Method of forming electrical contacts in layered structures
The present disclosure is directed to a method of forming a layered structure including a nanostructure layer having nanostructures. The method includes: forming a coating layer on the surface of the nanostructure layer, reflowing the coating layer, depositing one or more conductive plugs into the coating layer, and hardening the coating layer. The one or more conductive plugs each has a first portion configured to be placed in electrical communication with the nanostructure layer and a second portion not covered by the coating layer.
1. A method of forming a layered structure, the method comprising:
forming a coating layer on a surface of a nanostructure layer, wherein the nanostructure layer comprises a plurality of nanostructures;
reflowing the coating layer to transform the coating layer from a first state having a first viscosity to a second state having a second viscosity greater than the first viscosity;
depositing one or more conductive plugs in the coating layer while the coating layer is in the second state, the one or more conductive plugs each having a first portion configured to electrically contact the nanostructure layer and a second portion not covered by the coating layer; and
hardening the coating layer, wherein the reflowing the coating layer comprises exposing the one or more conductive plugs to at least one of heat or a solvent prior to the depositing the one or more conductive plugs in the coating layer.
2. The method of claim 1 , wherein the hardening the coating layer comprises exposing the coating layer to at least one of thermal energy, visible rays, or ultraviolet rays.
3. The method of claim 1 , wherein the one or more conductive plugs each comprises one or more nanoparticles.
4. The method of claim 1 , wherein the hardening the coating layer comprises hardening the coating layer prior to the depositing the one or more conductive plugs in the coating layer.
5. The method of claim 1 , wherein the reflowing the coating layer comprises exposing the coating layer to at least one of the heat or the solvent.
6. The method of claim 1 , wherein the coating layer comprises at least one material selected from the group consisting of: poly(methyl methacrylate), a dissolved powder coating resin, a copolymer of methyl methacrylate, a hydroxyl functional monomer, a carboxylate functional monomer, an amine monomer, or an epoxy monomer.
7. The method of claim 6 , wherein the coating layer comprises at least one material selected from the group consisting of an ultraviolet (UV) curable resin, a blocked isocyanate, or a melamine based cross-linker.
8. The method of claim 1 , wherein the coating layer comprises at least one material selected from the group consisting of an ultraviolet (UV) curable resin, a blocked isocyanate, or a melamine based cross-linker.
9. The method of claim 1 , comprising storing the layered structure for up to 27 weeks after the forming the coating layer and prior to the depositing the one or more conductive plugs in the coating layer.
10. The method of claim 1 , wherein the hardening the coating layer comprises hardening the coating layer to a pencil hardness of up to 2H.
11. The method of claim 1 , wherein:
the coating layer has a center portion and a perimeter portion, and
the depositing the one or more conductive plugs in the coating layer comprises depositing the one or more conductive plugs in the perimeter portion.
12. A method of forming a layered structure, the method comprising:
forming a coating layer on a surface of a nanostructure layer, wherein the nanostructure layer comprises a plurality of nanostructures;
coating one or more conductive plugs with a solvent configured to change a viscosity of the coating layer upon contact with the one or more conductive plugs;
depositing the one or more conductive plugs in the coating layer after the coating the one or more conductive plugs with the solvent, the one or more conductive plugs each having a first portion configured to electrically contact the nanostructure layer and a second portion not covered by the coating layer; and
hardening the coating layer.
13. The method of claim 12 , wherein the depositing the one or more conductive plugs in the coating layer comprises applying a pressure to the one or more conductive plugs to embed the one or more conductive plugs in the coating layer.
14. The method of claim 12 , wherein the solvent increases the viscosity of the coating layer.
15. The method of claim 12 , comprising:
heating the one or more conductive plugs prior to the depositing the one or more conductive plugs in the coating layer.
16. The method of claim 12 , comprising:
removing the solvent after the depositing the one or more conductive plugs in the coating layer.