Dual-cure resins and related methods
The present disclosure relates generally to curable resins, in particular dual-cure resins, and related methods for use in an additive fabrication (e.g., 3-dimensional printing) device.
1. A dual-cure resin for use in additive manufacturing, comprising:
a photo-curable component configured to cure when subjected to an effective amount of actinic radiation; and
a secondary component comprising a first secondary precursor species isolated from a second secondary precursor species, the first secondary precursor species and the second secondary precursor species configured to react when subjected to an initiating event.
2. A dual-cure resin as in claim 1 , wherein the first secondary precursor species is physically isolated from the second secondary precursor species.
3. A dual-cure resin as in claim 1 , wherein the first secondary precursor species is insoluble with the second secondary precursor species at room temperature.
4. A dual-cure resin as in claim 1 , wherein the first secondary precursor species comprises a blocking agent configured to prevent reaction of the first secondary precursor species and the second secondary precursor species, until occurrence of the initiating event.
5. A dual-cure resin as in claim 1 , wherein the second secondary precursor species comprises dicyandiamide.
6. A dual-cure resin as in claim 1 , wherein isolation prevents reaction between the first secondary precursor species and the second secondary precursor species, until subjected to the initiating event.
7. A dual-cure resin for use in additive manufacturing, comprising:
a photo-curable component configured to cure when subjected to an effective amount of actinic radiation; and
a secondary component comprising dicyandiamide and a secondary precursor species configured to react with dicyandiamide when subject to an initiating event.
8. A dual-cure resin for use in additive manufacturing, comprising:
a photo-curable component configured to cure when subjected to an effective amount of actinic radiation; and
a secondary component comprising a plurality of particles comprising a first secondary precursor species, wherein the plurality of particles are configured to dissolve when subjected to a dissolving event.
9. The dual-cure resin of claim 8 , wherein the dissolving event comprises application of an effective amount of heat.
10. The dual-cure resin of claim 8 , wherein the dissolving event comprises application of an effective mechanical force.
11. The dual-cure resin of claim 10 , wherein the effective mechanical force comprises a vibrational force.
12. The dual-cure resin of claim 8 , wherein the dissolving event comprises introduction of a chemical species.
13. The dual-cure resin of claim 12 , wherein the chemical species comprises at least one of a solvent or a catalyst.
14. The dual-cure resin of claim 8 , wherein the plurality of particles are configured to remain substantially undissolved until subjected to the dissolving event.
15. The dual-cure resin of claim 8 , wherein the secondary component is configured to produce a secondary polymer comprising one of a polyurea or an epoxy.
16. The dual-cure resin of any of claim 8 , wherein the first secondary precursor species comprises an amine species.
17. The dual-cure resin of claim 16 , wherein the amine species comprises dicyandiamide.
18. The dual-cure resin of claim 8 , wherein the secondary component further comprises a second secondary precursor species configured to react with the dissolved first secondary species to produce a secondary polymer.
19. The dual-cure resin of claim 18 , wherein the second secondary precursor species comprises a diisocyanate species.
20. The dual-cure resin of any of claim 8 , wherein the dual-cure resin is configured to have a shelf-life of at least six months.
21. The dual-cure resin of any of claim 8 , wherein the dual-cure resin is configured to have a viscosity of between 1 cP and 10,000 cP at 30° C.