Relating to substrates for the attachment of molecules
A substrate comprising a coating of a masking material, and a plurality of discrete reaction zones onto which one or more binding agents are intended to be attached, wherein said zones are uncoated areas on the substrate.
1. A ceramic substrate comprising a coating of a masking material, and a plurality of discrete reaction zones onto which one or more binding agents are intended to be attached, wherein said zones are uncoated areas on the substrate, wherein the masking material has a contact angle of 60-120°, and comprises a pigment, an acrylic resin, and a structuring agent, wherein the structuring agent is PTFE wax, and the ceramic substrate has a particle size of 1 to 30 μm.
2. A ceramic substrate according to claim 1 , wherein the ceramic substrate has a particle size of less than 20 μm.
3. A ceramic substrate according to claim 1 , wherein the ceramic substrate has a particle size of less than 10 μm.
4. A ceramic substrate according to claim 1 , wherein the ceramic substrate consists of 96% alumina (Al 2 O 3 ) with a particle size of 4 to 8 μm.
5. A ceramic substrate according to claim 1 , wherein the substrate is approximately 100 mm×99 mm in size, and wherein the substrate comprises square subsections that are approximately 9 mm×9 mm in size, each square subsection comprising a grid of discrete reaction zones, and wherein each square subsection comprises a grid of from 5×5, to 30×30 discrete reaction zones.
6. A ceramic substrate according to claim 1 , wherein the density of the discrete reaction zones is in the range of from 0.08 to 15 zones/mm 2 .
7. A ceramic substrate according to claim 1 , wherein each discrete reaction zone has a diameter ranging from 0.1 mm to 1 mm in diameter.
8. A ceramic substrate according to claim 1 comprising one or more binding agents immobilised on the discrete reaction zones.
9. A ceramic substrate according to claim 1 , wherein the substrate is a white ceramic substrate.
10. A ceramic substrate according to claim 1 , wherein the contact angle is 90°-120°.
11. A ceramic substrate according to claim 1 , wherein the thickness of the coating applied to the substrate is 2 to 50 μm (micron) thick.
12. A ceramic substrate according to claim 1 , wherein the coating of masking material is a color ranging from off-white to black.
13. A ceramic substrate according to claim 1 , wherein the discrete reaction zones are chemically activated to allow immobilization of binding agent.
14. A ceramic substrate according to claim 1 , wherein the masking material comprises an epoxy resin.
15. A ceramic substrate according to claim 1 , wherein:
the pigment is present in an amount of 1 to 8% w/w of the masking composition;
epoxy resin is present in an amount of 15 to 50% w/w of the masking composition,
the acrylic resin is present in an amount of 2 to 10% w/w of the masking composition, and
the structuring agent is present in an amount of 15 to 50% w/w of the masking composition.
16. A ceramic substrate according to claim 1 , wherein
the pigment is present in an amount of about 5% w/w of the masking composition;
the epoxy resin is present in an amount of about 30% w/w of the masking composition,
the acrylic resin is present in an amount of about 10% w/w of the masking composition, and
the structuring agent is present in an amount of about 20% w/w of the masking composition.
17. A ceramic substrate according to claim 1 , wherein the binding agents are antibodies.
18. A ceramic substrate according to claim 1 , wherein the masking material does not contain silicon.
19. A ceramic substrate according to claim 1 , wherein the coating of the masking material is a thermally cured coating.
20. A ceramic substrate according to claim 19 , wherein the thermally cured coating has been thermally cured at a temperature of at least 140° C.
21. A ceramic substrate according to claim 1 , wherein the coating of the masking material is a screen printed coating.
22. A ceramic substrate according to claim 15 , wherein the pigment is a black pigment.
23. A method of forming a ceramic substrate according to claim 1 , the method comprising:
(a) forming a plurality of discrete reaction zones on the surface of the ceramic substrate; and
(b) applying the masking material to the surface of the ceramic substrate other than the plurality of discrete reaction zones to form a coating of the masking material.
24. A method according to claim 23 , wherein the masking material is applied by screen printing.
25. A method according to claim 23 , wherein the masking material is thermally cured on the surface of the ceramic substrate.
26. A method according to claim 25 , wherein the masking material is thermally cured at a temperature of at least 140° C.