Tape wiring board and semiconductor device
View Patent ↗A tape wiring board includes an insulating film on which a semiconductor chip is mounted and metal layers formed on both principal surfaces, respectively, of the insulating film. That one of the metal layers which is formed on a first surface that is one principal surface of the insulating film and on which the semiconductor chip is mounted has a first electrode that is placed near substantially the center of a region on the first surface where the semiconductor chip is mounted.
1. A tape wiring board comprising:
an insulating film on which a semiconductor chip is mounted; and
a plurality of metal layers, each of which is formed on a first surface that is one principal surface of the insulating film and on which the semiconductor chip is mounted, having a plurality of first electrodes, each of which is placed near substantially a center of a region on the first surface where the semiconductor chip is mounted,
wherein the plurality of metal layers include a plurality of front-surface wires,
wherein the plurality of first electrodes are arranged side by side in a direction substantially diagonal to a direction along which the plurality of the front-surface wires extend.
2. The tape wiring board according to claim 1 , further comprising a plurality of vias, each of which is bored through the insulating film, and
another plurality of metal layers, each of which is formed on a second surface that is the other principal surface of the insulating film, having a plurality of back-surface wires, respectively,
wherein the plurality of first electrodes are connected to the plurality of back-surface wires via the plurality of vias, respectively.
3. The tape wiring board according to claim 1 , wherein a plurality of ends of the plurality of front-surface wires are located near substantially the center of the region on the first surface where the semiconductor chip is mounted.
4. The tape wiring board according to claim 1 , wherein the plurality of front-surface wires are arranged side by side in a predetermined direction, and
the ends of adjacent ones of the plurality of front-surface wires are placed out of alignment with each other in a direction substantially perpendicular to the predetermined direction.
5. The tape wiring board according to claim 1 , wherein the plurality of front-surface wires comprise
three or more front-surface wires that are arranged side by side in a predetermined direction, and
adjacent ones of the ends of the plurality of front-surface wires are placed out of alignment with each other in a direction substantially perpendicular to the predetermined direction.
6. A semiconductor device comprising:
a semiconductor chip; and
an insulating film on which the semiconductor chip is mounted,
wherein the semiconductor chip has a plurality of semiconductor connection terminals located near substantially a center of a surface of the semiconductor chip that faces the insulating film,
the semiconductor device further comprises a tape wiring board including a plurality of metal layers formed on a first surface that is one principal surface of the insulating film and on which the semiconductor chip is the plurality of metal layers including a plurality of first electrodes that are located near substantially a center of a region on the first surface where the semiconductor chip is mounted is the plurality of first electrodes respectively connected to the plurality of semiconductor connection terminals,
wherein the plurality of metal layers include a plurality of front-surface wires,
wherein the plurality of first electrodes are arranged side by side in a direction substantially diagonal to a direction along which the plurality of the front-surface wires extend.
7. The semiconductor device according to claim 6 , further comprising a plurality of vias, each of which is bored through the insulating film, and
another plurality of metal layers, each of which is formed on a second surface that is the other principal surface of the insulating film, having a plurality of back-surface wires, respectively,
wherein the plurality of first electrodes are connected to the plurality of back-surface wires the plurality of vias, respectively.
8. The semiconductor device according to claim 7 , wherein a plurality of ends of the plurality of front-surface wires are located near substantially the center of the region on the first surface where the semiconductor chip is mounted.
9. The semiconductor device according to claim 6 , wherein a plurality of ends of the plurality of front-surface wires are located near substantially the center of the region on the first surface where the semiconductor chip is mounted.
10. The semiconductor device according to claim 6 , wherein the plurality of front-surface wires are arranged side by side in a predetermined direction, and
the ends of adjacent ones of the plurality of front-surface wires are placed out of alignment with each other in a direction substantially perpendicular to the predetermined direction.
11. The semiconductor device according to claim 6 , wherein the plurality of semiconductor connection terminals are in contact with the plurality of first electrodes, respectively, and are placed within the plurality of first electrodes, respectively.
12. The semiconductor device according to claim 6 , wherein the plurality of semiconductor connection terminals are placed so that parts of the plurality of semiconductor connection terminals make contact with the plurality of first electrodes, respectively.
13. The semiconductor device according to claim 6 , wherein the plurality of front-surface wires comprise
three or more front-surface wires that are arranged side by side in a predetermined direction, and
adjacent ones of the ends of the plurality of front-surface wires are placed out of alignment with each other in a direction substantially perpendicular to the predetermined direction.