Systems and methods for integrated shielding in a current sensor
Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.
1. A current sensor comprising:
a lead frame comprising a first portion forming a conductor and a second portion comprising a plurality of signal leads;
an insulation layer in contact with the conductor;
a shield layer comprising a conductive material including at least one of a metalized tape or a metalized Mylar® spaced from the conductor by the insulation layer;
a semiconductor substrate having a first surface disposed proximal to the shield layer and a second opposing surface disposed distal from the shield layer and supporting a magnetic field sensing element, wherein the shield layer extends beyond an edge of the first surface of the semiconductor substrate and is configured to shunt noise away from the semiconductor substrate;
a wire bond configured to couple the shield layer to at least one of the plurality of signal leads to shunt the noise to the at least one of the plurality of signals leads; and
a bond pad on a portion of the shield layer that extends beyond the edge of the first surface of the semiconductor substrate, wherein the wire bond is coupled between the bond pad and at least one of the plurality of signal leads.
2. The current sensor of claim 1 , wherein the magnetic field sensing element comprises at least one of a Hall-effect element or a magnetoresistance element.
3. The current sensor of claim 1 , wherein the current sensor is provided in the form of an integrated circuit.
4. The current sensor of claim 1 , wherein the insulation layer comprises at least one of a polymer dielectric material or a layer of adhesive.
5. The current sensor of claim 4 , wherein the insulation layer is applied to the conductor.
6. The current sensor of claim 1 , wherein the shield layer comprises a plurality of layers.
7. The current sensor of claim 1 , wherein the shield layer is applied to the first surface of the semiconductor substrate.
8. The current sensor of claim 5 , wherein the shield layer is applied to the insulation layer.
9. The current sensor of claim 1 , wherein the insulation layer extends an edge of the conductor by an overhang distance and wherein a shortest distance between the semiconductor substrate and the conductor includes the overhang distance.
10. The current sensor of claim 1 , wherein a length and a width of the insulation layer is the same as a length and a width of the shield layer.
11. The current sensor of claim 1 , wherein the wire bond is directly coupled between the bond pad and the at least one signal lead.
12. The current sensor of claim 1 , further comprising a second bond pad on the at least one signal lead, wherein the wire bond is coupled between the bond pad on the shield layer and the second bond pad.
13. A current sensor comprising:
a lead frame comprising a first portion forming a conductor and a second portion comprising a plurality of signal leads;
an insulation layer in contact with the conductor;
a shield layer comprising a conductive material including at least one of a metalized tape or a metalized Mylar® spaced from the conductor by the insulation layer;
a semiconductor substrate having a first surface disposed proximal to the shield layer and a second opposing surface disposed distal from the shield layer and supporting a magnetic field sensing element and
wherein shield layer is configured to shunt noise away from the semiconductor substrate;
a wire bond coupled between a first bond pad disposed on the shield layer and a second bond pad disposed on at least one of the plurality of signal leads to shunt the noise to the at least one of the plurality of signals leads.
14. The current sensor of claim 13 , wherein the magnetic field sensing element comprises at least one of a Hall-effect element or a magnetoresistance element.
15. The current sensor of claim 13 , wherein the current sensor is provided in the form of an integrated circuit.
16. The current sensor of claim 13 , wherein the insulation layer comprises at least one of a polymer dielectric material or a layer of adhesive.
17. The current sensor of claim 13 , wherein the insulation layer is applied to the conductor.
18. The current sensor of claim 13 , wherein the shield layer comprises a plurality of layers.
19. The current sensor of claim 13 , wherein the shield layer extends beyond an edge of the first surface of the semiconductor substrate.
20. The current sensor of claim 19 , wherein the first bond pad is disposed on a portion of the shield layer that extends beyond the edge of the first surface of the semiconductor substrate.
21. The current sensor of claim 13 , wherein the shield layer is applied to the first surface of the semiconductor substrate.
22. The current sensor of claim 17 , wherein the shield layer is applied to the insulation layer.
23. The current sensor of claim 13 , wherein the insulation layer extends beyond an edge of the conductor by an overhang distance and wherein a shortest distance between the semiconductor substrate and the conductor includes the overhang distance.
24. The current sensor of claim 13 , wherein a length and a width of the insulation layer is the same as a length and a width of the shield layer.