METHODS AND DEVICES FOR TREATING THE SKIN
An apparatus includes multiple first reservoirs and multiple second reservoirs joined with a substrate. Selected ones of the multiple first reservoirs include a reducing agent, and first reservoir surfaces of selected ones of the multiple first reservoirs are proximate to a first substrate surface. Selected ones of the multiple second reservoirs include an oxidizing agent, and second reservoir surfaces of selected ones of the multiple second reservoirs are proximate to the first substrate surface.
1 . A method for treating acne comprising applying to a treatment area a device comprising a laminate comprising an elastic outer layer and an in-elastic inner layer, said inner layer comprising a substrate comprising one or more biocompatible electrodes configured to generate at least one of a low level electric field (LLEF) or low level electric current (LLEC).
2 . The method of claim 1 wherein the biocompatible electrodes comprise a first array comprising a pattern of microcells formed from a first conductive material, and a second array comprising a pattern of microcells formed from a second conductive material.
3 . The method of claim 2 wherein the LLEF is between 0.05 and 5 Volts.
4 . The method of claim 3 wherein the LLEF is between 0.1 and 5 Volts.
5 . The method of claim 4 wherein the LLEF is between 1.0 and 5 Volts.
6 . The method of claim 2 wherein the substrate comprises a pliable material.
7 . A method for rejuvenating skin comprising applying to a treatment area a device comprising a laminate comprising an elastic outer layer and an in-elastic inner layer, said inner layer comprising a substrate comprising biocompatible electrodes capable of generating at least one of a low level electric field (LLEF) or low level micro current (LLEC);
8 . The method of claim 7 wherein the biocompatible electrodes comprise a first array comprising a pattern of microcells formed from a first conductive material, and a second array comprising a pattern of microcells formed from a second conductive material.
9 . The method of claim 8 wherein the LLEF is between 0.05 and 5 Volts.
10 . The method of claim 9 wherein the LLEF is between 0.1 and 5 Volts.
11 . The method of claim 10 wherein the LLEF is between 1.0 and 5 Volts.
12 . The method of claim 8 wherein the substrate comprises a pliable material.
13 . The method of claim 2 , wherein said first conductive material comprises silver.
14 . The method of claim 8 , wherein said first conductive material comprises silver.