Imaging device
View Patent ↗An imaging device includes LED elements disposed on a first surface of a board to be electrically connected to first and second wiring patterns, and emitting illumination light in an imaging direction of a camera. A first heat dissipation member and second heat dissipation members are mounted onto opposite sides of the board. The first heat dissipation member is disposed opposite to the first surface. Each of the second heat dissipation members is disposed opposite to a second surface in a region including an area opposite to the LED elements via the board.
1. An imaging device, comprising:
a camera;
a board having a first surface, a second surface, and a wiring pattern disposed on at least one of the first surface and the second surface;
a light-emitting element disposed on the first surface of the board to be electrically connected to the wiring pattern, and emitting illumination light in an imaging direction of the camera; and
a first heat dissipation member and a second heat dissipation member that are mounted onto opposite sides of the board and that are electrically conductive and fastened to the board to cover at least the wiring pattern, and capable of dissipating heat generated at least by the board,
wherein the first heat dissipation member is disposed opposite to the first surface, and
the second heat dissipation member is disposed opposite to the second surface in a region including an area opposite to the light-emitting element via the board.
2. The imaging device according to claim 1 ,
wherein the first heat dissipation member and the second heat dissipation member are thermally coupled via the board.
3. The imaging device according to claim 2 ,
wherein the board includes a through hole penetrating the board in a direction of thickness,
the wiring pattern includes:
a first wiring pattern disposed on the first surface; and
a second wiring pattern disposed on the second surface and electrically connected to the first wiring pattern via the through hole, and
the first wiring pattern and the second wiring pattern are thermally coupled via the through hole.
4. The imaging device according to claim 3 , further comprising:
a heat dissipation sheet interposed between the second wiring pattern and the second heat dissipation member, for transferring heat generated by the board and the light-emitting element to the second heat dissipation member.
5. The imaging device according to claim 1 ,
wherein the first heat dissipation member includes:
a base having (i) a heat transfer surface opposite to the first surface of the board and (ii) a heat dissipation surface on a reverse side of the heat transfer surface and capable of dissipating heat transferred from the first surface to the heat transfer surface; and
a plurality of fins provided spaced from each other and integrally protruding from the heat dissipation surface, the plurality of fins being cooled by air.
6. The imaging device according to claim 5 ,
wherein each of the plurality of fins is a substantially square pillar and includes a chamfer at at least one of:
each corner where one of a top surface and a bottom surface of each of the plurality of fins meets an adjacent side surface of the fin; and
each corner where two adjacent side surfaces of each of the plurality of fins meet.
7. The imaging device according to claim 5 ,
wherein the plurality of fins extend in parallel with each other in a direction of gravity.
8. The imaging device according to claim 7 ,
wherein the first heat dissipation member includes a fin opening disposed in an upper region of the base in a direction of gravity and penetrating the base in a direction of thickness.
9. The imaging device according to claim 8 ,
wherein the fin opening is disposed opposite to upper ends of the plurality of fins in the direction of gravity.
10. The imaging device according to claim 8 ,
wherein the fin opening is disposed above upper ends of the plurality of fins in the direction of gravity and in alignment with a space between the plurality of fins.
11. The imaging device according to claim 10 , further comprising:
a front cover disposed opposite to the heat dissipation surface of the first heat dissipation member,
wherein the front cover includes an upper opening disposed above the upper ends of the plurality of fins and in alignment with the space between the plurality of fins.
12. The imaging device according to claim 11 ,
wherein the front cover includes a lower opening disposed below and opposite to lower ends of the plurality of fins in the direction of gravity.
13. The imaging device according to claim 1 ,
wherein the board further includes a connector electrically connected to the wiring pattern and connected to an external wiring member to electrically connect the external wiring member to the wiring pattern, and
at least one of the first heat dissipation member and the second heat dissipation member includes a case to cover the connector except for a part connected to the external wiring member.
14. An imaging device, comprising:
a camera including a metal shield covering side surfaces of the camera except for a side surface that crosses an optical axis of the camera;
a board having a first surface, a second surface, and a wiring pattern disposed on at least one of the first surface and the second surface;
a light-emitting element disposed on the first surface of the board to be electrically connected to the wiring pattern, and emitting illumination light in an imaging direction of the camera; and
a first heat dissipation member and a second heat dissipation member that are thermally insulated from the metal shield and that are mounted onto opposite sides of the board, and capable of dissipating heat generated at least by the board,
wherein the first heat dissipation member is disposed opposite to the first surface, and
the second heat dissipation member is disposed opposite to the second surface in a region including an area opposite to the light-emitting element via the board.
15. The imaging device according to claim 14 ,
wherein the first heat dissipation member and the second heat dissipation member are thermally insulated from the metal shield by one of an air layer and a resin member that is interposed between the first and second heat dissipation members and the metal shield.
16. The imaging device according to claim 14 ,
wherein the resin member is disposed between, and jointly fastened by, at least one of the first heat dissipation member and the second heat dissipation member and the metal shield.
17. The imaging device according to claim 14 ,
wherein the first heat dissipation member and the second heat dissipation member are thermally coupled via the board.
18. The imaging device according to claim 17 ,
wherein the board includes a through hole penetrating the board in a direction of thickness,
the wiring pattern includes:
a first wiring pattern disposed on the first surface; and
a second wiring pattern disposed on the second surface and electrically connected to the first wiring pattern via the through hole, and
the first wiring pattern and the second wiring pattern are thermally coupled via the through hole.
19. The imaging device according to claim 14 ,
wherein the first heat dissipation member includes:
a base having (i) a heat transfer surface opposite to the first surface of the board and (ii) a heat dissipation surface on a reverse side of the heat transfer surface and capable of dissipating heat transferred from the first surface to the heat transfer surface; and
a plurality of fins provided spaced from each other and integrally protruding from the heat dissipation surface, the plurality of fins being cooled by air.
20. The imaging device according to claim 19 ,
wherein the plurality of fins extend in parallel with each other in a direction of gravity.