IP Library Granted Patent US 11,083,093
Granted Patent B2
US 11,083,093 · App. 16/429,611 · Granted Aug 3, 2021

Outdoor electronics enclosure with modular structure

Inventors: Charles John Mann (Omaha, NE); Jiayong Wang (Shanghai, CN); Qiwei Shi (Shanghai, CN); Walter Mark Hendrix (Richardson, TX); Tri H. Nguyen (Richardson, TX)
Assignee: CommScope Technologies LLC
H05K5/0008H05K5/065H05K7/183H05K7/1488
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Quick Facts
Patent No.
US 11,083,093
App. No.
16/429,611
Filed
Jun 3, 2019
Granted
Aug 3, 2021
Kind
B2
Art Unit
2841
USPC
361/724
Abstract

A modular electronics enclosure includes a rear frame, a first L-shaped piece and a second L-shaped piece joined to form a box-shaped shell having a floor, a ceiling, a rear wall and first and second opposed side walls that define an internal cavity. The first L-shaped piece includes a wall panel and a top panel that form the ceiling and the first side wall of the shell. The second L-shaped piece includes a wall panel and a bottom panel that form the floor and the second side wall of the shell. The rear frame forms the rear wall of the shell.

Claims (35)

1. A modular electronics enclosure, comprising:

a rear frame, a first L-shaped piece and a second L-shaped piece joined to form a box-shaped shell having a floor, a ceiling, a rear wall, and first and second opposed side walls that define an internal cavity, a door, and a cooling unit;

wherein the first L-shaped piece includes a first wall panel and a top panel that form the ceiling and the first side wall of the shell, wherein a first lip extends perpendicular from a front edge of the first wall panel and top panel, and wherein a second lip extends Perpendicular from a rear edge of the first wall panel and top panel;

wherein the second L-shaped piece includes a second wall panel and a bottom panel that form the floor and the second side wall of the shell, wherein a third lip extends perpendicular from a front edge of the second wall panel and bottom panel, and wherein a fourth lip extends perpendicular from a rear edge of the second wall panel and bottom panel;

wherein the rear frame forms the rear wall of the shell, wherein the rear frame comprises a rear panel with top, bottom and side panels extending forwardly from respective edges of the rear panel, and wherein first, second, third and fourth flanges project inwardly from respective edges of the rear frame top, bottom and side panels;

wherein the second lip of the first L-shaped piece abuts and is joined to the first and third flanges of the rear frame, and wherein the fourth lip of the second L-shaped piece abuts and is joined to the second and fourth flanges of the rear frame;

wherein the door hingedly attaches to one of the first or second wall panels of the first or second L-shaped pieces; and

wherein the cooling unit is mounted to the door for cooling the internal cavity.

2. The modular electronics enclosure defined in claim 1 , wherein the rear frame includes an opening covered by an I/O panel.

3. The modular electronics enclosure defined in claim 1 , wherein at least one of the side panels of the rear frame includes an aperture for receiving a cable routed into the internal cavity.

4. The modular electronics enclosure defined in claim 1 , further comprising a battery tray mounted in the internal cavity and a battery string residing in the battery tray.

5. The modular electronics enclosure defined in claim 1 , further comprising a divider that divides the internal cavity into multiple compartments.

6. The modular electronics enclosure defined in claim 1 , further comprising electronics equipment mounted in the internal cavity.

7. The modular electronics enclosure defined in claim 6 , further comprising a battery string residing in the internal cavity.

8. The modular electronics enclosure defined in claim 1 , wherein the internal cavity is nominally 21 RU in height.

9. An assembly, comprising first and second modular electronics enclosures, each of the first and second modular electronics enclosures comprising:

a rear frame, a first L-shaped piece and a second L-shaped piece joined to form a box-shaped shell having a floor, a ceiling, a rear wall, first and second opposed side walls that define an internal cavity, a door, and a cooling unit;

wherein the first L-shaped piece includes a first wall panel and a top panel that form the ceiling and the first side wall of the shell, wherein a first lip extends perpendicular from a front edge of the first wall panel and top panel, and wherein a second lip extends perpendicular from a rear edge of the first wall panel and top panel;

wherein the second L-shaped piece includes a second wall panel and a bottom panel that form the floor and the second side wall of the shell, wherein a third lip extends Perpendicular from a front edge of the second wall panel and bottom panel, and wherein a fourth lip extends perpendicular from a rear edge of the second wall panel and bottom panel;

wherein the rear frame forms the rear wall of the shell, wherein the rear frame comprises a rear panel with top, bottom and side panels extending forwardly from respective edges of the rear panel, and wherein first, second, third and fourth flanges project inwardly from respective edges of the rear frame top, bottom and side panels;

wherein the second lip of the first L-shaped piece abuts and is joined to the first and third flanges of the rear frame, and wherein the fourth lip of the second L-shaped piece abuts and is joined to the second and fourth flanges of the rear frame;

wherein the door hingedly attaches to one of the first or second wall panels of the first or second L-shaped pieces;

wherein the cooling unit is mounted to the door for cooling the internal cavity; and

wherein the second modular electronics enclosure is vertically stacked on and above the first electronics enclosure.

10. The assembly defined in claim 9 , wherein the first modular electronics enclosure houses at least one battery string.

