Sewing method and apparatus to increase 3D object strength
An addition to additive manufacturing sews a number of printed substrate sheets together using industrial sewing machine technology. Portions of the final 3D object that will be solid are sewn together into bundles of the object with a needle protruding through the top of the bundle via a sewing machine with a looping mechanism connecting the thread loops under each bundle of printed substrate sheet layers. This will result in many well connected stack bundles that are then stacked in alignment to form the final stack. During heat and compression, the stitch thread may bunch together and become entangled with the cooled plastic of the final solid 3D object. Removal of the excess substrate may proceed as usual, since the sewing is applied only in the solid portions of the final object. The end result will be a part with much higher strength in the Z axis.
1. A method of bonding printed composite layers into bundles during composite based additive manufacturing, comprising:
a) receiving a plurality of printed substrate layers in succession from an additive manufacturing device, each printed substrate layer having a substrate sheet printed with a polymer;
b) stacking the received plurality of printed substrate layers in aligned formation at a piling station to form a bundle of the printed substrate layers, the bundle of printed substrate layers being a part of a stack of the printed substrate layers forming a 3D composite object;
c) sewing the printed substrate layers together with a sewing machine to form a sewn bundle; and
d) transferring the sewn bundle to a stacker subsystem via a bundle convey subsystem for subsequent bonding with a second sewn bundle to form a stack of printed substrate layers including the sewn bundle.
2. The method of claim 1 , wherein the step c) further comprises repeatedly passing a sewing needle and sewing thread attached to the sewing needle through the bundle of printed substrate layers to pull a first loop of the sewing thread from one side of the bundle of printed substrate layers of printed substrate layers to an opposite side of the bundle with a sewing mechanism, repeatedly wrapping the first loop of the sewing thread around a second sewing thread with a looping mechanism, and pulling the sewing needle and attached sewing thread out of the bundle of printed substrate layers.
3. The method of claim 1 , wherein the step c) further comprises repeatedly passing a sewing needle and sewing thread attached to the sewing needle through the bundle of printed substrate layers to pull a first loop of the sewing thread from one side of the bundle of printed substrate layers to an opposite side of the bundle of printed substrate layers with a sewing mechanism, repeatedly wrapping the first loop of the sewing thread around a second loop of the sewing thread with a looping mechanism, and pulling the sewing needle and attached sewing thread out of the bundle of printed substrate layers.
4. The method of claim 1 , further comprising, after step b), transferring the bundle of printed substrate layers from the piling station to the sewing machine with the bundle convey subsystem.
5. The method of claim 1 , wherein the sewing is performed with a thread including one of a polymer fiber and a carbon fiber.
6. The method of claim 1 , wherein the step b) includes aligning registration apertures of the printed substrate layers about registration pins at the piling station.
7. The method of claim 1 , wherein the step d) includes placing the sewn bundle onto the second sewn bundle and in alignment therewith with alignment apertures of the bundles in register with registration pins of the stacker subsystem, the stacker subsystem receiving the sewn bundles to form a stack of the sewn bundles.
8. The method of claim 1 , further comprising, after step d), entangling a sewing thread from the sewn bundle with the polymer printed on a printed substrate layer of an adjacent bundle of printed substrate layers.
9. The method of claim 1 , further comprising outputting control signals from a controller to control the sewing machine.
10. A method of bonding printed composite layers into bundles during composite based additive manufacturing, comprising:
a) receiving a plurality of printed substrate layers in succession from an additive manufacturing device, each printed substrate layer having a substrate sheet printed with a polymer;
b) stacking the received plurality of printed substrate layers in aligned formation at a piling station to form a bundle of the printed substrate layers, the bundle of printed substrate layers being a part of a stack of the printed substrate layers forming a 3D composite object;
c) outputting control signals from a controller to control a sewing machine;
d) sewing the printed substrate layers together with the sewing machine to form a sewn bundle, the sewing further comprising repeatedly passing a sewing needle and sewing thread attached to the sewing needle through the bundle of printed substrate layers to pull a first loop of the sewing thread from one side of the bundle of printed substrate layers to an opposite side of the bundle of printed substrate layers with a sewing mechanism, repeatedly wrapping the first loop of the sewing thread around a second loop of the sewing thread with a looping mechanism, and pulling the sewing needle and attached sewing thread out of the bundle of printed substrate layers; and
e) transferring the sewn bundle to a stacker subsystem via a bundle convey subsystem for subsequent bonding with a second sewn bundle to form a stack of printed substrate layers including the sewn bundle, the transferring the sewn bundle including placing the sewn bundle onto the second sewn bundle and in alignment therewith with alignment apertures of the bundles in register with registration pins of the stacker subsystem, the stacker subsystem receiving the sewn bundles to form a stack of the sewn bundles.
11. The method of claim 10 , wherein the step b) includes aligning registration apertures of the printed substrate layers about registration pins at the piling station, and further comprising after step b), transferring the bundle of printed substrate layers from the piling station to the sewing machine with the bundle convey subsystem.