IP Library Granted Patent US 10,868,165
Granted Patent B2
US 10,868,165 · App. 16/391,670 · Granted Dec 15, 2020

Transistor structure with depletion-mode and enhancement mode-devices

Inventors: Pil Sung Park (Los Angeles, CA); Maher J. Hamdan (Lake Forest, CA); Santosh Sharma (Laguna Niguel, CA); Daniel M. Kinzer (El Segundo, CA)
Assignee: NAVITAS SEMICONDUCTOR LIMITED
H01L29/7787H01L29/0696H01L29/2003H01L29/205H01L29/404H01L29/42356H01L29/7786H01L29/7832
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Quick Facts
Patent No.
US 10,868,165
App. No.
16/391,670
Granted
Dec 15, 2020
Kind
B2
Abstract

A gallium nitride transistor includes a substrate on which a source region, a drain region, a drift region and a gate region are defined. The drift region extends between the source region and the drain region. The gate region includes a combination of enhancement-mode and depletion-mode devices that are positioned across the drift region and are used together to control charge density and mobility of electrons in the drift region with a relatively low threshold voltage (V th ). Enhancement-mode devices are formed using a P-type layer disposed on the substrate and coupled to a gate electrode.

Claims (34)

1. A transistor comprising:

a compound semiconductor substrate;

a source region formed in the substrate;

a drain region formed in the substrate and separated from the source region;

a two-dimensional electron gas (2DEG) layer formed in the substrate and extending continuously from the source region to the drain region in a first direction, and extending between a first isolation region and a second isolation region in a second direction that is perpendicular to the first direction; and

a gate region formed across the 2DEG layer and including at least one depletion-mode structure and at least one enhancement-mode structure arranged sequentially in the second direction.

2. The transistor of claim 1 wherein the at least one enhancement-mode structure includes a p-type layer.

3. The transistor of claim 2 wherein the gate region includes a plurality of depletion-mode structures and a plurality of enhancement-mode structures with each enhancement-mode structure including a separate p-type layer.

4. The transistor of claim 3 wherein the plurality of depletion-mode structures and the plurality of enhancement-mode structures are arranged across the 2DEG layer in an alternating sequence.

5. The transistor of claim 4 further comprising a gate electrode that is electrically coupled to each separate p-type layer of each enhancement-mode structure of the plurality of enhancement-mode structures, and is electrically insulated from the 2DEG layer of each depletion-mode structure of the plurality of depletion-mode structures.

6. The transistor of claim 4 further comprising a gate electrode that is electrically coupled to each separate p-type layer of each enhancement-mode structure of the plurality of enhancement-mode structures, and is electrically coupled to a drift region of the substrate of each depletion-mode structure of the plurality of depletion-mode structures forming a Schottky barrier.

7. The transistor of claim 1 wherein one or more field plates are formed over a drift region and extend from the gate region towards the drain region.

8. The transistor of claim 1 wherein a threshold voltage for the transistor is between −10 Volts and −25 Volts.

9. A transistor comprising:

a compound semiconductor substrate;

a source region formed in the substrate;

a drain region formed in the substrate and separated from the source region in a first direction;

a two dimensional electron gas (2DEG) layer extending continuously from the source region to the drain region; and

a gate region formed across the 2DEG layer and positioned between the source region and the drain region, the gate region including at least one depletion-mode device and at least one enhancement-mode device arranged sequentially in a second direction that is orthogonal to the first direction.

10. The transistor of claim 9 further comprising a gate electrode that extends across the gate region.

11. The transistor of claim 10 wherein the gate region includes a plurality of enhancement-mode devices and wherein each enhancement-mode device of the plurality of enhancement-mode devices includes a p-type layer that is coupled to the gate electrode.

12. The transistor of claim 11 wherein the gate region includes a plurality of depletion-mode devices, each depletion-mode device of the plurality of depletion-mode devices positioned in-between two enhancement-mode devices such that the plurality of depletion-mode devices and the plurality of enhancement-mode devices are arranged in an alternating pattern.

13. The transistor of claim 12 wherein the gate electrode is electrically coupled to each p-type layer of each enhancement-mode device of the plurality of enhancement-mode devices and is electrically insulated from each depletion-mode device of the plurality of depletion-mode devices by a dielectric layer.

14. The transistor of claim 12 wherein the gate electrode is electrically coupled to each p-type layer of each enhancement-mode device and is electrically coupled to each depletion-mode device to form a Schottky barrier.

15. The transistor of claim 9 wherein one or more field plates are formed over a drift region and extend from the gate region towards the drain region.

16. A compound semiconductor transistor comprising:

a substrate;

a source formed in the substrate;

a drain formed in the substrate and separated from the source along a first direction;

a two dimensional electron gas (2DEG) layer extending continuously from the source to the drain; and

a gate formed across the 2DEG layer and positioned between the source and the drain, the gate including a plurality of depletion-mode devices and a plurality of enhancement-mode devices arranged in a second direction that is orthogonal to the first direction and parallel to the substrate.

17. The transistor of claim 16 wherein each enhancement-mode device of the plurality of enhancement-mode devices includes a p-type layer.

18. The transistor of claim 17 wherein the plurality of enhancement-mode devices and the plurality of depletion-mode devices are arranged in an alternating pattern having an enhancement-mode device positioned in-between two adjacent depletion-mode devices.

19. The transistor of claim 17 further comprising a gate electrode that is electrically coupled to the p-type layer of each enhancement-mode device of the plurality of enhancement-mode devices, the gate electrode electrically coupled to the substrate in a region of each depletion-mode device of the plurality of depletion-mode devices to form a plurality of Schottky barriers.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNMENT DOCUMENTS AND THE RECEIVING PARTY'S POSTAL CODE PREVIOUSLY RECORDED AT REEL: 053864 FRAME: 0208. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Mar 9, 2021
From: NAVITAS SEMICONDUCTOR, INC.
To: NAVITAS SEMICONDUCTOR LIMITED
Reel/Frame 056758/0314 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 23, 2020
From: NAVITAS SEMICONDUCTOR, INC.
To: NAVITAS SEMICONDUCTOR LIMITED
Reel/Frame 053864/0208 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 23, 2019
From: PARK, PIL SUNG; HAMDAN, MAHER J.; SHARMA, SANTOSH; KINZER, DANIEL M.
To: NAVITAS SEMICONDUCTOR, INC.
Reel/Frame 048969/0425 →
Continuity (2)
Provisional Application 62661585 · Apr 23, 2018
Related Publication 20190326426A1 · Oct 24, 2019