Pane having an electrical connection element
A pane, includes a substrate, an electrically conductive structure on a region of the substrate, a layer of a solder material on a region of the electrically conductive structure, and at least two soldering points of the at least one electrical connection element on the solder material, wherein the at least two soldering points form at least one contact surface between the at least one electrical connection element and the electrically conductive structure, and a shape of the at least one contact surface has at least one segment of an oval, an ellipse, or a circle with a central angle α of at least 90°.
1. A pane, comprising:
a substrate, the substrate having a first coefficient of thermal expansion from 8×10 −6 /° C. to 9×10 −6 /° C.,
at least one electrical connection element,
an electrically conductive structure on a region of the substrate,
a layer of a solder material on a region of the electrically conductive structure,
wherein each of the at least one electrical connection element
has a second coefficient of thermal expansion from 10×10 −6 /° C. to 13×10 −6 /° C., wherein a difference between the first coefficient of thermal expansion of the substrate and the second coefficient of thermal expansion of the connection element is less than 5×10 −6 /° C.,
contains at least 50 wt. % to 89.5 wt. % iron, 16 wt. % to 20 wt. % chromium, and one or more elements selected from the group of carbon, nickel, manganese, molybdenum, and titanium,
has at least two soldering points on the solder material, which form two contact surfaces, separated from each other, between the at least one electrical connection element and the electrically conductive structure, wherein the two contact surfaces are connected to each other via a surface of a bridge facing the substrate, and
wherein a shape of each of the two contact surfaces has at least one segment of an oval, an ellipse, or a circle with a central angle α of at least 90°.
2. The pane according to claim 1 , wherein the two contact surfaces are formed in a shape of a rectangle with two semicircles arranged on opposite sides.
3. The pane according to claim 1 , wherein each of the two contact surfaces is formed in a shape of a circle or a circular segment with a central angle α of at least 180°.
4. The pane according to claim 1 , wherein the substrate contains glass, polymers, or mixtures of glass and polymers.
5. The pane according to claim 1 , wherein spacers are arranged on the two contact surfaces.
6. The pane according to claim 1 , wherein each of the two soldering points is arranged on a contact bump.
7. The pane according to claim 1 , wherein the solder material contains tin and i) bismuth, ii) indium, iii) zinc, iv) copper, v) silver, or compositions of i)-v).
8. The pane according to claim 7 , wherein a proportion of tin in the solder material is 3 wt. % to 99.5 wt. % and a proportion of i) bismuth, ii) indium, iii) zinc, iv) copper, v) silver, or compositions of i)-v) is 0.5 wt. % to 97 wt. %.
9. The pane according to claim 1 , wherein the at least one electrical connection element is coated with nickel, tin, copper, or silver, or a mixture thereof.
10. A method for production of a pane with at least one electrical connection element according to claim 1 , comprising:
a) applying a solder material on at least one contact surface of the at least one electrical connection element as a platelet with a fixed layer thickness, volume, and shape,
b) applying an electrically conductive structure to a region of a substrate, the substrate having a first coefficient of thermal expansion from 8×10 −6 /° C. to 9×10 −6 /° C.,
c) arranging the at least one electrical connection element with the solder material on the electrically conductive structure, wherein the at least one electrical connection element has a second coefficient of thermal expansion from 10×10 −6 /° C. to 13×10 −6 /° C., wherein the at least one electrical connection element contains at least 50 wt.-% to 89.5 wt.-% iron, 16 wt.-% to 20 wt.-% chromium, and one or more elements selected from the group of carbon, nickel, manganese, molybdenum, and titanium, and wherein the difference between the first coefficient of thermal expansion of the substrate and the second coefficient of thermal expansion of the connection element is less than 5×10 −6 /° C.,
d) introducing energy to at least two soldering points, and
e) soldering the at least one electrical connection element to the electrically conductive structure, thereby producing the pane, the pane including the substrate,
the electrically conductive structure on the region of the substrate,
a layer of a solder material on a region of the electrically conductive structure, and
at least two soldering points of the at least one electrical connection element on the solder material, wherein
the at least two soldering points form two contact surfaces
between the at least one electrical connection element and the electrically conductive structure, each of the at least two soldering points being arranged on a contact bump, and
a shape of each of the two contact surfaces has at least one segment of an
oval, an ellipse, or a circle with a central angle α of at least 90°.
11. A method, comprising:
using the pane with at least one electrical connection element according to claim 1 , for vehicles with electrically conductive structures, preferably with heating conductors and/or antenna conductors.
12. The pane according to claim 3 , wherein the central angle α is at least 220°.
13. The pane according to claim 4 , wherein the glass is flat glass, float glass, quartz glass, borosilicate glass or soda lime glass.
14. The pane according to claim 4 , wherein the polymers are polyethylene, polypropylene, polycarbonate, or polymethyl methacrylate.
15. The pane according to claim 9 , wherein the at least one electrical connection element is coated with 0.1 μm to 0.3 μm nickel or 3 μm to 20 μm silver, or both 0.1 μm to 0.3 μm nickel and 3 μm to 20 μm silver.