Thermoelectric module with integrated printed circuit board

1. A thermoelectric system comprising:

a printed circuit board comprising a plurality of electrically conductive first tabs at a surface of the printed circuit board; and

at least one thermoelectric device mechanically coupled to the printed circuit board, the at least one thermoelectric device comprising:

a thermally conductive first plate;

a thermally conductive second plate comprising a first portion extending beyond a perimeter of the first plate and over an edge of the printed circuit board and over two first tabs of the plurality of first tabs, the first portion comprising two electrically conductive second tabs, each of the two second tabs in mechanical and electrical communication with a corresponding first tab of the two first tabs; and

a plurality of thermoelectric elements in thermal communication with and in a region between the first plate and the second plate.

2. The system of claim 1 , wherein the first plate of the at least one thermoelectric device does not extend over the surface of the printed circuit board.

3. The system of claim 1 , wherein the printed circuit board comprises a plurality of electrical conduits in electrical communication with the plurality of first tabs, the plurality of electrical conduits configured to provide electrical power to the at least one thermoelectric device.

4. The system of claim 1 , wherein the printed circuit board has a first thickness and the at least one thermoelectric device has a second thickness larger than the first thickness.

5. The system of claim 1 , further comprising a gap between the edge of the printed circuit board and a first edge of the first plate of the at least one thermoelectric device, the system further comprising a compound within the gap and mechanically coupled to the edge of the printed circuit board and the first edge of the at least one thermoelectric device, the compound is configured to strengthen a mechanical coupling of the printed circuit board with the at least one thermoelectric device and to at least partially seal the two first tabs and the two second tabs that are in mechanical and electrical communication with two first tabs.

6. The system of claim 5 , wherein at least one of the printed circuit board and the first portion of the second plate comprises at least two trenches configured to facilitate capillary flow of the compound from the gap to an area between the first portion of the second plate and the surface of the printed circuit board.

7. The system of claim 6 , wherein the at least two trenches are on the printed circuit board and extend at least partially around the two first tabs and/or the at least two trenches are on the first portion of the second plate and extend at least partially around the two second tabs.

8. The system of claim 5 , further comprising a coating extending over the surface of the printed circuit board and the first portion of the second plate of the at least one thermoelectric device, the coating configured to strengthen a mechanical coupling of the printed circuit board with the at least one thermoelectric device and to at least partially seal the two first tabs and the two second tabs that are in mechanical and electrical communication with the two first tabs.

9. The system of claim 1 , wherein the printed circuit board and the at least one thermoelectric device are substantially planar with one another.

10. The system of claim 1 , wherein the at least one thermoelectric device extends from the printed circuit board in a same direction as at least one other thermoelectric device extending from the printed circuit board, the at least one other thermoelectric device in mechanical and electrical communication with the printed circuit board, wherein the at least one thermoelectric device and the at least one other thermoelectric device extend from a same side of the printed circuit board.

11. The system of claim 10 , wherein the at least one thermoelectric device is in series electrical communication with the at least one other thermoelectric device.

12. The system of claim 1 , wherein the printed circuit board comprises a plurality of electrical conduits in electrical communication with the first tabs to provide electrical power to the at least one thermoelectric device.

13. The system of claim 1 , wherein the at least one thermoelectric device is in thermal communication with a first heat spreader and a second heat spreader.

14. The system of claim 13 , wherein an insulator plate is positioned between the first and second heat spreaders, the insulator plate having a hole configured to hold the at least one thermoelectric device.

15. The system of claim 13 , wherein the first and second heat spreaders bound a region between the first and second heat spreaders, the at least one thermoelectric device wholly within the region.

16. The system of claim 13 , wherein the printed circuit board comprises one or more holes configured to mate with corresponding one or more protrusions of a heat exchanger in thermal communication with the first heat spreader or the second heat spreader.

17. The system of claim 1 , wherein the second plate comprises an etched line extending at least partially across the second plate to thermally insulate at least a portion of the second plate.