HIGH POWER LED ASSEMBLY AND METHOD OF FORMING A HIGH POWER LED ASSEMBLY

1 . A method of forming a light emitting diode (LED) device, the method comprising:

providing:

a lead frame, and

an LED sub-assembly comprising an LED die; and

an optically transparent side wall surrounding the LED die, the side wall having a curved or angled profile;

attaching the LED sub-assembly to the lead frame; and

dispensing an encapsulation material in a space surrounding the LED sub-assembly attached to the lead frame.

2 . The method of claim 1 , wherein the LED die is attached to a wavelength converting layer.

3 . The method according to claim 1 , wherein the encapsulation material includes a polymeric material mixed with reflective particles.

4 . The method according to claim 1 , wherein the encapsulation material includes silicone mixed with titanium oxide (TiOx) particles.

5 . The method according to claim 2 , wherein the encapsulation material peripherally surrounds both the wavelength converting layer and the side wall after dispensing the encapsulation material.

6 . The method according to claim 2 , wherein the wavelength converting layer comprises a first surface attached to the LED die and a second surface opposite from the first surface that has a flat profile.

7 . The method of claim 1 , wherein providing the lead frame further includes at least one of:

etching a metallic layer to form contacts of the lead frame; or

stamping a metallic layer to form contacts of the lead frame.

8 . The method of claim 1 , wherein the lead frame includes a polymer base and metal contacts embedded in the polymer base.

9 . The method of claim 1 , wherein a pocket is formed or stamped in the lead frame, and the pocket is adapted to receive the LED sub-assembly.

10 . The method of claim 1 , wherein the space surrounding the LED sub-assembly has a conical profile.

11 . The method of claim 1 , wherein the space surrounding the LED sub-assembly extends between the LED sub-assembly and an adjacent LED sub-assembly attached to the lead frame.

12 . The method of claim 1 , wherein the LED sub-assembly is a high powered LED.

13 . The method of claim 2 , wherein the wavelength conversion layer is formed as a first discrete layer, the LED die is formed as a second discrete layer, and the LED die is deposited onto the wavelength conversion layer.

14 . The method of claim 1 , wherein the lead frame is formed as a continuously flat plate having a uniform cross-sectional profile.

15 . The method of claim 1 further comprising:

curing the encapsulation material.

16 . The method of claim 1 , wherein attaching the LED sub-assembly to the lead frame comprises at least one of a soldering, a mounting by conductive epoxy, and mounting by sintering heat and electrically conductive material.

17 . A light emitting diode (LED) device comprising:

a lead frame including a polymeric base and at least one metal contact;

an LED sub-assembly including an LED die attached to an optically transparent side wall surrounding the LED die, the optically transparent side wall having a curved or angled profile, the LED sub-assembly being attached to the lead frame such that at least one metal contact of the LED die contacts the at least one metal contact of the lead frame; and

an encapsulation material surrounding the LED sub-assembly.

18 . The LED device of claim 17 , further comprising a wavelength conversion layer, wherein the wavelength conversion layer defines a first surface attached to the LED die and a second surface opposite from the first surface that has a flat profile.

19 . The LED device of claim 17 , wherein at least one of:

the encapsulation material includes at least one of a polymeric and a silicone based material mixed with reflective particles, and

the encapsulation material peripherally surrounds both the wavelength converting layer and the optically transparent side wall.

20 . The LED device of claim 17 , wherein the polymer base of the lead frame is formed as at least one of: a continuously flat plate having a uniform cross-sectional profile; or a plate including a pre-molded pocket adapted to receive the LED sub-assembly.