Compressed air and lattice structure cooling
Compressed air and lattice structure cooling is disclosed. In an embodiment, an assembly includes a heat conductive lattice structure with open-cell voids. The assembly also includes a port configured to provide compressed air that is directed toward the heat conductive lattice structure. The assembly also includes a base configured to be coupled to an electronic component and thermally coupled to the heat conductive lattice structure.
1. An assembly, comprising:
a heat conductive lattice structure with open-cell voids;
a port configured to provide compressed air that is directed toward the heat conductive lattice structure;
an air flow spreader configured to receive the compressed air provided via the port and distribute the compressed air through one or more airflow pathways to one or more outlets facing the heat conductive lattice structure, wherein the one or more airflow pathways are in a configuration in which an airflow pathway pattern recurs in substantially similar form at progressively smaller scales; and
a base configured to be coupled to an electronic component and thermally coupled to the heat conductive lattice structure.
2. The assembly of claim 1 , wherein the airflow pathway pattern is associated with an H-tree fractal.
3. The assembly of claim 1 , wherein the port has a substantially similar air flow resistance to each of the one or more outlets.
4. The assembly of claim 1 , wherein the air flow spreader includes a fractal airflow pathway network.
5. The assembly of claim 1 , further comprising a vortex tube coupled to the port, wherein the vortex tube is configured to spin a source of the compressed air to provide a colder compressed air to the port and exhaust a warmer exhaust air.
6. The assembly of claim 1 , wherein the heat conductive lattice structure is made, at least in part, of aluminum or an alloy thereof.
7. The assembly of claim 6 , wherein the heat conductive lattice structure has undergone an aluminum-oxide removal process.
8. The assembly of claim 1 , wherein the heat conductive lattice structure has been plated.
9. The assembly of claim 1 , wherein the open-cell voids are of substantially similar size and are of substantially similar distance apart from one another.
10. The assembly of claim 1 , wherein the electronic component is an integrated circuit chip.
11. The assembly of claim 1 , wherein the compressed air is compressed by an air compressor external to a server rack.
12. The assembly of claim 1 , further comprising a distribution tank configured to store the compressed air and deliver the compressed air to the port.
13. The assembly of claim 1 , further comprising a connector configured to automatically stop a flow of the compressed air in response to a tray being removed from a server rack and/or to automatically initiate the flow of the compressed air in response to the tray being plugged into the server rack.
14. The assembly of claim 1 , further comprising a control valve configured to control an amount of the compressed air distributed to the electronic component.
15. The assembly of claim 14 , wherein the control valve is computer-controlled.
16. The assembly of claim 14 , wherein the control valve is controlled based at least in part on at least one of: a load of the electronic component or a temperature of the electronic component.
17. The assembly of claim 1 , wherein the base is coupled to the electronic component via a thermal paste.
18. A method, comprising:
providing compressed air via a port;
directing the compressed air toward a heat conductive lattice structure with open-cell voids;
utilizing an air flow spreader to receive the compressed air provided via the port and distribute the compressed air through one or more airflow pathways to one or more outlets facing the heat conductive lattice structure, wherein the one or more airflow pathways are in a configuration in which an airflow pathway pattern recurs in substantially similar form at progressively smaller scales; and
cooling, via the compressed air, an electronic component coupled to a base that is thermally coupled to the heat conductive lattice structure.
19. The method of claim 18 , wherein the air flow spreader includes a fractal airflow pathway network.
20. An assembly, comprising:
a heat conductive lattice structure with open-cell voids;
a port configured to provide compressed air that is directed toward the heat conductive lattice structure;
an air flow spreader configured to receive the compressed air provided via the port and distribute the compressed air through one or more airflow pathways to one or more outlets facing the heat conductive lattice structure, wherein the one or more airflow pathways are in a configuration associated with an H-tree fractal; and
a base configured to be coupled to an electronic component and thermally coupled to the heat conductive lattice structure.