Array substrates and manufacturing methods thereof, and display panels
View Patent ↗According to an embodiment, the present invention provides an array substrate that includes a base substrate and a number of film layers provided on the base substrate. The base substrate is provided with an installation slot that provides an installation space for a hardware structure. A packaging-reserved slot is defined in a number of film layers and extending through at least a part of the film layers. The installation slot extends through the base substrate in a thickness direction of the array substrate, and the packaging-reserved slot surrounds the installation slot.
1. An array substrate comprising:
a base substrate;
an installation slot positioned in the base substrate for providing an installation space, the installation slot extending through a thickness of the base substrate, the installation slot separating the base substrate into two or more pixel regions; and
an anode layer and a pixel defining layer provided in each pixel region on the base substrate,
wherein the pixel defining layer includes a plurality of pixel defining openings, and
wherein the pixel defining layer includes a packaging-reserved slot extending through at least a part of the pixel defining layer, the packaging-reserved slot being positioned around the installation slot.
2. The array substrate according to claim 1 , further comprising an organic light-emitting unit in the pixel defining opening, the organic light-emitting unit including an organic light-emitting material layer and a cathode layer formed on the organic light-emitting material layer.
3. The array substrate according to claim 2 , wherein a top surface of the organic light-emitting unit is planar with a top surface of the pixel defining laver.
4. The array substrate according to claim 1 ,
wherein a width of the packing reserve slot is greater than a width of the installation slot.
5. The array substrate according to claim 2 , further comprising a package layer formed on a side of the organic light-emitting unit away from the array substrate, wherein the package layer covers at least the organic light-emitting unit adjacent to an edge of the installation slot.
6. The array substrate according to claim 4 , wherein an edge of the installation slot and a boundary of the functional film layer define the packaging-reserved slot; a shortest distance between the edge of the installation slot and the boundary of the functional film layer is substantially 80 μm to substantially 150 μm.
7. The array substrate according to claim 6 , wherein a shortest distance between the edge of the installation slot and the boundary of the functional film layer is substantially 100 μm.