IP Library Patent Application 16420674
Patent Application
App. No. 16/420,674

THREE-DIMENSIONAL MICROSTRUCTURES

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Quick Facts
Patent No.
US None
App. No.
16/420,674
Abstract

An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.

Claims (6)

1 - 8 . (canceled)

9 . A phase adjuster configurable to change transmission phase by changing wirebond configuration, comprising:

a dielectric substrate;

a plurality of microstrip segments disposed on a selected surface of the substrate, each microstrip segment having a respective transmission phase associated therewith; and

a plurality of wirebonds, each wirebond selectively electrically coupled between at least two of the plurality of microstrip segments to provide a connected group of microstrip segments to which the wirebonds are electrically coupled, the connected group having a transmission phase determined by the wirebonds and microstrip segments contained in the connected group, whereby the transmission phase is adjusted by selection of which of the wirebonds and which of the microstrip segments are contained in the connected group.

10 . The phase adjuster of claim 9 , wherein a selected pair of the microstrip segments has a plurality of the wirebonds electrically coupled therebetween.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 9, 2020
From: SHERRER, DAVID; ROLLIN, JEAN-MARC; VANHILLE, KENNETH; OLIVER, MARCUS; HUETTNER, STEVEN
To: CUBIC CORPORATION
Reel/Frame 051554/0052 →