THERMODYNAMIC RAM TECHNOLOGY STACK
A thermodynamic RAM technology stack, two or more memristors or pairs of memristors comprising AHaH (Anti-Hebbian and Hebbian) computing components, and one or more AHaH nodes composed of such memristor pairs to that forms at least a portion of the thermodynamic RAM technology stack. The levels of the thermodynamic-RAM technology stack include the memristor, a Knowm synapse, an AHaH Node, a kT-RAM, kT-RAM instruction set, a sparse spike encoding, a kT-RAM emulator, and a SENSE Server.
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10 . A thermodynamic RAM application server, comprising:
a collection of one or more modules comprising:
at least one machine learning module that executes thermodynamic RAM instruction set calls;
at least one spoke encoding algorithm;
at least one spoke pattern buffer; and
at least one spike stream joiner.
11 . The thermodynamic RAM application server of claim 10 , wherein said thermodynamic RAM application server runs on a Linux operating system.
12 . The thermodynamic RAM application server of claim 10 wherein said thermodynamic RAM is integrated with a CPU such that a thermodynamic RAM instruction set is specified as a part of a CPU instruction set.
13 . The thermodynamic RAM application server of claim 12 wherein said thermodynamic RAM is integrated with said CPU via a north bridge.
14 . The thermodynamic RAM application server of claim 12 wherein said thermodynamic RAM is integrated with said CPU via a south bridge.
15 . The thermodynamic RAM application server of claim 12 wherein said thermodynamic RAM is integrated with said CPU via a PCI bus.
16 . The thermodynamic RAM application server of claim 12 wherein said thermodynamic RAM is integrated with said CPU via an LPR bus.