCTCN2019078335 · Mar 15, 2019
Related Publication 20190317297A1 · Oct 17, 2019