11. The assembly defined in claim 10 , wherein the second modular electronics enclosure houses electronic equipment.

12. A modular electronics enclosure, comprising:

a rear frame, a first L-shaped piece and a second L-shaped piece joined to form a box-shaped shell having a floor, a ceiling, a rear wall and first and second opposed side walls that define an internal cavity;

wherein the first L-shaped piece includes a first wall panel and a top panel that form the ceiling and the first side wall of the shell, wherein a first lip extends perpendicular from a front edge of the first wall panel and top panel, and wherein a second lip extends perpendicular from a rear edge of the first wall panel and top panel;

wherein the second L-shaped piece includes a second wall panel and a bottom panel that form the floor and the second side wall of the shell, wherein a third lip extends perpendicular from a front edge of the second wall panel and bottom panel, and wherein a fourth lip extends perpendicular from a rear edge of the second wall panel and bottom panel; and

wherein the rear frame forms the rear wall of the shell, wherein the rear frame comprises a rear panel with top, bottom and side panels extending forwardly from respective edges of the rear panel, and wherein first, second, third and fourth flanges project inwardly from respective edges of the rear frame top, bottom and side panels; and

wherein the second lip of the first L-shaped piece abuts and is joined to the first and third flanges of the rear frame with fasteners, and wherein the fourth lip of the second L-shaped piece abuts and is joined to the second and fourth flanges of the rear frame with fasteners, and wherein the fasteners are located in the internal cavity of the shell such that the shell has no externally exposed fasteners.

13. The modular electronics enclosure defined in claim 12 , further comprising a door hingedly attached to one of the wall panels of the first or second pieces.

14. The modular electronics enclosure defined in claim 13 , further comprising a cooling unit mounted to the door for cooling the internal cavity.

15. The modular electronics enclosure defined in claim 12 , wherein the internal cavity is nominally 21 RU in height.

Assignments (14)
RELEASE OF SECURITY INTEREST AT REEL/FRAME 058843/0712 Recorded Jan 12, 2026
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: ARRIS ENTERPRISES LLC; COMMSCOPE NORTH CAROLINA, LLC (F/K/A COMMSCOPE, INC. OF NORTH CAROLINA); COMMSCOPE TECHNOLOGIES LLC
Reel/Frame 074591/0389 →
PARTIAL TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 069889/FRAME 0114 Recorded Feb 7, 2025
From: APOLLO ADMINISTRATIVE AGENCY LLC
To: OUTDOOR WIRELESS NETWORKS LLC
Reel/Frame 070154/0341 →
RELEASE (REEL 068770 / FRAME 0460) Recorded Feb 7, 2025
From: JPMORGAN CHASE BANK, N.A.
To: OUTDOOR WIRELESS NETWORKS LLC
Reel/Frame 070149/0432 →
PARTIAL TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 7, 2025
From: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION
To: OUTDOOR WIRELESS NETWORKS LLC
Reel/Frame 070154/0183 →
RELEASE OF SECURITY INTEREST AT REEL/FRAME 068770/0632 Recorded Dec 19, 2024
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: OUTDOOR WIRELESS NETWORKS LLC
Reel/Frame 069743/0264 →
RELEASE OF SECURITY INTEREST AT REEL/FRAME 058875/0449 Recorded Dec 19, 2024
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: ARRIS ENTERPRISES LLC (F/K/A ARRIS ENTERPRISES, INC.); COMMSCOPE, INC. OF NORTH CAROLINA; COMMSCOPE TECHNOLOGIES LLC
Reel/Frame 069743/0057 →
SECURITY INTEREST Recorded Dec 17, 2024
From: ARRIS ENTERPRISES LLC; COMMSCOPE TECHNOLOGIES LLC; COMMSCOPE INC., OF NORTH CAROLINA; OUTDOOR WIRELESS NETWORKS LLC; RUCKUS IP HOLDINGS LLC
To: APOLLO ADMINISTRATIVE AGENCY LLC
Reel/Frame 069889/0114 →
PATENT SECURITY AGREEMENT (TERM) Recorded Aug 26, 2024
From: OUTDOOR WIRELESS NETWORKS LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 068770/0632 →
PATENT SECURITY AGREEMENT (ABL) Recorded Aug 26, 2024
From: OUTDOOR WIRELESS NETWORKS LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 068770/0460 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 3, 2024
From: COMMSCOPE TECHNOLOGIES LLC
To: OUTDOOR WIRELESS NETWORKS LLC
Reel/Frame 068107/0089 →
SECURITY INTEREST Recorded Nov 19, 2021
From: ARRIS SOLUTIONS, INC.; ARRIS ENTERPRISES LLC; COMMSCOPE TECHNOLOGIES LLC; COMMSCOPE, INC. OF NORTH CAROLINA; RUCKUS WIRELESS, INC.
To: WILMINGTON TRUST
Reel/Frame 060752/0001 →
TERM LOAN SECURITY AGREEMENT Recorded Nov 15, 2021
From: ARRIS ENTERPRISES LLC; COMMSCOPE TECHNOLOGIES LLC; COMMSCOPE, INC. OF NORTH CAROLINA
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 058875/0449 →
ABL SECURITY AGREEMENT Recorded Nov 15, 2021
From: ARRIS ENTERPRISES LLC; COMMSCOPE TECHNOLOGIES LLC; COMMSCOPE, INC. OF NORTH CAROLINA
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 058843/0712 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 5, 2019
From: MANN, CHARLES JOHN; WANG, JIAYONG; SHI, QIWEI; HENDRIX, WALTER MARK; NGUYEN, TRI H.
To: COMMSCOPE TECHNOLOGIES LLC
Reel/Frame 050276/0992 →
Continuity (2)
Provisional Application 62718459 · Aug 14, 2018
Related Publication 20200060027A1 · Feb 20, 2020
Cited By (1)
US 12,324,121