Cooling system for high density heat loads

1. A cooling system comprising:

a primary cooling module, the primary cooling module supplying refrigerant to a circuit including a thermal load;

a secondary cooling module, the secondary cooling module providing a supplemental flow of refrigerant to the circuit upon detection of a deficiency of the primary cooling module; and

at least one valve disposed between the primary cooling module and the circuit to prevent refrigerant flow therebetween,

wherein the secondary cooling module is configured to transition from a standby mode of operation to an online mode of operation and the primary cooling module is deactivated in response to detection of the deficiency of the primary cooling module.

2. The cooling system of claim 1 wherein the primary cooling module further comprises:

a first pump for supplying refrigerant, the first pump supplying refrigerant to the circuit at a first temperature; and

a first condenser for receiving refrigerant from the circuit, the refrigerant received by the first condenser being at a higher temperature than the first temperature.

3. The cooling system of claim 2 wherein the secondary cooling module further comprises:

a second pump for supplying refrigerant, the second pump supplying refrigerant to the circuit at the first temperature; and

a second condenser for receiving refrigerant from the circuit, the refrigerant received by the second condenser having a higher temperature than the first temperature.

4. The cooling system of claim 3 , the at least one valve further comprising:

an inlet valve for controlling fluid flow between an inlet of the circuit and one of the primary cooling module and the secondary cooling module; and

an outlet valve for controlling fluid flow between an outlet of the circuit and one of the primary cooling module and the secondary cooling module.

5. The cooling system of claim 1 , the at least one valve further comprising:

an inlet valve for controlling fluid flow between an inlet of the circuit and one of the primary cooling module and the secondary cooling module; and

an outlet valve for controlling fluid flow between an outlet of the circuit and one of the primary cooling module and the secondary cooling module.

6. A cooling system comprising:

a plurality of primary cooling modules, the primary cooling modules circulating refrigerant through a respective one of a plurality of thermal loads;

a secondary cooling module, the secondary cooling module selectively providing a supplemental flow of refrigerant through a load associated with a primary cooling module for which a fault has been detected; and

at least one valve disposed between each of the plurality of primary cooling modules and the load to prevent refrigerant flow therebetween,

wherein the secondary cooling module is configured to transition from a standby mode of operation to an online mode of operation and the primary cooling module for which a fault has been detected is deactivated in response to detection of the fault of the primary cooling module for which a fault has been detected.

7. The cooling system of claim 6 wherein each primary cooling module further comprises:

a plurality of first pumps for circulating refrigerant, the plurality of first pumps supplying refrigerant at a first temperature to the respective loads associated with the respective primary cooling modules; and

a first condenser for receiving refrigerant from the respective loads associated with the respective primary cooling modules, the refrigerant received by the respective condensers being at a higher temperature than the first temperature.

8. The cooling system of claim 7 wherein the secondary cooling module further comprises:

a second pump for supplying refrigerant, the second pump supplying refrigerant at the first temperature to the load associated with the primary cooling module for which the fault has been detected; and

a second condenser for receiving refrigerant from the load associated with the primary cooling module for which the fault has been detected, the refrigerant received by the second condenser having a temperature higher than the first temperature.

9. The cooling system of claim 8 , the at least one valve further comprising:

a plurality of inlet valves associated with a respective primary cooling module for controlling fluid flow between an inlet of the respective load and a respective primary cooling module and the secondary cooling module; and

an plurality of outlet valves associated with a respective primary cooling module for controlling fluid flow between an outlet of the respective load and a respective primary cooling module and the secondary cooling module.

10. A method for providing redundant cooling in a cooling system comprising:

providing a primary cooling module having a circuit, the primary cooling module providing cooling fluid to a thermal load;

providing a secondary cooling module;

arranging at least one valve between the primary cooling module and the load to prevent refrigerant flow therebetween;

initiating operation of the secondary cooling module upon detection of a fault in the primary cooling module;

inserting the secondary cooling module into the circuit, the secondary cooling module providing cooling fluid to the thermal load;

deactivating the primary cooling module; and

transitioning the secondary cooling module from a standby mode of operation to an online mode of operation and the primary cooling module is deactivated in response to detection of the fault of the primary cooling module.

11. The method of claim 10 further comprising removing the primary cooling module from the circuit.

12. The method of claim 10 further comprising returning the cooling system to normal operation comprising:

transitioning the primary cooling module from a standby mode of operation to an online mode of operation when the fault is no longer detected;

inserting the primary cooling module into the circuit for providing cooling fluid to the thermal load; and

transitioning the secondary cooling module to the standby mode of operation.

13. The method of claim 12 further comprising removing the secondary cooling module from the circuit.