Feature and depth measurement using multiple beam sources and interferometry
Systems and techniques for processing materials using wavelength beam combining for high-power operation in concert with interferometry to detect the depth or height of features as they are created.
1. A system for processing a workpiece, the system comprising:
a laser emitter for emitting an output beam;
an interferometry apparatus for measuring a height or depth of a portion of a surface of the workpiece using a portion of the output beam; and
a controller, coupled to the laser emitter and the interferometry apparatus, for controlling a property of the output beam, in accordance with the measured height or depth of the portion of the surface of the workpiece, to process the workpiece by physically altering the workpiece.
2. The system of claim 1 , wherein the interferometry apparatus comprises a movable reflective surface, a photodetector, and a beamsplitter.
3. The system of claim 1 , wherein the controlled property of the output beam is power.
4. The system of claim 1 , wherein the controlled property of the output beam is beam parameter product.
5. The system of claim 1 , wherein the laser emitter is configured to emit a multi-wavelength output beam.
6. The system of claim 1 , wherein the laser emitter comprises a wavelength beam combining laser emitter.
7. The system of claim 1 , further comprising a database storing parameters relating process types and/or material compositions to output-beam properties.
8. The system of claim 7 , wherein the controller is configured to control the property of the output beam to process the workpiece based at least in part on one or more parameters in the database.
9. The system of claim 1 , wherein the controller is configured to process the workpiece by at least one of cutting the workpiece, etching the workpiece, annealing the workpiece, drilling the workpiece, soldering the workpiece, or welding the workpiece.