IP Library Granted Patent US 12,053,303
Granted Patent B2
US 12,053,303 · App. 16/358,123 · Granted Aug 6, 2024

Manufacturing method for a multielectrode system

Inventors: Markus Jung (Hanau, DE); Oliver Keitel (Aschaffenburg, DE)
Assignee: Heraeus Deutschland GmbH & Co. KG
A61B5/6851A61B5/287A61B5/6858A61B5/6859A61B18/1492A61N1/05A61N1/0551A61N1/0587A61N1/36125A61N1/37205A61N1/37512A61B2018/0016A61B2018/00267A61B2018/00357A61B2018/00577A61B2562/125
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Quick Facts
Patent No.
US 12,053,303
App. No.
16/358,123
Granted
Aug 6, 2024
Kind
B2
Abstract

One aspect includes a manufacturing method for a multielectrode system including providing several conductors, which are electrically conductive in their longitudinal direction; bundling the conductors at a proximal portion of the multielectrode system by means of a sheath surrounding the conductors to form a conductor bundle configured to be used as a lead of the multielectrode system; and providing several ring electrodes each surrounding one of the conductors at a distal portion of the multielectrode system and electrically connecting the ring electrodes and the conductors to form a multielectrode array of the multielectrode system. The multielectrode array is configured to be in a longitudinally extended or in a transversally expanded configuration.

Claims (36)

1. A manufacturing method for a multielectrode system, comprising:

providing several conductors, which are electrically conductive in their longitudinal direction,

bundling the conductors at a proximal portion of the multielectrode system by means of a sheath surrounding the conductors at least partially to form a conductor bundle configured to be used as a lead of the multielectrode system, and

providing several ring electrodes each surrounding at least partially one of the conductors at a distal portion of the multielectrode system and electrically connecting the ring electrodes and the conductors to form a multielectrode array of the multielectrode system,

wherein the multielectrode array is configured to be in a longitudinally extended or in a transversally expanded configuration; and

further comprising electrically connecting either the conductors and/or the guidewires with a distal tip portion of the multielectrode system to form a tip electrode of the multielectrode system, wherein the tip electrode is formed as a ring-shaped electrode and is further surrounded by a tip electrode insulation.

2. The manufacturing method of claim 1 , wherein the transversally expanded configuration is a spherically or a conically expanded configuration.

3. The manufacturing method of claim 1 , wherein the transversally expanded configuration is a rest position of the multielectrode array, which is changeable into the longitudinally extended configuration by inserting the multielectrode array into a sleeve or a catheter.

4. The manufacturing method of claim 1 , further comprising:

providing a tube extending within the conductor bundle,

providing a guidewire extending within the tube and the multielectrode array, and

attaching the guidewire to a distal tip portion of the multielectrode system so that a pulling of the guidewire leads to a change of the multielectrode array from the longitudinally extended to the transversally expanded configuration.

5. The manufacturing method of claim 1 , wherein the conductors comprise a shape memory alloy configured to be in the longitudinally extended and the transversally expanded configuration.

6. The manufacturing method of claim 1 , wherein the conductors are coated with a thermally shaped polymer configured to be in the longitudinally extended and the transversally expanded configuration.

7. The manufacturing method of claim 1 , wherein the transversally expanded configuration of the multielectrode array is a partially open configuration comprising accessible slits between adjacent conductors.

8. The manufacturing method of claim 1 , wherein the bundling is a heating of the sheath, which is a heat shrink.

9. The manufacturing method of claim 1 , further comprising:

providing the sheath around the conductors also in the distal portion of the multielectrode system, and

partially removing the sheath to expose at least a ring electrode portion of one of the ring electrodes.

10. The manufacturing method of claim 1 , further comprising:

providing at least one conductor and one ring electrode in the distal portion of the multielectrode system at least partially with a sub-sheath, and

partially removing the sub-sheath to expose at least a ring electrode portion of the ring electrode.

11. A multielectrode system, comprising:

several conductors, which are electrically conductive in their longitudinal direction,

a sheath surrounding the conductors at least partially to form a conductor bundle configured as a lead of the multielectrode system, and

several ring electrodes each surrounding one of the conductors at a distal portion of the multielectrode system at least partially, wherein the ring electrodes are electrically connected to the conductors to form a multielectrode array (A) of the multielectrode system, and

wherein the multielectrode array is configured to be in a longitudinally extended or in a transversally expanded configuration;

wherein at least one of the several conductors is an insulated conductor, which is electrically insulated in a direction perpendicular to its longitudinal direction;

wherein at least one of the several conductors is a strand of several wires or a bundle of several strands comprising several wires; and

wherein at least one of the wires or one of the strands is electrically insulated in a direction perpendicular to its longitudinal direction; and

wherein at least one of the conductors or the guidewire is electrically connecting with a distal tip portion of the multielectrode system to form a tip electrode of the multielectrode system, wherein the tip electrode is ring-shaped and further surrounded by a tip electrode insulation.

12. The multielectrode system of claim 11 , wherein the strand and/or the bundle comprises a sub-guidewire.

13. The multielectrode system of claim 11 , wherein at least one of the several conductors is a wire.

14. The multielectrode system of claim 11 , wherein a diameter of the multielectrode system is in a range between 0.5 and 2.5 mm and the multielectrode system comprises between 2 and 150 ring electrodes.

15. The multielectrode system of claim 11 incorporated in a multielectrode unit further comprising a pulse generator configured to control the multielectrode system.

16. The multielectrode system of claim 11 used for applications within the fields of neuro modulation, electrophysiology or cardiac rhythm management.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 23, 2024
From: HERAEUS DEUTSCHLAND GMBH & CO. KG
To: HERAEUS MEDEVIO GMBH & CO. KG
Reel/Frame 068189/0526 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 11, 2019
From: JUNG, MARKUS; KEITEL, OLIVER
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 048863/0254 →
Priority Claims (1)
EP 18163684 · Mar 23, 2018 · regional
Continuity (1)
Related Publication 20190290206A1 · Sep 26, 2019