IP Library Granted Patent US 10,649,042
Granted Patent B2
US 10,649,042 · App. 16/394,338 · Granted May 12, 2020

Packages for coil actuated position sensors

Inventors: Alexander Latham (Harvard, MA); Michael C. Doogue (Bedford, NH); Jason Boudreau (Exeter, NH)
Assignee: Allegro MicroSystems, LLC
G01R33/0094G01N27/90G01R33/0005G01R33/0011G01R33/0017G01R33/0029G01R33/025G01R33/032G01R33/1284H01F5/003H01F2027/348
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Quick Facts
Patent No.
US 10,649,042
App. No.
16/394,338
Granted
May 12, 2020
Kind
B2
Abstract

An apparatus comprises a first substrate and two coils supported by the first substrate and arranged next to each other, the coils configured to each generate a magnetic field which produces eddy currents in and a reflected magnetic field from a conductive target, the two coils arranged so their respectively generated magnetic fields substantially cancel each other in an area between the coils. One or more magnetic field sensing elements are positioned in the area between the coils and configured to detect the reflected magnetic field.

Claims (30)

1. An apparatus comprising:

a first substrate;

two coils supported by the first substrate and arranged next to each other such that a current through each of the coils flows in the same plane, the coils configured to each generate a magnetic field which produces eddy currents in and a reflected magnetic field from a conductive target, the two coils arranged so their respectively generated magnetic fields substantially cancel each other in an area between the coils; and

one or more magnetic field sensing elements positioned in the area between the coils and configured to detect the reflected magnetic field in order to detect one or more of a position, speed, rotational angle, or direction of the conductive target.

2. The apparatus of claim 1 wherein the one or more magnetic field sensing elements comprise a bridge circuit.

3. The apparatus of claim 1 wherein the one or more magnetic field sensing elements comprise at least two pairs of magnetic field sensing elements.

4. The apparatus of claim 3 wherein a center area of the conductive target is adjacent to one of the pairs of magnetic field sensing elements and an edge of the conductive target is adjacent to another of the pairs of magnetic field sensing elements.

5. The apparatus of claim 1 further comprising a second substrate, wherein the one or more magnetic field sensing elements and/or a processing circuit are supported by the second substrate.

6. The apparatus of claim 5 wherein the second substrate is centered in the area between the coils.

7. The apparatus of claim 5 wherein the first and/or second substrates comprise one or more of: a semiconductor material, a glass material, or a ceramic material.

8. An apparatus comprising:

a first substrate;

a conductive trace supported by the first substrate and having a first portion looped in a first direction to form a first coil and a second portion looped in a second direction to form a second coil, wherein the second direction is opposite the first direction and wherein the first and second coils are configured to each generate a magnetic field which produces eddy currents in and a reflected magnetic field from a conductive target, the two coils arranged so their respectively generated magnetic fields substantially cancel each other in an area between the coils; and

one or more magnetic field sensing elements positioned in the area between the coils and configured to detect the reflected magnetic field in order to detect one or more of a position, speed, rotational angle, or direction of the conductive target.

9. The apparatus of claim 8 wherein the one or more magnetic field sensing elements comprise a bridge circuit.

10. The apparatus of claim 8 wherein the one or more magnetic field sensing elements comprise at least two pairs of magnetic field sensing elements.

11. The apparatus of claim 10 wherein a center area of the conductive target is adjacent to one of the pairs of magnetic field sensing elements and an edge of the conductive target is adjacent to another of the pairs of magnetic field sensing elements.

12. The apparatus of claim 8 further comprising a second substrate, wherein the one or more magnetic field sensing elements and/or a processing circuit are supported by the second substrate.

13. The apparatus of claim 12 wherein the second substrate is centered in the area between the coils.

14. The apparatus of claim 12 wherein the first and/or second substrates comprise one or more of: a semiconductor material, a glass material, or a ceramic material.

15. An apparatus comprising:

a first substrate;

two coils supported by the first substrate and arranged next to each other such that a current through each of the coils flows in opposite directions with respect to each other, the coils configured to each generate a magnetic field which produces eddy currents in and a reflected magnetic field from a conductive target, the two coils arranged so their respectively generated magnetic fields substantially cancel each other in an area between the coils; and

one or more magnetic field sensing elements positioned in the area between the coils and configured to detect the reflected magnetic field in order to detect one or more of a position, speed, rotational angle, or direction of the conductive target.

16. The apparatus of claim 15 wherein the one or more magnetic field sensing elements comprise a bridge circuit.

17. The apparatus of claim 15 wherein the one or more magnetic field sensing elements comprise at least two pairs of magnetic field sensing elements.

18. The apparatus of claim 17 wherein a center area of the conductive target is adjacent to one of the pairs of magnetic field sensing elements and an edge of the conductive target is adjacent to another of the pairs of magnetic field sensing elements.

19. The apparatus of claim 15 further comprising a second substrate, wherein the one or more magnetic field sensing elements and/or a processing circuit are supported by the second substrate.

20. The apparatus of claim 19 wherein the second substrate is centered in the area between the coils.

21. The apparatus of claim 19 wherein the first and/or second substrates comprise one or more of: a semiconductor material, a glass material, or a ceramic material.

Assignments (6)
RELEASE OF SECURITY INTEREST IN PATENTS AT REEL 053957/FRAME 0874 Recorded Nov 1, 2023
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
To: ALLEGRO MICROSYSTEMS, LLC
Reel/Frame 065420/0572 →
RELEASE OF SECURITY INTEREST IN PATENTS (R/F 053957/0620) Recorded Jun 22, 2023
From: MIZUHO BANK, LTD., AS COLLATERAL AGENT
To: ALLEGRO MICROSYSTEMS, LLC
Reel/Frame 064068/0360 →
PATENT SECURITY AGREEMENT Recorded Jun 22, 2023
From: ALLEGRO MICROSYSTEMS, LLC
To: MORGAN STANLEY SENIOR FUNDING, INC., AS THE COLLATERAL AGENT
Reel/Frame 064068/0459 →
PATENT SECURITY AGREEMENT Recorded Oct 1, 2020
From: ALLEGRO MICROSYSTEMS, LLC
To: MIZUHO BANK LTD., AS COLLATERAL AGENT
Reel/Frame 053957/0620 →
PATENT SECURITY AGREEMENT Recorded Oct 1, 2020
From: ALLEGRO MICROSYSTEMS, LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 053957/0874 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 26, 2019
From: LATHAM, ALEXANDER; DOOGUE, MICHAEL C.; BOUDREAU, JASON
To: ALLEGRO MICROSYSTEMS, LLC
Reel/Frame 049002/0903 →
Cited By (1)
US 12,552,046