IP Library Granted Patent US 10,943,945
Granted Patent B2
US 10,943,945 · App. 16/403,452 · Granted Mar 9, 2021

Light fixture with dynamically controllable light distribution

Inventors: Frederic Stephane Diana (Santa Clara, CA); Yifeng Qiu (San Jose, CA); Michael Wasilko (San Jose, CA); Nazila Soleimani (San Jose, CA); Jeroen Den Breejen (San Jose, CA); Alan Andrew McReynolds (San Jose, CA); Gregory Donald Guth (San Jose, CA)
Assignee: Lumileds LLC
H01L27/153F21K9/61F21K9/65H05B45/10H05K1/118
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Quick Facts
Patent No.
US 10,943,945
App. No.
16/403,452
Granted
Mar 9, 2021
Kind
B2
Abstract

A flexible printed circuit board and method of fabrication are disclosed. The flexible printed circuit board has a flexible body with multiple segments. Each segment has multiple body contacts that are electrically isolated from body contacts of each other segment. The flexible printed circuit further has multiple flexible legs in which each leg extends from a different segment and contains multiple leg contacts disposed proximate to a distal end of the leg from the body. Each leg contact is connected with a different body contact of the leg. The flexible printed circuit board is formed from a multilayer structure that includes: a dielectric layer, a metal layer adjacent to the dielectric layer, and a solder mask layer adjacent to the metal layer, the solder mask layer exposing portions of the metal layer to form the body contacts.

Claims (68)

1. A flexible printed circuit board comprising:

a flexible body comprising a plurality of segments, each segment comprising a plurality of body contacts that are electrically isolated from the plurality of body contacts of each other segment; and

a plurality of flexible legs, each leg:

adjacent to another of the legs,

extending from a different segment of the plurality of segments, and

comprising a plurality of leg contacts disposed more proximate to a distal end of the leg from the flexible body than to the flexible body, each leg contact coupled with a different body contact of the segment from which the leg extends.

2. The flexible printed circuit board of claim 1 , wherein:

the flexible printed circuit board is formed from a multilayer structure that comprises:

a dielectric layer,

a metal layer adjacent to the dielectric layer, and

a solder mask layer adjacent to the metal layer, the solder mask layer exposing portions of the metal layer to form the body contacts.

3. The flexible printed circuit board of claim 2 , wherein the multilayer structure further comprises:

an adhesive layer configured to adhere the structure to a material contacting the adhesive layer.

4. The flexible printed circuit board of claim 2 , wherein:

the solder mask layer exposes portions of the metal layer to form the leg contacts.

5. The flexible printed circuit board of claim 2 , wherein:

the dielectric layer exposes portions of the metal layer to form the leg contacts.

6. The flexible printed circuit board of claim 1 , wherein:

each segment comprises multiple plurality of body contacts that are electrically isolated from each other.

7. The flexible printed circuit board of claim 1 , wherein:

the flexible printed circuit board is formed from a multilayer structure that comprises:

an adhesive layer configured to adhere the structure to a material contacting the adhesive layer;

a solder mask layer configured to expose, for each segment, the plurality of body contacts and the plurality of leg contacts of the segment, and

a plurality of alternating dielectric and metal layers disposed between the adhesive layer and solder mask layer, each metal layer providing, for each segment, electrical connection between one of the plurality of the body contacts and a corresponding plurality of leg contacts of the segment, each metal layer electrically isolated from each other metal layer.

8. The flexible printed circuit board of claim 7 , wherein:

the solder mask layer exposes portions of each metal layer to form the leg contacts.

9. The flexible printed circuit board of claim 8 , wherein:

the dielectric layer exposes portions of each metal layer to form the leg contacts.

10. The flexible printed circuit board of claim 1 , wherein for each segment:

each leg of the segment comprises secondary leg contacts disposed more proximate to the body than to the leg contacts.

11. The flexible printed circuit board of claim 1 , wherein:

each segment comprises multiple plurality of body contacts and multiple plurality of leg contacts, and

for each segment, each plurality of body contacts of the segment is in electrical contact with a corresponding plurality of leg contacts of the segment, and each plurality of body contacts and corresponding plurality of leg contacts of the segment are electrically isolated from each other plurality of body contacts and corresponding plurality of leg contacts of the segment.

12. The flexible printed circuit board of claim 1 , wherein:

each leg further comprises a plurality of test contacts disposed between the leg contacts of the leg and the segment from which the leg extends.

