Nanosheet transistor with fully isolated source and drain regions and spacer pinch off
A semiconductor device includes a plurality of nano sheet stacks disposed above a substrate. Each nanosheet stack has a first nanosheet and a first sacrificial layer, the first nanosheet and the first sacrificial layer each include a first end and a second end. The first end and the second end of the first sacrificial layer are recessed from the first and second ends of the first nanosheet. Each nanosheet stack has a bottom sacrificial layer formed on top of the substrate. The bottom sacrificial layer has a first end and a second end, which are recessed from the first and second ends of the first nanosheet. The semiconductor also has a source or drain (S/D) structures formed in contact with the first end and the second end of the first nanosheet. The S/D structures are isolated from the substrate by the bottom sacrificial layer.
1. A method of fabricating a semiconductor device, the method comprising:
forming a plurality of nanosheet stacks disposed above a substrate, each nanosheet stack comprising:
a first nanosheet and a first sacrificial layer, the first nanosheet and the first sacrificial layer each having a first end and a second end, the first sacrificial layer comprising a first germanium content; and
a bottom sacrificial layer formed on top of the substrate, the bottom sacrificial layer comprising a second germanium content higher than the first germanium content;
forming a gate structure on each nanosheet stack;
recessing a portion of the nanosheet stacks and the substrate below a bottommost surface of the bottom sacrificial layer such that a distance “Dg” between adjacent gate structures is greater than a distance “Ds” between adjacent nanosheets stacks;
removing a portion of the first and second ends of the first sacrificial layer to expose portions of the first nanosheet;
removing the bottom sacrificial layer to form a cavity between the nanosheet stacks and the substrate;
forming an interlayer dielectric (ILD) layer around the plurality of nanosheet stacks in source/drain regions, the ILD layer filling the cavity; and
forming source or drain (S/D) structures in the S/D regions in contact with the first end and the second end of the first nanosheet, wherein the S/D structures are isolated from the substrate by the ILD layer.
2. The method according to claim 1 , wherein the gate structure comprises:
a gate having a first and a second gate sidewall; and
a hard mask on a top surface of the gate.
3. The method according to claim 1 , wherein each nanosheet stack further comprises a plurality of vertically-stacked nanosheets alternating with a plurality of sacrificial layers disposed above the first nanosheet, such that each nanosheet is separated by a sacrificial layer and such that the substrate is separated from the nanosheet stack by the bottom sacrificial layer.
4. The method according to claim 3 , wherein the sacrificial layers comprise silicon germanium (SiGe).
5. The method according to claim 4 , wherein the sacrificial layers contain 25% to 50% of germanium (Ge).
6. The method according to claim 1 , wherein the first sacrificial layer contains 25% of germanium (Ge) and the bottom sacrificial layer contains 50% of Ge.
7. A method of fabricating a semiconductor device, the method comprising:
forming a plurality of nanosheet stacks disposed above a substrate, each nanosheet stack comprising a plurality of vertically-stacked nanosheets having a first end and a second end alternating with a plurality of sacrificial layers comprising a first germanium content, the sacrificial layers having a first end and a second end disposed above the first nanosheet such that each nanosheet is separated by a sacrificial layer and such that the substrate is separated from the nanosheet stack by a bottom sacrificial layer comprising a second germanium content higher than the first germanium content;
forming a gate structure on each nanosheet stack;
recessing a portion of the nanosheet stacks and the substrate below a bottommost surface of the bottom sacrificial layer such that a distance “Dg” between adjacent gate structures is greater than a distance “Ds” between adjacent nanosheets stacks;
removing a portion of the first and second ends of the first sacrificial layers to expose portions of the first nanosheet;
removing the bottom sacrificial layer to form a cavity between the nanosheet stacks and the substrate;
forming an interlayer dielectric (ILD) layer around the plurality of nanosheet stacks in source or drain (S/D) regions, the ILD layer filling the cavity; and
forming S/D structures in the S/D regions in contact with the first end and the second end of the vertically-stacked nanosheets, wherein the S/D structures are isolated from the substrate by the ILD layer.
8. The method according to claim 7 , wherein the sacrificial layers comprise silicon germanium (SiGe).
9. The method according to claim 8 , wherein the sacrificial layers contain 25% to 50% of germanium (Ge).
10. The method according to claim 7 , wherein the sacrificial layers contain 25% of germanium (Ge) and the bottom sacrificial layer contains 50% of Ge.
11. The method according to claim 7 , wherein the gate structure comprises:
a gate having a first and a second gate sidewall; and
a hard mask on a top surface of the gate.