IP Library Granted Patent US 10,750,250
Granted Patent B1
US 10,750,250 · App. 16/418,262 · Granted Aug 18, 2020

Grounding assembly for optical modules

Inventors: Charlie Wesly Parker (Richardson, TX); Stewart Henry Hiebert (Lake Dallas, TX); Casey Daniels (Richardson, TX)
Assignee: Fujitsu Limited
H04Q1/04H01R4/48H01R4/66H01R43/26H05K7/1427
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Quick Facts
Patent No.
US 10,750,250
App. No.
16/418,262
Granted
Aug 18, 2020
Kind
B1
Abstract

A grounding clip for a plug-in universal (PIU) module enclosure in an optical network element includes a first wing portion shaped to be positioned between and in contact with a first side of a faceplate of the network element and the chassis, a second wing portion shaped to be positioned between and in contact with a second side of the faceplate and the chassis, and a center portion shaped to extend over and to be in contact with the PIU module enclosure when the grounding assembly is installed in the network element. The grounding clip includes an opening through which a fastener electrically and mechanically couples the grounding clip to a printed circuit board (PCB) and to the chassis when installed, the PCB being installed within the chassis and configured to be communicably coupled to a PIU module when the PIU module is installed in the PIU module enclosure.

Claims (62)

1. A network element in an optical transport network, comprising:

a plug-in universal (PIU) module enclosure into which a PIU module is received during installation of the PIU module in the network element;

a chassis within which the PIU module enclosure is installed in the network element;

a printed circuit board (PCB) installed within the chassis and configured to be communicably coupled to the PIU module when the PIU module is installed in the network element;

a faceplate mechanically coupled to the PCB through which the PIU module is inserted into the PIU module enclosure when installing the PIU module in the network element; and

a grounding assembly, comprising:

a grounding clip, comprising:

a first wing portion positioned between a first side of the faceplate and the chassis and in contact with the first side of the faceplate and the chassis when the grounding assembly is installed in the network element;

a second wing portion positioned between a second side of the faceplate and the chassis and in contact with the second side of the faceplate and the chassis when the grounding assembly is installed in the network element, the second side of the faceplate being opposite the first side of the faceplate; and

a center portion between the first wing portion and the second wing portion shaped to extend over and to be in contact with at least a portion of the PIU module enclosure when the grounding assembly is installed in the network element; and

a fastener to electrically and mechanically couple the grounding clip to the PCB when the grounding assembly is installed in the network element.

2. The network element of claim 1 , wherein:

the grounding clip is fashioned as a single piece of a metal or a metal alloy exhibiting spring properties;

the first wing portion is shaped to snap onto the first side of the faceplate and exert a force on the chassis to hold the grounding clip in position to make contact with the chassis; and

the second wing portion is shaped to snap onto the second side of the faceplate and exert a force on the chassis to hold the grounding clip in position to make contact with the chassis.

3. The network element of claim 2 , wherein

the first wing portion extends away from a first side of the center portion in a direction toward the faceplate at an angle of between 70 and 80 degrees with respect to a line running across the center portion between the first and second wing portions; and

the second wing portion extends away from a second side of the center portion opposite the first side of the center portion in a direction toward the faceplate at an angle of between 70 and 80 degrees with respect to the line running across the center portion between the first and second wing portions.

4. The network element of claim 1 , wherein the faceplate is fashioned from a plastic material.

5. The network element of claim 1 , wherein the center portion comprises one or more perforations that are aligned with respective ventilation perforations on the PIU module enclosure when the PIU module enclosure is installed in the network element.

6. The network element of claim 5 , wherein:

the PIU module enclosure is a PIU module enclosure of a first enclosure type; and

the center portion further comprises one or more additional perforations that are aligned with respective ventilation perforations on a PIU module enclosure of a second enclosure type when the PIU module enclosure of the second enclosure type is installed in the network element.

7. The network element of claim 1 , wherein the center portion is shaped to extend over and to be in contact with greater than fifty percent of a surface of the PIU module enclosure when the grounding assembly is installed in the network element.

8. The network element of claim 1 , further comprising an additional PIU module enclosure into which an additional PIU module is received during installation of the additional PIU module in the network element, wherein the center portion is shaped to extend over and to be in contact with the at least a portion of the PIU module enclosure and at least a portion of the additional PIU module enclosure when the grounding assembly is installed in the network element.

9. The network element of claim 1 , wherein the fastener comprises one or more screws shaped to pass through respective openings in the grounding clip and the PCB and to make contact with the chassis.

10. A grounding clip for a plug-in universal (PIU) module enclosure, comprising:

a first wing portion shaped to be positioned between a first side of a faceplate of an optical network element and a chassis within which the PIU module enclosure is installed in the network element such that the first wing portion is in contact with the first side of the faceplate and the chassis when the grounding clip is installed in the network element;

a second wing portion shaped to be positioned between a second side of the faceplate and the chassis such that the second wing portion is in contact with the second side of the faceplate and the chassis when the grounding clip is installed in the network element, the second side of the faceplate being opposite the first side of the faceplate;

a center portion between the first wing portion and the second wing portion shaped to extend over and to be in contact with at least a portion of the PIU module enclosure when the grounding assembly is installed in the network element; and

an opening through which a fastener electrically and mechanically couples the grounding clip to a printed circuit board (PCB) and to the chassis when the grounding assembly is installed in the network element, the PCB being installed within the chassis and configured to be communicably coupled to a PIU module when the PIU module is installed in the PIU module enclosure.