13. The flexible printed circuit board of claim 1 , wherein:

a different leg extends from every segment of the body.

14. A method of fabricating a flexible printed circuit, the method comprising:

forming a metal layer on a flexible dielectric layer;

applying a solder mask over the metal layer, portions of the metal layer exposed through the solder mask forming body contacts; and

applying an adhesive to the dielectric layer,

the flexible printed circuit comprising a flexible body and a plurality of flexible legs extending from the flexible body, the flexible body comprising a plurality of segments, each of the legs extending from a different segment of the plurality of segments, each segment comprising the body contacts, the body contacts of each segment electrically isolated from the body contacts of each other segment, and the leg comprising leg contacts disposed more proximate to a distal end of the leg from the flexible body than to the flexible body, and

each leg being adjacent to another of the legs.

15. The method of claim 14 , wherein:

portions of the metal layer exposed through the solder mask form the leg contacts.

16. The method of claim 14 , further comprising:

removing portions of the dielectric layer to expose the metal layer and form the leg contacts prior to applying the solder mask.

17. The method of claim 14 , wherein:

the adhesive is applied to the dielectric layer after formation of the body contacts.

18. A flexible printed circuit comprising:

a body comprising a plurality of segments and a plurality of body contacts, each segment comprising at least one body contact of the plurality of body contacts; and

a flexible leg:

extending from the body, and

comprising multiple sets of leg contacts disposed more proximate to a distal end of the leg from the body than to the body, each set of leg contacts having a plurality of leg contacts that are electrically isolated, each set of leg contacts associated with:

a body contact of a different segment depending upon whether each segment contains a single body contact, and

a different set of body contacts within a particular segment depending upon whether the particular segment comprises multiple sets of body contacts, each set of body contacts having multiple body contacts.

19. The flexible printed circuit of claim 18 , wherein at least one of:

the sets of leg contacts is associated with different segments, or

the sets of leg contacts is associated with different sets of body contacts within the particular segment.

20. The flexible printed circuit board of claim 18 , wherein:

the flexible printed circuit board is formed from a multilayer structure that comprises:

an adhesive layer to attach the flexible printed circuit board to an underlying surface,

a metal layer to provide electrical connection between the body and leg contacts,

a dielectric layer adjacent to the metal layer, the adhesive layer attached to a portion of the dielectric layer, and

a solder mask layer configured to expose the metal layer to form the plurality of body contacts.

21. The flexible printed circuit board of claim 20 , wherein:

the metal layer is exposed through the dielectric layer to form the leg contacts.

22. The flexible printed circuit board of claim 18 , wherein each leg is adjacent to another of the legs.

Assignments (8)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2025
From: LUMILEDS LLC
To: LUMILEDS SINGAPORE PTE. LTD.
Reel/Frame 071888/0086 →
RELEASE OF SECURITY INTEREST Recorded Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
SECURITY INTEREST Recorded Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
PATENT SECURITY AGREEMENT Recorded Dec 9, 2022
From: LUMILEDS, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 062114/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE RECEIVING PARTY PREVIOUSLY RECORDED ON REEL 055091 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT. Recorded Oct 12, 2021
From: DIANA, FREDERIC STEPHANE; QIU, YIFENG; WASILKO, MICHAEL; SOLEIMANI, NAZILA; DEN BREEJEN, JEROEN; MCREYNOLDS, ALAN ANDREW; GUTH, GREGORY DONALD
To: LUMILEDS HOLDING B.V.
Reel/Frame 057775/0797 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2021
From: LUMILEDS HOLDING B.V.
To: LUMILEDS LLC
Reel/Frame 055071/0975 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME TO "LUMILEDS HOLDING B.V." THAT WAS INCORRECTLY FILED PREVIOUSLY RECORDED AT REEL: 054094 FRAME: 0525. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jan 25, 2021
From: DIANA, FREDERIC STEPHANE; QIU, YIFENG; WASILKO, MICHAEL; SOLEIMANI, NAZILA; DEN BREEJEN, JEROEN; MCREYNOLDS, ALAN ANDREW; GUTH, GREGORY DONALD
To: LUMILEDS LLC
Reel/Frame 055091/0087 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2020
From: DIANA, FREDERIC STEPHANE; QIU, YIFENG; WASILKO, MICHAEL; SOLEIMANI, NAZILA; BREEJEN, JEROEN DEN; MCREYNOLDS, ALAN ANDREW; GUTH, GREGORY DONALD
To: LUMILEDS LLC
Reel/Frame 054094/0525 →