Wide band gap semiconductor device and method for forming a wide band gap semiconductor device
A method for forming a wide band gap semiconductor device is provided. The method includes forming a gate insulation layer on a wide band gap semiconductor substrate and annealing the gate insulation layer using at least a first reactive gas species and a second reactive gas species, wherein the first reactive gas species differs from the second reactive gas species. The method can include forming a gate electrode on the gate insulation layer after annealing the gate insulation layer.
1. A method for forming a wide band gap semiconductor device, the method comprising:
forming a gate insulation layer on a wide band gap semiconductor substrate;
in an annealing tool, annealing the gate insulation layer in a reactive gas atmosphere comprising at least a reactive gas species;
before annealing the gate insulation layer in the reactive gas atmosphere, heating the gate insulation layer in an inert gas atmosphere at a temperature of at least 950° C.; and
after annealing the gate insulation layer in the reactive gas atmosphere and without exposing the gate insulation layer to the atmosphere outside the annealing tool, annealing the gate insulation layer in an inert gas atmosphere.
2. The method of claim 1 , wherein the reactive gas species comprises at least one of nitric oxide and ammonia, and wherein a volume percent of the reactive gas species is at least 0.1 vol %.
3. The method of claim 1 , wherein the reactive gas species comprises at least 5 vol % nitric oxide, wherein the inert gas species comprises at least 90% nitrogen, and wherein a duration of the annealing in the inert gas species is shorter than a duration of the annealing in the reactive gas species.
4. The method of claim 1 , wherein the inert gas atmosphere has a concentration of oxygen of at most 0.5 vol %.
5. The method of claim 1 , wherein a duration of each annealing of the gate insulation layer is at least 10 minutes and at most 600 minutes.
6. The method of claim 1 , wherein an annealing temperature of each annealing of the gate insulation layer is at least 600° C. and at most 1200° C.
7. The method of claim 1 , further comprising:
after annealing the gate insulation layer in the inert gas atmosphere, forming a gate electrode on the gate insulation layer.
8. The method of claim 7 , wherein the gate electrode is a gate trench electrode that extends from a surface of the wide band gap semiconductor substrate into the wide band gap semiconductor substrate.
9. The method of claim 1 , wherein the wide band gap semiconductor substrate is a silicon carbide substrate.
10. The method of claim 1 , wherein the gate insulation layer is a silicon dioxide layer.
11. A wide band gap semiconductor device, comprising:
a wide band gap semiconductor substrate;
a transistor;
a gate insulation layer of the transistor; and
a gate electrode of the transistor,
wherein the gate insulation layer is located between the wide band gap semiconductor substrate and the gate electrode,
wherein a charge carrier mobility of a channel region of the transistor within the wide band gap semiconductor substrate is at least 50 cm 2 /Vs,
wherein a threshold voltage of the transistor varies from a nominal threshold voltage by at most 10% of the nominal threshold voltage when a nominal gate voltage is applied at 150° C. for 1000 h.
12. The wide band gap semiconductor device of claim 11 , wherein a refractive index of the gate insulation layer is at least 1.457 and at most 1.468 at a wavelength of at least 631 nm and at most 633 nm.
13. The wide band gap semiconductor device of claim 11 , wherein the wide band gap semiconductor substrate is a silicon carbide substrate.