11. The grounding clip of claim 10 , wherein:

the grounding clip is fashioned as a single piece of a metal or a metal alloy exhibiting spring properties;

the first wing portion is shaped to snap onto the first side of the faceplate and exert a force on the chassis to hold the grounding clip in position to make contact with the chassis; and

the second wing portion is shaped to snap onto the second side of the faceplate and exert a force on the chassis to hold the grounding clip in position to make contact with the chassis.

12. The grounding clip of claim 11 , wherein

the first wing portion extends away from a first side of the center portion in a direction toward the faceplate at an angle of between 70 and 80 degrees with respect to a line running across the center portion between the first and second wing portions; and

the second wing portion extends away from a second side of the center portion opposite the first side of the center portion in a direction toward the faceplate at an angle of between 70 and 80 degrees with respect to the line running across the center portion between the first and second wing portions.

13. The grounding clip of claim 10 , wherein the center portion comprises one or more perforations that are aligned with respective ventilation perforations on the PIU module enclosure when the PIU module enclosure and the grounding clip are installed in the network element.

14. The grounding clip of claim 10 , wherein the center portion comprises:

one or more perforations that are aligned with respective ventilation perforations on a PIU module enclosure of a first enclosure type when the PIU module enclosure of the first enclosure type and the grounding clip are installed in the network element; and

one or more perforations that are aligned with respective ventilation perforations on a PIU module enclosure of a second enclosure type when the PIU module enclosure of the second enclosure type and the grounding clip are installed in the network element.

15. The grounding clip of claim 10 , wherein the center portion is shaped to extend over and to be in contact with greater than fifty percent of a surface of the PIU module enclosure when the PIU module enclosure and the grounding assembly are installed in the network element.

16. The grounding clip of claim 10 , wherein the center portion is shaped to extend over and to be in contact with the at least a portion of the PIU module enclosure and at least a portion of an additional PIU module enclosure when the PIU module enclosure, the additional PIU module enclosure, and the grounding assembly are installed in the network element.

17. A method for installing a grounding assembly for a plug-in universal (PIU) module in a chassis of a network element, comprising:

installing, in the chassis, a printed circuit board (PCB) configured to be communicably coupled to the PIU module when the PIU module is installed in the network element;

installing a PIU module enclosure within the chassis;

mechanically coupling a faceplate to the PCB and to the PIU module enclosure through which the PIU module is inserted into the PIU module enclosure when installing the PIU module in the network element;

installing a grounding clip within the chassis such that:

a first wing portion of the grounding clip is positioned between a first side of the faceplate and the chassis so as to be in contact with the first side of the faceplate and the chassis;

a second wing portion of the grounding clip is positioned between a second side of the faceplate and the chassis so as to be in contact with the second side of the faceplate and the chassis, the second side of the faceplate being opposite the first side of the faceplate; and

a center portion of the grounding clip between the first wing portion and the second wing portion extends over and is in contact with at least a portion of the PIU module enclosure; and

installing a fastener to electrically and mechanically couple the grounding clip to the PCB and to the chassis.

18. The method of claim 17 , wherein:

the grounding clip is fashioned as a single piece of a metal or a metal alloy exhibiting spring properties;

installing the grounding clip within the chassis comprises:

snapping the first wing portion onto the first side of the faceplate; and

snapping the second wing portion onto the second side of the faceplate;

the first wing portion is shaped to exert a force on the chassis to hold the grounding clip in position to make contact with the first side of the faceplate and the chassis subsequent to installing the grounding clip; and

the second wing portion is shaped to exert a force on the chassis to hold the grounding clip in position to make contact with the second side of the faceplate and the chassis subsequent to installing the grounding clip.

19. The method of claim 17 , wherein installing the fastener comprises inserting one or more screws through respective openings in the grounding clip and the PCB such that they make contact with the grounding clip, the PCB, and the chassis.

20. The method of claim 17 , further comprising fashioning the grounding clip from a single piece of a metal or a metal alloy exhibiting spring properties.

Assignments (4)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR FROM FUJITSU NETWORK COMMUNICATIONS TO FUJITSU NETWORK COMMUNICATIONS, INC. PREVIOUSLY RECORDED ON REEL 052121 FRAME 0481. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Mar 18, 2020
From: FUJITSU NETWORK COMMUNICATIONS, INC.
To: FUJITSU LIMITED
Reel/Frame 052188/0716 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR FROM FUJITSU NETWORK COMMUNICATIONS TO FUJITSU NETWORK COMMUNICATIONS, INC. PREVIOUSLY RECORDED ON REEL 052121 FRAME 0481. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Mar 18, 2020
From: FUJITSU NETWORK COMMUNICATIONS, INC.
To: FUJITSU LIMITED
Reel/Frame 052189/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 16, 2020
From: FUJITSU NETWORK COMMUNICATIONS
To: FUJITSU LIMITED
Reel/Frame 052121/0481 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2019
From: PARKER, CHARLIE WESLY; HIEBERT, STEWART HENRY; DANIELS, CASEY
To: FUJITSU NETWORK COMMUNICATIONS, INC.
Reel/Frame 049242/0801 →
Cited By (7)
US 12,250,024 US 12,313,886 US 12,405,433 US 12,455,422 US 12,461,322 US 12,490,401 US 12,520,448