IP Library Granted Patent US 10,802,198
Granted Patent B1
US 10,802,198 · App. 16/370,166 · Granted Oct 13, 2020

Structural support elements of light guide and electrical housing

Inventors: Ron G. Gipson (Metamora, MI); Bhanumurthy Veeragandham (Auburn Hills, MI); Indraneel Page (Farmington Hills, MI)
Assignee: Dura Operating, LLC
G02B6/0045G02B6/005G02B6/0021G02B6/0065G02B6/0083H05K1/181H05K2201/0108H05K2201/10106
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Quick Facts
Patent No.
US 10,802,198
App. No.
16/370,166
Granted
Oct 13, 2020
Kind
B1
Abstract

A component assembly includes a printed circuit board having an electronics component mounted on a first portion of a first face of the printed circuit board. A light emitting diode is mounted on a second portion of the first face. A light guide of a light transmissive polymeric material covers the body including the light emitting diode and the electronics component. The light guide includes: a cavity having the electronics component positioned within the cavity; a non-planar area of the light guide positioned above the cavity, the non-planar area mitigating against collapse of the light guide into the cavity; and a second cavity having the light emitting diode positioned within the second cavity; and a top plate of a polymeric light reflective material mounted onto the light guide directly above the light emitting diode.

Claims (36)

1. A component assembly, comprising:

a body having an electronics component mounted on a first portion of a first face of the body; and

a light guide covering the electronics component, the light guide having:

a cavity having the electronics component positioned within the cavity; and

a non-planar area of the light guide positioned above the cavity, the non-planar area providing support for the light guide and mitigating against collapse of the light guide into the cavity, wherein the non-planar area includes a ceiling of the cavity positioned directly over the electronics component and wherein the non-planar area defines a dome-shaped wall having an equal thickness throughout the dome-shaped wall.

2. The component assembly of claim 1 , wherein a clearance gap is provided in an as-molded condition of the non-planar area between the electronics component and the ceiling.

3. The component assembly of claim 1 , wherein the non-planar area includes a curved outer surface and wherein the ceiling defines a curved surface.

4. The component assembly of claim 1 , further including:

a light emitting diode mounted on the first face of the body; and

a top plate molded of a polymeric material attached to the light guide outside of a portion of the light guide covering the electronic component and also covering the light emitting diode; and

wherein the top plate is pre-molded and is separately attached to the light guide using multiple pins homogeneously connected to the light guide which are individually received in one of multiple apertures created in the top plate.

5. The component assembly of claim 4 , wherein the light guide is molded of a light transmissive polymeric material having the non-planar area defining a homogeneous portion of the light guide and includes a support area homogeneously connected to the light guide and extending from the light guide to directly contact the body outside of the cavity to provide support for the top plate and to mitigate against collapse of the cavity.

6. The component assembly of claim 4 , wherein the body defines a printed circuit board and the light emitting diode is mounted on a second portion of the first face separate from the first portion.

7. The component assembly of claim 4 , further including a molded outer layer of an opaque polymeric material applied to a second face of the body oppositely facing with respect to the top plate.

8. A component assembly, comprising:

a body having an electronics component mounted on a first portion of a first face of the body;

a light emitting diode mounted on a second portion of the first face; and

a light guide covering the body including the light emitting diode and the electronics component, the light guide having:

a cavity having the electronics component positioned within the cavity; and

a non-planar area of the light guide positioned above the cavity, the non-planar area mitigating against collapse of the light guide into the cavity,

wherein the body includes a through aperture positioned proximate to the light emitting diode with the light guide also covering the through aperture.

9. The component assembly of claim 8 , wherein the light guide includes a second cavity defining a light outlet positioned over the light emitting diode and aligned with the through aperture positioned proximate to the light emitting diode.

10. The component assembly of claim 8 , further including a top plate of a polymeric light reflective material mounted onto the light guide directly above the light emitting diode, wherein the top plate is separately attached to the light guide using multiple pins homogeneously connected to the light guide which are individually received in one of multiple apertures created in the top plate.

11. The component assembly of claim 8 , wherein the non-planar area includes a curved outer surface and a ceiling defining a planar surface oriented parallel to the body, and wherein the non-planar area has a first thickness defining a first end, a second thickness greater than or equal to the first thickness approximately at a mid-span above the cavity, and a third thickness equal to or less than the second thickness defining a second end.

12. The component assembly of claim 8 , wherein the non-planar area includes a curved outer surface and a ceiling defining a curved surface, and wherein the non-planar area also defines a dome-shaped wall having an equal thickness throughout the dome-shaped wall.

13. A component assembly, comprising:

a printed circuit board having an electronics component mounted on a first portion of a first face of the printed circuit board;

a light emitting diode mounted on a second portion of the first face;

a light guide of a light transmissive polymeric material covering the printed circuit board including the light emitting diode and the electronics component, the light guide having:

a cavity having the electronics component positioned within the cavity;

a non-planar area of the light guide positioned above the cavity, the non-planar area mitigating against collapse of the light guide into the cavity; and

a second cavity having the light emitting diode positioned within the second cavity; and

a top plate of a polymeric light reflective material mounted onto the light guide directly above the light emitting diode,

wherein the light guide is attached to the printed circuit board using pins extending from the light guide received in first apertures of the printed circuit board, and

wherein the top plate is pre-molded and is attached to the light guide using pins homogeneously connected to the light guide which are individually received in second apertures created in the top plate.

14. The component assembly of claim 13 , wherein the non-planar area of the light guide includes a ceiling positioned over the electronics component, with a clearance gap provided between the electronics component and the ceiling.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2022
From: DUS OPERATING INC.; DURA AUTOMOTIVE HOLDINGS U.K. LTD; DURA AUTOMOTIVE BODY & GLASS SYSTEMS GMBH
To: PLASMAN US HOLDCO LLC
Reel/Frame 061476/0893 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 24, 2021
From: DURA OPERATING, LLC; DURA AUTOMOTIVE SYSTEMS, LLC; DURA GLOBAL TECHNOLOGIES, INC.; DURA GLOBAL TECHNOLOGIES, LLC
To: DUS OPERATING INC.
Reel/Frame 058241/0814 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 8, 2020
From: GIPSON, RON G; VEERAGANDHAM, BHANUMURTHY; PAGE, INDRANEEL
To: DURA OPERATING, LLC
Reel/Frame 052340/0212 →