Foldable array substrate, preparation method thereof and display device
The present application provides a foldable array substrate, a preparation method thereof and a display device. The foldable array substrate includes a base substrate, a gate metal layer disposed on one side of the base substrate, a source-drain metal layer disposed on the side of the gate metal layer opposite to the base substrate, and an insulating layer disposed between the gate metal layer and the source-drain metal layer. A plurality of holes are disposed on the foldable array substrate, and the holes are disposed between adjacent pixel units of a plurality of pixel units, and extend from the side of the insulating layer opposite to the base substrate toward the base substrate.
1. A foldable array substrate, comprising: a base substrate, a gate metal layer disposed on one side of the base substrate, a source-drain metal layer disposed on the side of the gate metal layer opposite to the base substrate, and an insulating layer disposed between the gate metal layer and the source-drain metal layer, wherein
the gate metal layer comprises a gate line, the source-drain metal layer comprises a data line, and the gate line is arranged in an intersecting manner with the data line to define a plurality of pixel units on the base substrate,
the foldable array substrate further comprising a plurality of holes, which are disposed between adjacent pixel units of the plurality of pixel units, and extend from the side of the insulating layer opposite to the base substrate toward the base substrate.
2. The foldable array substrate according to claim 1 , further comprising a preset punching area between two rows of pixel units adjacent to each other and/or between two columns of pixel units adjacent to each other, wherein the plurality of holes are disposed in the preset punching area.
3. The foldable array substrate according to claim 2 , wherein the width of the preset punching area is in the range of 2 micrometers to 10 micrometers.
4. The foldable array substrate according to claim 1 , wherein the plurality of holes at least comprise a first type of holes, the first type of holes do not intersect with the metal of each metal layer of the foldable array substrate.
5. The foldable array substrate according to claim 4 , wherein the first type of holes extend from one side of the insulating layer opposite to the base substrate to the base substrate.
6. The foldable array substrate according to claim 4 , further comprising a buffer layer disposed on the side of the base substrate and in contact with the base substrate, wherein the first type of holes extend from one side of the insulating layer opposite to the base substrate toward the base substrate to the buffer layer.
7. The foldable array substrate according to claim 1 , wherein the plurality of holes further comprises a second type of holes, the second type of holes extend from one side of the insulating layer opposite to the base substrate to a metal wiring in the gate metal layer.
8. The foldable array substrate according to claim 1 , further comprising at least two rows of pixel units adjacent to each other, wherein the plurality of holes comprise a first hole-slot extending along a length direction of the gate line between the two rows of pixel units.
9. The foldable array substrate according to claim 8 , further comprising a buffer layer disposed on the side of the base substrate and in contact with the base substrate, wherein the first hole-slot extends from one side of the insulating layer opposite to the base substrate to the buffer layer.
10. The foldable array substrate according to claim 9 , wherein the plurality of holes further comprise a plurality of holes extending along a length direction of the data line.
11. The foldable array substrate according to claim 10 , wherein the plurality of holes extending along a length direction of the data line extend from one side of the insulating layer opposite to the base substrate to the buffer layer.
12. The foldable array substrate according to claim 1 , further comprising at least two columns of pixel units adjacent to each other, wherein the plurality of holes comprise a second hole-slot extending along a length direction of the data line between the two columns of pixel units.
13. The foldable array substrate according to claim 12 , wherein the second hole-slot comprises a portion extending from one side of the insulating layer opposite to the base substrate to the buffer layer and a portion extending to the gate line.
14. The foldable array substrate according to claim 1 , further comprising a capacitor layer disposed between the gate metal layer and the source-drain metal layer,
wherein the insulating layer comprises a first insulating layer disposed between the capacitor layer and the source-drain metal layer, and a second insulating layer disposed between the capacitor layer and the gate metal layer.
15. The foldable array substrate according to claim 1 , wherein the insulating layer is made of inorganic silicon material.
16. The foldable array substrate according to claim 15 , wherein the inorganic silicon material comprises at least one of silicon oxide and silicon nitride.
17. An OLED display device, comprising a foldable array substrate, wherein the foldable array substrate comprises:
a base substrate, a gate metal layer disposed on one side of the base substrate, a source-drain metal layer disposed on the side of the gate metal layer opposite to the base substrate, and an insulating layer disposed between the gate metal layer and the source-drain metal layer, wherein
the gate metal layer comprises a gate line, the source-drain metal layer comprises a data line, and the gate line is arranged in an intersecting manner with the data line to define a plurality of pixel units on the base substrate,
the foldable array substrate further comprising a plurality of holes, which are disposed between adjacent pixel units of the plurality of the pixel units, and extend from the side of the insulating layer opposite to the base substrate toward the base substrate.
18. A preparation method of a foldable array substrate, comprising:
forming an active layer pattern, a gate metal layer pattern, and an insulating layer on one side of a base substrate, wherein the gate metal layer pattern comprises a gate line; and
forming a plurality of holes extending from one side of the insulating layer opposite to the base substrate toward the base substrate, wherein the plurality of holes are formed between adjacent pixel units of the plurality of pixel units.
19. The preparation method of the foldable array substrate according to claim 18 , wherein the forming a plurality of holes extending from one side of the insulating layer opposite to the base substrate toward the base substrate comprising:
forming a first hole-slot extending along a length direction of the gate line between at least one pair of two rows of pixel units adjacent to each other.
20. The preparation method of the foldable array substrate according to claim 19 , further comprising forming a source-drain metal layer pattern after the forming a plurality of holes extending from one side of the insulating layer opposite to the base substrate toward the base substrate, wherein the source-drain metal layer pattern comprises a data line,
wherein the forming a plurality of holes extending from one side of the insulating layer opposite to the base substrate toward the base substrate further comprises:
forming a second hole-slot extending along a length direction of the date line between at least one pair of two columns of pixel units adjacent to each other.